High voltage metal oxide device with enhanced well region
    4.
    发明授权
    High voltage metal oxide device with enhanced well region 有权
    具有增强井区的高压金属氧化物装置

    公开(公告)号:US06448625B1

    公开(公告)日:2002-09-10

    申请号:US09808966

    申请日:2001-03-16

    IPC分类号: H01L2358

    摘要: A high voltage MOS device (100) is disclosed. The MOS device comprises an n-well region (113) with two areas. The first area (110) has a high dopant concentration and the second area (112) has a low dopant concentration. Inside the well region a region of a secondary conductivity type (108) is formed. The second area (110) is typically underlying a gate (105). The lower doping concentration in that area helps to increase the breakdown voltage when the device is blocking voltage and helps to decrease on-resistance when the device is in the “on” state.

    摘要翻译: 公开了一种高压MOS器件(100)。 MOS器件包括具有两个区域的n阱区域(113)。 第一区域(110)具有高掺杂剂浓度,第二区域(112)具有低掺杂剂浓度。 在阱区内部形成二次导电型(108)的区域。 第二区域(110)通常位于门(105)下方。 当器件处于“导通”状态时,该器件阻塞电压时,该区域中较低的掺杂浓度有助于提高击穿电压,有助于降低导通电阻。

    Method for manufacturing a high voltage MOSFET device with reduced on-resistance
    5.
    发明授权
    Method for manufacturing a high voltage MOSFET device with reduced on-resistance 有权
    制造具有降低的导通电阻的高压MOSFET器件的方法

    公开(公告)号:US06492679B1

    公开(公告)日:2002-12-10

    申请号:US09920655

    申请日:2001-08-03

    IPC分类号: H01L2976

    摘要: A high voltage MOSFET device (100) has a well region (113) with two areas. The first area (110) has a high dopant concentration and the second area (112) has a low dopant concentration. Inside the well region a region of a secondary conductivity type (108) is formed. The second area (110) is typically underlying a gate region (105). The lower doping concentration in that area helps to increase the breakdown voltage when the semiconductor device is blocking voltage and helps to decrease the on-resistance when the semiconductor device is in the “on” state. The MOSFET device further has a p-top layer (108) which is disposed on the top surface of the well region and then driven into the well region by annealing the MOSFET device at a high temperature in an inert atmosphere.

    摘要翻译: 高电压MOSFET器件(100)具有带有两个区域的阱区(113)。 第一区域(110)具有高掺杂剂浓度,第二区域(112)具有低掺杂剂浓度。 在阱区内形成二次导电型(108)的区域。 第二区域(110)通常位于栅极区域(105)下方。 当半导体器件处于“导通”状态时,该半导体器件阻挡电压并有助于降低导通电阻,该区域中较低的掺杂浓度有助于提高击穿电压。 MOSFET器件还具有p顶层(108),其设置在阱区的顶表面上,然后通过在惰性气氛中的高温退火MOSFET器件而被驱动进入阱区。