公开(公告)号：US20220139893A1

公开(公告)日：2022-05-05

申请号：US17573633

申请日：2022-01-12

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/16 ,  H01L33/50 ,  H01L33/56 ,  H01L33/48 ,  H01L33/64

Abstract: A light emitting device including a plurality of element structures each including a submount, a light emitting element, and a light transmissive member, in this order. The light emitting device further includes a first cover member holding the element structures by covering lateral faces of each of the element structures.

公开(公告)号：US20210005590A1

公开(公告)日：2021-01-07

申请号：US16917903

申请日：2020-07-01

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/16 ,  H01L33/50 ,  H01L33/56 ,  H01L33/64 ,  H01L33/48

Abstract: A method of manufacturing a light emitting device includes: providing a plurality of first element structures each including a submount, a light emitting element, and a light transmissive member, in this order; disposing the first element structures on a sheet member such that the submount in each of the first element structures faces the sheet member; and forming a first cover member on the sheet member so as to cover lateral faces of the first element structures.

公开(公告)号：US20220293573A1

公开(公告)日：2022-09-15

申请号：US17826160

申请日：2022-05-27

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/16

Abstract: A light emitting device that includes a plurality of element structures, a frame, and a covering member. Each of the plurality of element structures includes a light emitting element. The frame surrounds the plurality of element structures. The covering member is disposed on an inner side of the frame. The covering member is disposed between the frame and an element structure of the plurality of element structures adjacent to the frame and between adjacent element structures of the plurality of element structures. An upper surface and a lower surface of each of the plurality of element structures are exposed from the covering member.

公开(公告)号：US20210317958A1

公开(公告)日：2021-10-14

申请号：US17224816

申请日：2021-04-07

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA ,  Takashi ISHII

IPC: F21S4/28 ,  F21K9/90 ,  F21V23/00 ,  F21V29/503

Abstract: A light emitting device includes: a plurality of element structural bodies, each including: a substrate, a light emitting element mounted on or above the substrate, and a light-transmissive member disposed on or above the light emitting element, wherein at least three of the plurality of element structural bodies are disposed along a first direction; a first covering member that covers lateral surfaces of the substrate, the light emitting element, and the light-transmissive member of each of the plurality of element structural bodies; and a support member that covers a lateral surface of the first covering member, wherein at least a portion of the support member is disposed lateral to the plurality of element structural bodies and extends along the first direction. A rigidity of the support member is greater than a rigidity of the first covering member.

公开(公告)号：US20230317896A1

公开(公告)日：2023-10-05

申请号：US18189860

申请日：2023-03-24

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Takayoshi WAKAKI ,  Naoki MUSASHI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/505

Abstract: A light-emitting device includes a substrate, a light-emitting element on the substrate, a wavelength conversion member on the light-emitting element and including a first surface, an optical member above the first surface, a light-transmitting layer between the wavelength conversion member and the optical member and having a refractive index lower than a refractive index of the optical member, and a light-reflecting member surrounding the light-emitting element, the wavelength conversion member, the light-transmitting layer, and the optical member. The upper surface of the optical member includes a first region and a second region adjacent to the first region. The first region includes a first exit surface of which internal angle relative to the first surface is a first angle. The second region includes a second exit surface having a second angle narrower than the first angle. The second region is located in one corner region of the optical member.

公开(公告)号：US20230005895A1

公开(公告)日：2023-01-05

申请号：US17778000

申请日：2020-11-02

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Kosuke SATO ,  Chinami NAKAI ,  Takashi ISHII ,  Atsushi KOJIMA

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/56 ,  H01L23/00

Abstract: A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.
A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

公开(公告)号：US20210082885A1

公开(公告)日：2021-03-18

申请号：US17020838

申请日：2020-09-15

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/075 ,  H01L33/00

Abstract: A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.

公开(公告)号：US20210091051A1

公开(公告)日：2021-03-25

申请号：US17024704

申请日：2020-09-18

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/16

Abstract: A method of manufacturing a light-emitting device that includes providing a plurality of element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order. The method further includes disposing the plurality of element structures such that the light-transmissive members face a sheet member, and forming a covering member on the sheet member to cover at least a portion of each of lateral surfaces of the submount substrate of each of the element structures.