PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARDS MADE BY USING THE SAME
    8.
    发明申请
    PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARDS MADE BY USING THE SAME 有权
    光刻胶和热固化树脂组合物和使用它的印刷电路板

    公开(公告)号:US20120295200A1

    公开(公告)日:2012-11-22

    申请号:US13560286

    申请日:2012-07-27

    IPC分类号: G03F7/027

    摘要: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

    摘要翻译: 光固化性和热固性组合物包含(A)在其分子中具有至少一个羧基的含羧基的树脂,(B)具有由以下通式(I)表示的肟键的光聚合引发剂,(C)反应性 稀释剂,(D)分子中具有2个以上环氧基的环氧化合物。 将上述光聚合引发剂(B)掺入至少与至少含有上述含羧基的树脂(A)和上述反应性稀释剂(C)的配方不同的制剂中,以配制 包括至少两个部分的系统。

    Photocurable and thermosetting resin composition and printed circuit boards made by using the same
    9.
    发明申请
    Photocurable and thermosetting resin composition and printed circuit boards made by using the same 审中-公开
    可光固化和热固性树脂组合物和使用它们的印刷电路板

    公开(公告)号:US20080227883A1

    公开(公告)日:2008-09-18

    申请号:US12153309

    申请日:2008-05-16

    IPC分类号: C08J3/28

    摘要: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

    摘要翻译: 光固化性和热固性组合物包含(A)在其分子中具有至少一个羧基的含羧基的树脂,(B)具有由以下通式(I)表示的肟键的光聚合引发剂,(C)反应性 稀释剂,(D)分子中具有2个以上环氧基的环氧化合物。 将上述光聚合引发剂(B)掺入至少与至少含有上述含羧基的树脂(A)和上述反应性稀释剂(C)的配方不同的制剂中,以配制 包括至少两个部分的系统。