公开(公告)号：US06709563B2

公开(公告)日：2004-03-23

申请号：US09893624

申请日：2001-06-29

申请人： Mizuki Nagai ,  Shuichi Okuyama ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

发明人： Mizuki Nagai ,  Shuichi Okuyama ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

IPC分类号： C25D502

CPC分类号： C25D3/38 ,  C25D5/10 ,  C25D7/123 ,  C25D17/001

摘要： There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper completely into the depth of the fine recesses. The plating liquid contains divalent copper ions and a completing agent, and an optional pH adjusting agent.

摘要翻译： 提供了不含碱金属和氰化物的镀铜液，当用于具有外籽晶层和高纵横比的微细凹槽的基片时，可以加强种子层的薄部分，并且可以 将铜完全嵌入精细凹槽的深度。电镀液含有二价铜离子和完成剂，以及任选的pH调节剂。

公开(公告)号：US07033463B1

公开(公告)日：2006-04-25

申请号：US09762582

申请日：1999-08-11

申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Satoshi Sendai ,  Tetsuma Ikegami ,  Koji Mishima ,  Shuichi Okuyama ,  Mizuki Nagai ,  Ryoichi Kimizuka ,  Megumi Maruyama

发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Satoshi Sendai ,  Tetsuma Ikegami ,  Koji Mishima ,  Shuichi Okuyama ,  Mizuki Nagai ,  Ryoichi Kimizuka ,  Megumi Maruyama

IPC分类号： C25D17/00

CPC分类号： H01L21/76843 ,  C23C18/1632 ,  C23C18/1653 ,  C23C18/1682 ,  C23C18/38 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877 ,  H01L2221/1089 ,  H05K3/107 ,  H05K3/241 ,  H05K3/423

摘要： A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.

摘要翻译： 一种方法和装置，通过有效地填充形成在半导体衬底中的精细凹槽，镀覆金属而没有空隙或污染，从而形成衬底以形成布线。 用电镀金属填充形成在半导体衬底中的布线凹槽的衬底的电镀包括在衬底上进行形成初始层的无电镀处理，并且进行用电镀金属填充布线凹槽的电解电镀工艺，同时 初始层用作供料层。

公开(公告)号：US20060144714A1

公开(公告)日：2006-07-06

申请号：US11360685

申请日：2006-02-24

申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inous ,  Satoshi Sendai ,  Tetsuma Ikegami ,  Koji Mishima ,  Shuichi Okuyama ,  Mizuki Nagai ,  Ryoichi Kimizuka ,  Megumi Maruyama

发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inous ,  Satoshi Sendai ,  Tetsuma Ikegami ,  Koji Mishima ,  Shuichi Okuyama ,  Mizuki Nagai ,  Ryoichi Kimizuka ,  Megumi Maruyama

IPC分类号： C25D3/38

CPC分类号： H01L21/76843 ,  C23C18/1632 ,  C23C18/1653 ,  C23C18/1682 ,  C23C18/38 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877 ,  H01L2221/1089 ,  H05K3/107 ,  H05K3/241 ,  H05K3/423

摘要： A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.

公开(公告)号：US20070264374A1

公开(公告)日：2007-11-15

申请号：US11822912

申请日：2007-07-11

申请人： Tsutomu Harada ,  Takashi Tajiri ,  Shuichi Okuyama

发明人： Tsutomu Harada ,  Takashi Tajiri ,  Shuichi Okuyama

IPC分类号： B22F3/00

CPC分类号： H02K15/03 ,  B22F3/02 ,  B22F3/03 ,  B22F2999/00 ,  B30B11/008 ,  H01F41/0266 ,  H01F41/0273 ,  B22F2202/05

摘要： A press machine 10 includes a die 12 with a through hole 12a that defines a cavity, a first press surface 14a and a second press surface 16a for pressing a magnetic powder 18 loaded in the cavity, and magnetic field generating means for applying an aligning magnetic field to the magnetic powder 18 in the cavity. At least one of the first and second press surfaces 14a and 16a has a region made of a material having a Vickers hardness that is higher than 200 but equal to or lower than 450. In pressing the powder under the aligning magnetic field, the press machine 10 minimizes the disturbance in the orientation of the powder.

摘要翻译： 压制机10包括具有限定空腔的通孔12a的模具12，用于按压装在空腔中的磁性粉末18的第一压制表面14a和第二挤压表面16a，以及用于施加空气的磁场产生装置 与空腔中的磁粉18对齐的磁场。 第一和第二按压面14a和16a中的至少一个具有由维氏硬度高于200但等于或小于450的材料制成的区域。在对准磁场下挤压粉末时， 压榨机10使粉末的取向的干扰最小化。

公开(公告)号：US07604468B2

公开(公告)日：2009-10-20

申请号：US11822912

申请日：2007-07-11

申请人： Tsutomu Harada ,  Takashi Tajiri ,  Shuichi Okuyama

发明人： Tsutomu Harada ,  Takashi Tajiri ,  Shuichi Okuyama

IPC分类号： B29C43/02

CPC分类号： H02K15/03 ,  B22F3/02 ,  B22F3/03 ,  B22F2999/00 ,  B30B11/008 ,  H01F41/0266 ,  H01F41/0273 ,  B22F2202/05

摘要： A press machine 10 includes a die 12 with a through hole 12a that defines a cavity, a first press surface 14a and a second press surface 16a for pressing a magnetic powder 18 loaded in the cavity, and magnetic field generating means for applying an aligning magnetic field to the magnetic powder 18 in the cavity. At least one of the first and second press surfaces 14a and 16a has a region made of a material having a Vickers hardness that is higher than 200 but equal to or lower than 450. In pressing the powder under the aligning magnetic field, the press machine 10 minimizes the disturbance in the orientation of the powder.

