SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF 有权
    固态成像装置,固态成像装置及其制造方法

    公开(公告)号:US20060284052A1

    公开(公告)日:2006-12-21

    申请号:US11423776

    申请日:2006-06-13

    IPC分类号: H01L27/00

    CPC分类号: H01L27/14627 H01L27/14685

    摘要: The present invention provides a solid-state imaging apparatus and the like which is able to support an optical system whose incident angle is wide. Each pixel is 2.25 μm square in size, and includes a distributed index lens 1, a color filter (for example, for green) 2, an Al interconnections 3, a signal transmitting unit 4, a planarized layer 5, a light-receiving device (Si photodiodes) 6, and an Si substrate 7. The two-stage concentric circle structure of the distributed index lens is formed by SiO2 (n=2) with the film thickness 1.2 μm (“grey color”), the film thickness 0.8 μm (“dots pattern”) and the film thickness of 0 μm (“without pattern: white color”), and the medium surrounding the distributed index lens 1 is air (n=1).

    摘要翻译: 本发明提供能够支持入射角较宽的光学系统的固体摄像装置等。 每个像素的尺寸为2.25mum正方形,并且包括分布式折射率透镜1,滤色器(例如,绿色)2,Al互连3,信号发送单元4,平坦化层5,光接收装置 (Si光电二极管)6和Si衬底7.分布式折射率透镜的两级同心圆结构由SiO 2(n = 2)形成,膜厚为1.2μm(“灰” 颜色“),膜厚0.8μm(”点图案“)和膜厚度为0μm(”无图案:白色“),分布折射率透镜1周围的介质为空气(n = 1)。

    SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF 有权
    固态成像装置,固态成像装置及其制造方法

    公开(公告)号:US20090020840A1

    公开(公告)日:2009-01-22

    申请号:US12189971

    申请日:2008-08-12

    IPC分类号: H01L31/00

    CPC分类号: H01L27/14627 H01L27/14685

    摘要: A solid-state imaging apparatus includes a plurality of unit pixels with associated microlenses arranged in a two-dimensional array. Each microlens includes a distributed index lens with a modulated effective refractive index distribution obtained by including a combination of a plurality of patterns having a concentric structure, the plurality of patterns being divided into line widths equal to or shorter than a wavelength of an incident light. At least one of the plurality of patterns includes a lower light-transmitting film having the concentric structure and a first line width and a first film thickness, and an upper light-transmitting film having the concentric structure configured on the lower light-transmitting film having a second line width and a second film thickness. The distributed index lens has a structure in which a refractive index material is dense at a center and becomes sparse gradually toward an outer side in the concentric structure.

    摘要翻译: 固态成像装置包括具有以二维阵列排列的相关联的微透镜的多个单位像素。 每个微透镜包括具有调制的有效折射率分布的分布式折射率透镜,通过包括具有同心结构的多个图案的组合而获得,所述多个图案被划分成等于或短于入射光的波长的线宽。 多个图案中的至少一个图案包括具有同心结构且第一线宽度和第一膜厚度的下部透光膜,以及具有同心结构的上部透光膜,其在下部透光膜上具有 第二线宽度和第二膜厚度。 分布式折射率透镜具有其中折射率材料在中心处致密并且在同心结构中朝向外侧逐渐变稀的结构。

    PHASE SHIFT MASK AND METHOD FOR MANUFACTURING LIGHT-COLLECTING DEVICE
    3.
    发明申请
    PHASE SHIFT MASK AND METHOD FOR MANUFACTURING LIGHT-COLLECTING DEVICE 失效
    相位移动掩模和制造收集装置的方法

    公开(公告)号:US20080076039A1

    公开(公告)日:2008-03-27

    申请号:US11860756

    申请日:2007-09-25

    IPC分类号: G03F1/00

    CPC分类号: G03F7/0005 G03F1/30

    摘要: The phase shift mask according to the present invention is a phase shift mask for manufacturing a semiconductor device. The phase shift mask includes a light-blocking portion, a light-transmitting portion, a phase shift portion, and an auxiliary pattern portion, the light-blocking portion, the light-transmitting portion, the phase shift portion, and the auxiliary pattern portion being concentrically arranged, wherein a width of the auxiliary pattern portion in a radius direction is less than a width of the light-transmitting portion and a width of the phase shift portion in a radius direction. Furthermore, it is possible that a phase of exposure light which passes through an auxiliary pattern portion is opposite to a phase of exposure light which passes through a light-transmitting portion or a phase shift portion, the light-transmitting portion or the phase shift portion being the closest to the auxiliary pattern portion.

