公开(公告)号：US09805871B2

公开(公告)日：2017-10-31

申请号：US15352670

申请日：2016-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Onishi ,  Tomohiro Sasaki ,  Yasuhiro Nishisaka ,  Akira Ishizuka ,  Akihiro Yoshida

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/005 ,  H01F27/29 ,  H01C7/00 ,  H01L41/047 ,  H01L41/293 ,  H01G4/008 ,  H01G4/12 ,  H01F27/28

CPC classification number: H01G4/30 ,  H01C7/008 ,  H01F27/2804 ,  H01F27/29 ,  H01F2027/2809 ,  H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/293

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

公开(公告)号：US08982533B2

公开(公告)日：2015-03-17

申请号：US13886309

申请日：2013-05-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro Motoki ,  Akihiro Yoshida ,  Makoto Ogawa

IPC: H01G4/00 ,  H01G4/30 ,  C23C18/40 ,  C23C28/02 ,  C25D5/10 ,  C25D5/12 ,  H01G4/232 ,  C25D17/20

CPC classification number: H01G4/30 ,  C23C18/405 ,  C23C28/023 ,  C23C28/028 ,  C25D5/10 ,  C25D5/12 ,  C25D17/20 ,  H01G4/2325 ,  Y10T428/24917

Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.

Abstract translation: 单片电子部件包括层叠体，该层压体包括多个层叠绝缘层和在绝缘层之间延伸的多个内部电极，并且其端部暴露在层叠体的预定表面处，设置在层压体的预定表面上的第一镀层 以及设置在第一镀层上的第二镀层。 第一镀层由不同于制造内部电极的金属制成。 第一镀层通过无电镀形成。 第二镀层通过电镀形成。

公开(公告)号：US09530560B2

公开(公告)日：2016-12-27

申请号：US14324397

申请日：2014-07-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Onishi ,  Tomohiro Sasaki ,  Yasuhiro Nishisaka ,  Akira Ishizuka ,  Akihiro Yoshida

IPC: H01G4/005 ,  H01G4/30 ,  H01F27/29 ,  H01C7/00 ,  H01L41/047 ,  H01L41/293

CPC classification number: H01G4/30 ,  H01C7/008 ,  H01F27/2804 ,  H01F27/29 ,  H01F2027/2809 ,  H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/293

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract translation: 电连接到内部电极的露出部分的外部电极设置在层叠陶瓷电容器的陶瓷主体的端面上。 包含在内部电极中的金属和外部电极中包含的金属的合金层被布置在外部电极和陶瓷主体和内部电极之间的边界处。 电镀层设置在外部电极的表面上。 因此提供了具有减小的ESR的陶瓷电子部件。

公开(公告)号：US09859056B2

公开(公告)日：2018-01-02

申请号：US14867282

申请日：2015-09-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro Yoshida

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01G4/12 ,  H01G4/012 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/10015

Abstract: A multilayer ceramic capacitor includes an external electrode on an end surface of a ceramic body to be connected to internal electrodes including a base layer including a sintered metal containing Cu and glass and a Cu plated layer on the base layer. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The Cu metal of the Cu plated layer is present in the base layer to a position of about ⅓ or more of the thickness of the base layer from a surface layer of the external electrode. The metal thickness of the external electrode is about 8.7 μm or more and about 13.9 μm or less.

公开(公告)号：US09148954B2

公开(公告)日：2015-09-29

申请号：US14223258

申请日：2014-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro Nishisaka ,  Satoshi Matsuno ,  Akihiro Yoshida ,  Yasunori Taseda

IPC: H05K1/03 ,  H05K1/18 ,  H01G4/232

CPC classification number: H05K1/0306 ,  H01G4/2325 ,  H05K1/185 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

Abstract translation: 陶瓷电子部件包括陶瓷体和外部电极。 陶瓷体包括第一和第二主表面，第一和第二侧表面以及第一和第二端面。 外电极设置在第一主表面上。 外电极包括含有Cu和玻璃的底层电极层和Cu镀层。 底层电极层设置在第一主表面上。 Cu镀层设置在下面的电极层上。 Cu镀层比下面的电极层厚。