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公开(公告)号:US20130232747A1
公开(公告)日:2013-09-12
申请号:US13873301
申请日:2013-04-30
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor: Naohiro NODAKE , Hideaki TAKAHASHI , Shin SAIJO
IPC: H01L41/29
CPC classification number: H01L41/29 , H01L41/22 , H01L41/27 , H03H3/04 , H03H3/10 , H03H9/0222 , H03H2003/0414 , H03H2003/045 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
Abstract: In the boundary acoustic wave device, an IDT electrode, a first dielectric layer, and a second dielectric layer are provided on a piezoelectric substrate. The first dielectric layer is made of a deposited film. A thickness of the IDT electrode is about 10% or more of λ. A difference between a height of the first dielectric layer, measured from an upper surface of the piezoelectric substrate, above a center of an electrode finger of the IDT electrode and a height of the first dielectric layer, measured from the upper surface of the piezoelectric substrate, above a center of a gap between adjacent electrode fingers, i.e., a magnitude of unevenness in an upper surface of the first dielectric layer, is about 5% or less of λ.
Abstract translation: 在弹性边界波装置中,在压电基板上设置IDT电极,第一电介质层和第二电介质层。 第一电介质层由沉积膜制成。 IDT电极的厚度为λ的约10%以上。 从压电基板的上表面测量的第一介电层的高度与IDT电极的电极指的中心之间的距离和第一介电层的高度之间的差异是从压电基板的上表面 在相邻电极指之间的间隙的中心上方,即第一介电层的上表面中的不均匀度的大小为λ的约5%或更小。
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公开(公告)号:US20200186128A1
公开(公告)日:2020-06-11
申请号:US16707169
申请日:2019-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Koji YAMAMOTO , Tsutomu TAKAI , Hideaki TAKAHASHI
Abstract: An acoustic wave device includes a high-acoustic-velocity film, a low-acoustic-velocity film provided on the high-acoustic-velocity film, a piezoelectric layer provided on the low-acoustic-velocity film, and an IDT electrode provided on the piezoelectric layer. An acoustic velocity of bulk waves propagating through the high-acoustic-velocity film is higher than an acoustic velocity of acoustic waves propagating through the piezoelectric layer. An acoustic velocity of bulk waves propagating through the low-acoustic-velocity film is lower than an acoustic velocity of bulk waves propagating through the piezoelectric layer. The low-acoustic-velocity film includes a material including hydrogen atoms.
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公开(公告)号:US20200186119A1
公开(公告)日:2020-06-11
申请号:US16707155
申请日:2019-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Koji YAMAMOTO , Tsutomu TAKAI , Hideaki TAKAHASHI
Abstract: An acoustic wave device includes a high-acoustic-velocity film, a piezoelectric layer provided directly or indirectly on the high-acoustic-velocity film, an IDT electrode provided on the piezoelectric layer, and a dielectric film provided on the piezoelectric layer to cover the IDT electrode. An acoustic velocity of bulk waves propagating through the high-acoustic-velocity film is higher than an acoustic velocity of acoustic waves propagating through the piezoelectric layer. The dielectric film includes a material including hydrogen atoms.
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公开(公告)号:US20190288668A1
公开(公告)日:2019-09-19
申请号:US16429098
申请日:2019-06-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideaki TAKAHASHI , Hirokazu SAKAGUCHI , Yasuharu NAKAI
Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a silicon oxide film arranged on the piezoelectric substrate to cover the IDT electrode. The IDT electrode includes first and second electrode layers laminated on each other, the first electrode layer is made of metal or an alloy with a density higher than a density of metal of the second electrode layer and a density of silicon oxide of the silicon oxide film, the piezoelectric substrate is made of LiNbO3 and θ is in a range of equal to or greater than about 8° and equal to or less than about 32° with Euler Angles (0°±5°, θ, 0°±10°) of the piezoelectric substrate, and the silicon oxide film contains hydrogen atoms, hydroxyl groups, or silanol groups.
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公开(公告)号:US20130029033A1
公开(公告)日:2013-01-31
申请号:US13644040
申请日:2012-10-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Taku KIKUCHI , Hideaki TAKAHASHI
IPC: H01L41/22
CPC classification number: H03H3/10 , C23C14/0036 , C23C14/0042 , C23C14/0073 , C23C14/34 , C23C14/3407 , C23C14/3421 , C23C14/3428 , C23C14/3435 , H03H3/00 , H03H3/02 , H03H9/00 , H03H9/02 , H03H9/02228 , H03H9/02559 , H03H9/02574 , H03H9/02582 , H03H9/02834 , H03H9/14538 , H03H9/725 , H03H2003/0428 , Y10T29/42
Abstract: A method for manufacturing an acoustic wave device with an excellent frequency-temperature profile is performed such that the acoustic wave device produced includes a piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, and a dielectric film mainly including Si and O and arranged on the piezoelectric substrate to cover the IDT electrode. The dielectric film is formed by sputtering in a sputtering gas containing H2O.
Abstract translation: 进行具有优异的频率 - 温度分布的声波器件的制造方法,使得所制造的声波器件包括压电基片,位于压电基片上的IDT电极,以及主要包括Si和O的电介质膜,并布置在 压电基板覆盖IDT电极。 电介质膜通过溅射在含有H 2 O的溅射气体中形成。
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