摘要翻译： 压制机10包括具有限定空腔的通孔12a的模具12，用于按压装在空腔中的磁性粉末18的第一压制表面14a和第二挤压表面16a，以及用于施加定向磁体的磁场产生装置 在空腔中的磁粉18上。 第一和第二压制表面14a和16a中的至少一个具有由维氏硬度高于200但等于或低于450的材料制成的区域。在对准磁场下挤压粉末时，冲压机 10使粉末取向的干扰最小化。

公开(公告)号：US07314530B2

公开(公告)日：2008-01-01

申请号：US10490421

申请日：2002-10-01

申请人： Tsutomu Harada ,  Takashi Tajiri ,  Shuichi Okuyama

发明人： Tsutomu Harada ,  Takashi Tajiri ,  Shuichi Okuyama

IPC分类号： H01F1/04

CPC分类号： H02K15/03 ,  B22F3/02 ,  B22F3/03 ,  B22F2999/00 ,  B30B11/008 ,  H01F41/0266 ,  H01F41/0273 ,  B22F2202/05

摘要： A press machine 10 includes a die 12 with a through hole 12a that defines a cavity, a first press surface 14a and a second press surface 16a for pressing a magnetic powder 18 loaded in the cavity, and magnetic field generating means for applying an aligning magnetic field to the magnetic powder 18 in the cavity. At least one of the first and second press surfaces 14a and 16a has a region made of a material having a Vickers hardness that is higher than 200 but equal to or lower than 450. In pressing the powder under the aligning magnetic field, the press machine 10 minimizes the disturbance in the orientation of the powder.

摘要翻译： 压制机10包括具有限定空腔的通孔12a的模具12，用于按压装在空腔中的磁性粉末18的第一压制表面14a和第二挤压表面16a，以及用于施加空气的磁场产生装置 与空腔中的磁粉18对齐的磁场。 第一和第二按压面14a和16a中的至少一个具有由维氏硬度高于200但等于或小于450的材料制成的区域。在对准磁场下挤压粉末时， 压榨机10使粉末的取向的干扰最小化。

公开(公告)号：US06599468B2

公开(公告)日：2003-07-29

申请号：US09818930

申请日：2001-03-28

申请人： Shuichi Okuyama ,  Tsutomu Harada ,  Takashi Tajiri

发明人： Shuichi Okuyama ,  Tsutomu Harada ,  Takashi Tajiri

IPC分类号： B22F302

CPC分类号： H01F41/0273 ,  B22F3/03 ,  B22F2999/00 ,  B30B15/065 ,  H01F1/0576 ,  B22F3/02 ,  B22F2202/05

摘要： The present invention provides a powder compacting apparatus including: a die having a through hole forming a cavity; a first punch and a second punch for pressing a rare-earth alloy magnetic powder filled in the cavity; and a magnetic field generator for applying an orientation magnetic field parallel to a pressing direction through the rare-earth alloy magnetic powder in the cavity, wherein at least one of the first and second punches and has a curved pressing surface, and the pressing surface is given a shape such as to suppress the movement of particles of the rare-earth alloy magnetic powder along the pressing surface during the pressing step.

公开(公告)号：US06352598B1

公开(公告)日：2002-03-05

申请号：US09567987

申请日：2000-05-10

申请人： Tsuyoshi Hisamura ,  Tsutomu Harada ,  Shuichi Okuyama

发明人： Tsuyoshi Hisamura ,  Tsutomu Harada ,  Shuichi Okuyama

IPC分类号： H01F4102

CPC分类号： B30B11/02 ,  B22F3/03 ,  B22F2999/00 ,  H01F41/0273 ,  B22F2202/05

摘要： A rare-earth alloy powder pressing apparatus comprises a die. The die includes a die main body. The die main body includes a through hole for formation of a cavity, and an auxiliary yoke. A rare-earth alloy powder is fed into the cavity. A correcting yoke is disposed near the die, on a side from which a compact is taken out, and an orienting magnetic field is applied. At this time, the correcting yoke is disposed on an upper side of the die if the compact is to be taken out from the upper side of the die whereas the correcting yoke is disposed on a lower side of the die if the compact is to be taken out from the lower side of the die, an inward side surface of the correcting yoke and an inward side surface of the auxiliary yoke are made flush with a plane vertical to a direction in which the orienting magnetic field is applied, and the correcting yoke is urged toward the die. Then, the rare-earth alloy powder is pressed by an upper punch and a lower punch to form a compact. The correcting yoke and the auxiliary yoke may be made integrally with each other.

摘要翻译： 稀土合金粉末压制装置包括模具。 模具包括模具主体。 模具主体包括用于形成空腔的通孔和辅助轭。 将稀土合金粉末进料到空腔中。 校正磁轭设置在模具附近，取出压块的一侧，并且施加定向磁场。 此时，如果从模具的上侧取出压块，则校正磁轭设置在模具的上侧，而如果压块为压模，则校正磁轭设置在模具的下侧 从模具的下侧取出，校正磁轭的内侧面和辅助磁轭的内侧面与垂直于定向磁场的方向的平面齐平，校正磁轭 被迫向死亡。 然后，通过上冲头和下冲头压制稀土合金粉末以形成紧凑。 校正轭和辅助轭可以彼此一体地制成。