公开(公告)号：US20040089470A1

公开(公告)日：2004-05-13

申请号：US10701594

申请日：2003-11-06

Applicant: NEC CORPORATION

Inventor： Tadanori Shimoto ,  Hirokazu Honda ,  Keiichiro Kata ,  Hideya Murai ,  Katsumi Kikuchi ,  Kazuhiro Baba

IPC: H05K001/00

CPC classification number: H05K1/0346 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K3/205 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2203/0733 ,  H01L2224/0401

Abstract: A printed circuit board is provided including a lower interconnect, a base insulating film formed on the lower interconnect, and a via hole formed on the base insulating film, and an upper interconnect connected to the lower interconnect with the via hole. The base insulating film has a thickness of about 3 to 100 nullm and has a breaking strength of about 80 MPa or more at a temperature of 23null C. and when the base insulating film is defined to have a breaking strength nullanull at a temperature of null65null C. and a breaking strength nullbnull at a temperature of 150null C., a value of a ratio (a/b) is about 4.5 or less.

Abstract translation: 提供一种印刷电路板，包括下互连，形成在下互连上的基绝缘膜，以及形成在基绝缘膜上的通孔，以及与通孔相连的下互连的上互连。 基底绝缘膜的厚度为3〜100μm左右，在23℃的温度下具有约80MPa以上的断裂强度，并且当基底绝缘膜的断裂强度a 温度为-65℃，断裂强度“b”在150℃的温度下，比率（a / b）为4.5以下。

公开(公告)号：US20020001937A1

公开(公告)日：2002-01-03

申请号：US09894123

申请日：2001-06-29

Applicant: NEC CORPORATION

Inventor： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

IPC: H01L021/4763

CPC classification number: H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/44 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/061 ,  H05K2203/1536 ,  H01L2924/00

Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

Abstract translation: 用于安装半导体芯片的半导体封装板包括具有用于在其中接收半导体芯片的开口的金属基体和层叠在金属基底上的多层布线膜。 将半导体芯片倒装芯片接合到设置在开口内的多层布线膜上的金属焊盘上。 金属基体的表面与容纳在开口中的半导体芯片的顶表面齐平。 所得的半导体器件在不使用加强件的情况下具有较大数量的外部引脚和较小的变形。