公开(公告)号：US20040124543A1

公开(公告)日：2004-07-01

申请号：US10334042

申请日：2002-12-30

Applicant: Motorola Inc.

Inventor： Brian W. Condie ,  David J. Dougherty

IPC: H01L023/48

CPC classification number: H01L24/83 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device (121) is provided which comprises a substrate and a die (123) having a first surface which is attached to the substrate by way of a die attach material. At least a portion (127) of the perimeter of the die is resistant to wetting by the die attach material, either through treatment with a dewetting agent or by selective removal of the backside metallization. It is found that this construction allows the surface area of the die to be increased without increasing the incidence of cracking and chipping along the sawn edges of the die.

Abstract translation: 提供一种半导体器件（121），其包括基板和具有通过管芯附着材料附接到基板的第一表面的管芯（123）。 通过用去湿剂处理或通过选择性去除背面金属化，模具的周边的至少一部分（127）抵抗通过管芯附接材料的润湿。 发现这种结构允许模具的表面积增加，而不增加沿着模具的锯刃的开裂和切屑的发生。