公开(公告)号：US20190296190A1

公开(公告)日：2019-09-26

申请号：US16354056

申请日：2019-03-14

Applicant: NICHIA CORPORATION

Inventor： Yoshinori MIYAMOTO ,  Tokutaro OKABE ,  Yuya KAGOSHIMA ,  Keisuke HIGASHITANI ,  Chiaki OZAKI

IPC: H01L33/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/32

Abstract: A method for manufacturing a semiconductor device includes: preparing a wafer including sapphire, the wafer having an upper surface that includes a first region and a second region, the second region surrounding the first region and located at a position at least 2 μm higher or lower than the first region; and forming a semiconductor layer at the upper surface, the semiconductor layer including at least one layer that comprises AlzGa1-zN (0.03≤z≤0.15).

公开(公告)号：US20160240738A1

公开(公告)日：2016-08-18

申请号：US15044868

申请日：2016-02-16

Applicant: NICHIA CORPORATION

Inventor： Makoto ABE ,  Keisuke HIGASHITANI ,  Naoki AZUMA ,  Akiyoshi KINOUCHI

IPC: H01L33/22 ,  H01L33/16

CPC classification number: H01L33/22 ,  H01L33/16

Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.

Abstract translation: 发光元件包括：蓝宝石衬底，其主表面具有c面; 以及设置在蓝宝石基板的主表面侧的半导体层。 蓝宝石基板包括第一单元，其包括第一区域，第二区域和第三区域，其中，当从主表面侧观察时，三个区域一起具有均匀分为三个区域的正六边形的形状 使得每个区域具有菱形的形状; 以及设置成与所述第一单元的每一侧对准的多个第二单元，所述第二单元相对于所述第一单元具有镜像对称性。 第一单元和第二单元布置成在单元的中心形成空间。

公开(公告)号：US20230343892A1

公开(公告)日：2023-10-26

申请号：US18343078

申请日：2023-06-28

Applicant: NICHIA CORPORATION

Inventor： Yoshiki INOUE ,  Shun KITAHAMA ,  Yoshiyuki AIHARA ,  Yoshiki MATSUSHITA ,  Keisuke HIGASHITANI

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/22

CPC classification number: H01L33/0095 ,  H01L33/007 ,  H01L33/507 ,  H01L33/22 ,  H01L2933/0041

Abstract: A method for manufacturing a light-emitting element includes: forming a semiconductor structure comprising a light-emitting layer on a first surface of a substrate, wherein the first surface comprising a plurality of protrusions and a second region; dividing the semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region of the substrate, wherein the second region is exposed from under the semiconductor structure in the exposed region; bonding a light-transmitting body to a second surface of the substrate that is opposite the first surface so as to form a bonded body, wherein the light-transmitting body comprises a fluorescer; forming a plurality of modified regions along the exposed region; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.

公开(公告)号：US20210193867A1

公开(公告)日：2021-06-24

申请号：US17113583

申请日：2020-12-07

Applicant: NICHIA CORPORATION

Inventor： Yoshiki INOUE ,  Shun KITAHAMA ,  Yoshiyuki AIHARA ,  Yoshiki MATSUSHITA ,  Keisuke HIGASHITANI

IPC: H01L33/00 ,  H01L33/22 ,  H01L33/50

Abstract: A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.

公开(公告)号：US20180062036A1

公开(公告)日：2018-03-01

申请号：US15691551

申请日：2017-08-30

Applicant: NICHIA CORPORATION

Inventor： Makoto ABE ,  Keisuke HIGASHITANI ,  Naoki AZUMA ,  Akiyoshi KINOUCHI

IPC: H01L33/22 ,  H01L33/16

CPC classification number: H01L33/22 ,  H01L33/16

Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.