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1.发明申请PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE 有权表面安装陶瓷LED封装，由生产工艺生产的表面安装陶瓷LED封装的生产工艺和用于生产包装的模具公开(公告)号：US20100084681A1
公开(公告)日：2010-04-08
申请号：US12244799
申请日：2008-10-03
申请人： NAOTO NAKAJIMA , SHUICHI TSUNODA , AKIRA INABA
发明人： NAOTO NAKAJIMA , SHUICHI TSUNODA , AKIRA INABA
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
摘要翻译： 本发明涉及一种表面安装陶瓷LED封装及其制造方法，包括：将具有孔的陶瓷生片和第二陶瓷生片分层，将具有凹槽的模具插入底部形成隔板 的陶瓷生片基板，烧成陶瓷生片基板。
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2.发明申请公开(公告)号：US20130160835A1
公开(公告)日：2013-06-27
申请号：US13337619
申请日：2011-12-27
申请人： AKIRA INABA , Takeshi Kondo , Mamoru Murakami
发明人： AKIRA INABA , Takeshi Kondo , Mamoru Murakami
IPC分类号： H01L31/0224 , H01B1/22 , H01L31/18
CPC分类号： H01B1/22 , H01L31/022425 , H01L31/068 , Y02E10/547
摘要： The invention relates to a back-side electrode adjacently formed on silicon layer of p-type solar cell comprises a conductive component comprising (a) aluminum powder, (b) organic medium and (c) metal-containing component selected from the group consisting of (i) metal selected from the group consisting of Bismuth (Bi), Molybdenum (Mo), Strontium (Sr) and Stibium (Sb), and (ii) carbide, oxide, nitride, boride, carbonate, hydroxide and resinate of (i) metal, and (iii) Copper (Cu).
摘要翻译： 本发明涉及一种邻近形成在p型太阳能电池的硅层上的背面电极，其包括导电组分，该导电组分包括（a）铝粉，（b）有机介质和（c）选自以下的含金属组分： （i）选自铋（Bi），钼（Mo），锶（Sr）和锑（Sb）的金属，和（ii）碳化物，氧化物，氮化物，硼化物，碳酸盐，氢氧化物和（i ）金属，（iii）铜（Cu）。
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3.发明申请公开(公告)号：US20130160834A1
公开(公告)日：2013-06-27
申请号：US13337602
申请日：2011-12-27
申请人： AKIRA INABA , TAKESHI KONDO
发明人： AKIRA INABA , TAKESHI KONDO
IPC分类号： H01L31/0224 , H01B1/02 , H01L31/18
CPC分类号： H01B1/22 , H01L31/022425 , H01L31/068 , Y02E10/547
摘要： The invention relates to a back-side electrode adjacently formed on silicon layer of p-type solar cell, comprises a conductive component comprising, before firing, (a) aluminum powder, (b) organic medium and (c) metal-containing component selected from the group consisting of (i) metal selected from the group consisting of Titanium(Ti), Manganese(Mn) and Cerium (Ce), and (ii) carbide, oxide, nitride, boride, carbonate, hydroxide and resinate of (i) metal.
摘要翻译： 本发明涉及一种邻近形成在p型太阳能电池的硅层上的背面电极，包括导电组分，其包括在烧制之前（a）铝粉，（b）有机介质和（c）选择的含金属组分 由（i）选自钛（Ti），锰（Mn）和铈（Ce）的金属组成的组，和（ii）碳化物，氧化物，氮化物，硼化物，碳酸盐，氢氧化物和（i ）金属。
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公开(公告)号：US20100009203A1
公开(公告)日：2010-01-14
申请号：US12169881
申请日：2008-07-09
申请人： YOSHIKAZU NAGENO , AKIRA INABA
发明人： YOSHIKAZU NAGENO , AKIRA INABA
CPC分类号： C03C8/04 , C03C8/16 , C03C10/0054 , C03C2207/04 , C04B41/009 , C04B41/5022 , C04B41/86 , C04B2111/92 , C04B41/4539 , C04B41/5035 , C04B41/5041 , C04B35/00
摘要： An insulation layer formed on a metal or ceramic substrate includes a glass component, wherein the glass component contains 0.1 to 10 wt % of B2O3 based on the total weight of the glass component. The insulation layer of the present invention exhibits few defects on the interface thereof with a substrate, even when fired at high temperature.
摘要翻译： 形成在金属或陶瓷基板上的绝缘层包括玻璃成分，其中玻璃成分相对于玻璃成分的总重量含有0.1〜10重量％的B 2 O 3。 本发明的绝缘层即使在高温下烧成时也与基板的界面几乎没有缺陷。
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公开(公告)号：US20090311537A1
公开(公告)日：2009-12-17
申请号：US12483362
申请日：2009-06-12
申请人： AKIRA INABA
发明人： AKIRA INABA
CPC分类号： C08L83/04 , C08K3/22 , C08K3/34 , H01B3/46 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , Y10T428/31612 , Y10T428/31663 , C08L2666/04 , H01L2924/00 , H01L2224/05599
摘要： This invention relates to an insulating paste for an electric module that avoids cracks occurring in an insulating layer. The insulating paste comprises heat-curable silicone resin, inorganic filler and solvent.
摘要翻译： 本发明涉及一种避免绝缘层发生裂缝的电气模块绝缘膏。 绝缘膏包括可热固化的有机硅树脂，无机填料和溶剂。
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