CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    陶瓷电子元件及其制造方法

    公开(公告)号:US20140057080A1

    公开(公告)日:2014-02-27

    申请号:US14068053

    申请日:2013-10-31

    Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.

    Abstract translation: 在电子部件中,外部端子电极的周边部比其中央部厚,并且周边部的至少一部分埋设在部件主体中。 外部端子电极的表面和部件主体的主表面位于同一平面上。 沿着部件主体的主表面布置电绝缘涂层,以覆盖外部端子电极的周边部分的至少一部分。 涂层的端部与组件主体的主表面中的外部端子电极的周边部分的最厚部分接触。 涂层和外部端子电极的表面位于同一平面上。

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