    摘要翻译: 根据本发明的相移掩模是用于制造半导体器件的相移掩模。 相移掩模包括遮光部分,透光部分,相移部分和辅助图案部分,遮光部分,透光部分,相移部分和辅助图案部分 其中所述辅助图形部分在半径方向上的宽度小于所述透光部分的宽度和所述相移部分在半径方向上的宽度。 此外,通过辅助图案部分的曝光光的相位可能与通过透光部分或相移部分的曝光光的相位相反,透光部分或相移部分 最靠近辅助图案部分。

    MANUFACTURING METHOD OF LIGHT-COLLECTING DEVICE, LIGHT-COLLECTING DEVICE AND PHASE SHIFT MASK
    4.
    发明申请
    MANUFACTURING METHOD OF LIGHT-COLLECTING DEVICE, LIGHT-COLLECTING DEVICE AND PHASE SHIFT MASK 有权
    光收集装置的制造方法,收集装置和相移片

    公开(公告)号:US20060285228A1

    公开(公告)日:2006-12-21

    申请号:US11423989

    申请日:2006-06-14

    IPC分类号: G02B3/08

    摘要: The present invention provides a method of manufacturing a lens, in which the method includes exposing a photoresist to light using a phase shift mask. Here, the phase shift mask includes layout portions respectively corresponding to pixels and lens, in which each of the layout portions has: a light-blocking portion which has a shape of a substantially circle or a substantially concentric zone; a light-transmitting portion which has a shape of a substantially circle or a substantially concentric zone; a phase shift portion which has a shape of a substantially circle or a substantially concentric zone; and a light-blocking frame. Furthermore, the light-transmitting portion, the light-blocking portion and the phase shift portion are arranged alternately so as to form concentric circles, and the light-blocking frame corresponds to a whole or a part of a perimeter of the lens.

    摘要翻译: 本发明提供一种制造透镜的方法,其中所述方法包括使用相移掩模将光致抗蚀剂曝光。 这里,相移掩模包括分别对应于像素和透镜的布局部分,其中每个布局部分具有:具有基本圆形或基本同心的形状的遮光部分; 具有基本上圆形或大体上同心的形状的透光部分; 相移部,其具有大致圆形或大致同心的区域的形状; 和遮光框架。 此外,光透射部分,遮光部分和相移部分交替地布置以形成同心圆,并且遮光框对应于透镜的周边的全部或一部分。

    Semiconductor device and method of fabricating the same
    5.
    发明申请
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20080038856A1

    公开(公告)日:2008-02-14

    申请号:US11898951

    申请日:2007-09-18

    摘要: The semiconductor device of this invention includes an active region formed from a group III nitride semiconductor grown on a substrate and an insulating oxide film formed in a peripheral portion of the active region by oxidizing the group III nitride semiconductor. On the active region, a gate electrode in Schottky contact with the active region extending onto the insulating oxide film and having an extended portion on the insulating oxide film is formed, and ohmic electrodes respectively serving as a source electrode and a drain electrode are formed with space from side edges along the gate length direction of the gate electrode.

    摘要翻译: 本发明的半导体器件包括由在衬底上生长的III族氮化物半导体形成的有源区和通过氧化III族氮化物半导体而形成在有源区的周边部分中的绝缘氧化物膜。 在有源区域上,形成与延伸到绝缘氧化膜上并在绝缘氧化膜上具有延伸部分的有源区肖特基接触的栅电极,分别用作源电极和漏电极的欧姆电极形成有 沿着栅电极的栅极长度方向的侧边缘的空间。

    SOLID STATE IMAGING DEVICE AND METHOD FOR FABRICATING THE SAME
    6.
    发明申请
    SOLID STATE IMAGING DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    固态成像装置及其制造方法

    公开(公告)号:US20080303058A1

    公开(公告)日:2008-12-11

    申请号:US12035340

    申请日:2008-02-21

    IPC分类号: H01L31/0336 H01L21/329

    摘要: A solid state imaging device includes a pixel having a photoelectric conversion element formed on a semiconductor substrate. The photoelectric conversion element includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type formed on the first semiconductor layer and forming a junction therebetween; a third semiconductor layer formed on the second semiconductor layer and having a smaller band gap energy than the second semiconductor layer, the third semiconductor layer being made of a single-crystal semiconductor and containing an impurity; and a fourth semiconductor layer of the first conductivity type covering a side surface and an upper surface of the third semiconductor layer. Provision of the fourth semiconductor layer can reduce a current flowing in dark conditions.

    摘要翻译: 固态成像装置包括具有形成在半导体基板上的光电转换元件的像素。 光电转换元件包括:第一导电类型的第一半导体层; 第二导电类型的第二半导体层,形成在第一半导体层上并在其间形成接合部; 形成在所述第二半导体层上并且具有比所述第二半导体层更小的带隙能量的第三半导体层,所述第三半导体层由单晶半导体制成并且含有杂质; 以及覆盖第三半导体层的侧表面和上表面的第一导电类型的第四半导体层。 提供第四半导体层可以减少在黑暗条件下流动的电流。