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公开(公告)号:US20180221537A1
公开(公告)日:2018-08-09
申请号:US15887301
申请日:2018-02-02
发明人: Jed JOHNSON , Jason CHAKROFF , Devan OHST , Brian COHEN , Anthony ROMEO
CPC分类号: A61L27/18 , A61B17/0401 , A61B2017/00526 , A61B2017/00884 , A61B2017/0406 , A61B2017/0414 , A61B2017/0464 , A61B2017/0495 , A61F2/0811 , A61F2002/0852 , A61F2002/0858 , A61L27/10 , A61L27/12 , A61L27/3662 , A61L27/46 , A61L2300/64 , A61L2430/10 , C08L67/04
摘要: The instant disclosure is directed to methods of improving bone-soft tissue healing using biocompatible electrospun polymer fibers. In one embodiment, a method may include locating a portion of a subject's bone, affixing a tendon or ligament to the bone using a hardware fixture, and placing a patch comprising at least one electrospun polymer fiber in physical communication with both the bone and the tendon or ligament. In some embodiments, the bone may be a humerus, and the tendon or ligament may be a supraspinatus tendon. In certain embodiments, the patch may comprise substantially parallel electrospun polymer fibers, and may be placed such that the fibers are also substantially parallel with the long axis of the tendon or ligament.