公开(公告)号：US20150275725A1

公开(公告)日：2015-10-01

申请号：US14618234

申请日：2015-02-10

申请人： NGK Insulators, Ltd.

发明人： Shuichi ICHIKAWA ,  Keisuke KIMURA ,  Taku NISHIGAKI

IPC分类号： F01N3/022 ,  B01D46/24 ,  C04B38/00 ,  B32B3/12

CPC分类号： F01N3/0222 ,  B01D46/2418 ,  B01D46/2448 ,  B01D46/2466 ,  B32B3/12 ,  C04B28/24 ,  C04B35/565 ,  C04B35/6316 ,  C04B38/0006 ,  C04B38/0019 ,  C04B2111/00387 ,  C04B2111/00793 ,  C04B2111/0081 ,  C04B2111/2084 ,  C04B2235/3217 ,  C04B2235/3481 ,  C04B2235/3826 ,  C04B2235/428 ,  C04B2235/5224 ,  Y10T428/24149 ,  C04B38/0645 ,  C04B38/067 ,  C04B14/043 ,  C04B14/303 ,  C04B14/324 ,  C04B14/4625 ,  C04B24/383 ,  C04B2103/0049 ,  C04B14/20 ,  C04B2103/0051

摘要： In a honeycomb structure, a bonding material monolithically bonds a plurality of honeycomb segments. The bonding material contains crystalline anisotropic ceramic particle and a particulate pore former. The crystalline anisotropic ceramic particle is 20 mass % or less. An average particle diameter of the pore former in the bonding material is 80 to 200 μm. In the case where a compressive Young's modulus of the bonding material is assumed as E (unit: MPa) and a shear strength of the bonding material is assumed as σ (unit: kPa), σ/E is 5 to 50.

摘要翻译： 在蜂窝结构体中，接合材料将多个蜂窝片段整体地结合。 接合材料包含结晶各向异性陶瓷颗粒和颗粒状成孔剂。 结晶各向异性陶瓷粒子为20质量％以下。 接合材料中的成孔剂的平均粒径为80〜200μm。 在将接合材料的压缩杨氏模量设为E（单位：MPa），将接合材料的剪切强度设为＆sgr的情况下， （单位：kPa），＆sgr / E为5〜50。

公开(公告)号：US20200308069A1

公开(公告)日：2020-10-01

申请号：US16803092

申请日：2020-02-27

申请人： NGK INSULATORS, LTD.

发明人： Keisuke KIMURA

IPC分类号： C04B38/00 ,  C04B35/565 ,  B01D39/20 ,  B01D46/24

摘要： A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 μm.

公开(公告)号：US20200306677A1

公开(公告)日：2020-10-01

申请号：US16822507

申请日：2020-03-18

申请人： NGK INSULATORS, LTD.

发明人： Jun INOUE ,  Michio SUZUKI ,  Yoshitaka TABUCHI ,  Keisuke KIMURA

IPC分类号： B01D46/00 ,  C04B38/00 ,  B01D46/24

摘要： A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.

公开(公告)号：US20200277508A1

公开(公告)日：2020-09-03

申请号：US16800423

申请日：2020-02-25

申请人： NGK INSULATORS, LTD.

发明人： Keisuke KIMURA ,  Suguru KODAMA

IPC分类号： C09D121/02 ,  C09D7/61 ,  C09D7/40 ,  B01D53/94 ,  B01D46/24 ,  B01J35/04 ,  B01J27/224 ,  B01J21/12

摘要： A coating material for a honeycomb structure, the coating material containing: from 1% by mass to 10% by mass of first ceramic fibers having an average axial length of from 80 μm to 200 μm in an inorganic raw material; and from 0.1% by mass to 15% by mass of second ceramic fibers having an average axial length of from 50 μm to 70 μm in the inorganic raw material.

公开(公告)号：US20170284246A1

公开(公告)日：2017-10-05

申请号：US15467087

申请日：2017-03-23

申请人： NGK INSULATORS, LTD.

发明人： Keisuke KIMURA ,  Ryuta KOUNO ,  Shuichi ICHIKAWA

IPC分类号： F01N3/022 ,  B01D46/24 ,  B28B3/20 ,  B28B11/24 ,  B32B3/12 ,  B32B18/00

CPC分类号： F01N3/0222 ,  B01D46/2448 ,  B01D46/2459 ,  B01D46/247 ,  B01D46/2474 ,  B01D2046/2433 ,  B01D2046/2437 ,  B01D2265/04 ,  B01D2275/406 ,  B28B1/002 ,  B28B3/20 ,  B28B11/243 ,  B28B2003/203 ,  B32B3/12 ,  B32B18/00 ,  C04B28/24 ,  C04B35/565 ,  C04B35/6263 ,  C04B37/005 ,  C04B38/0019 ,  C04B2111/00387 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3445 ,  C04B2235/3454 ,  C04B2235/3472 ,  C04B2235/349 ,  C04B2235/522 ,  C04B2235/5224 ,  C04B2235/5228 ,  C04B2235/524 ,  C04B2235/5244 ,  C04B2235/5248 ,  C04B2235/5292 ,  C04B2235/5296 ,  C04B2235/5436 ,  C04B2235/96 ,  C04B2237/083 ,  C04B2237/09 ,  C04B2237/365 ,  C04B2237/597 ,  F01N3/2828 ,  F01N2330/04 ,  F01N2330/06 ,  F01N2330/38 ,  F01N2330/48 ,  Y02T10/20 ,  C04B14/46 ,  C04B38/0064 ,  C04B38/08

摘要： A honeycomb structure includes honeycomb segments each having a porous partition wall defining a plurality of cells, and includes a porous bonding layer containing a crystalline anisotropic ceramic and disposed so as to bond side surfaces of the honeycomb segments to each other. A ratio of a pore volume (cc/g) of a fine pore defined as a pore in the bonding layer having a pore diameter of 10 μm or more and less than 50 μm with respect to a pore volume (cc/g) of a coarse pore defined as a pore in the bonding layer having a pore diameter of 50 μm or more and 300 μm or less is from 2.0 to 3.5, the pore volume of the fine pore is from 0.15 to 0.4 cc/g, and the pore volume of the coarse pore is from 0.05 to 0.25 cc/g.

公开(公告)号：US20210300767A1

公开(公告)日：2021-09-30

申请号：US17182354

申请日：2021-02-23

申请人： NGK INSULATORS, LTD.

发明人： Taku NISHIGAKI ,  Suguru KODAMA ,  Keisuke KIMURA

IPC分类号： C01B32/963 ,  B01J35/04 ,  B01J27/224 ,  B01J35/02 ,  B01J37/04

摘要： A method for manufacturing a honeycomb structure containing silicon carbide, including blending a recycled raw material derived from a material constituting a first honeycomb structure containing silicon carbide in a process after firing as a part of an initial raw material for a second honeycomb structure containing silicon carbide, wherein the initial raw material comprises silicon carbide and metallic silicon; and the recycled raw material is a powder recovered from the material constituting the first honeycomb structure containing silicon carbide in the process after firing, and after the recovering, a particle size is adjusted so that a 10% diameter (D10) is 10 μm or more and a 50% diameter (D50) is 35 μm or less when a cumulative particle size distribution on a volume basis is measured by a laser diffraction/scattering method.