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公开(公告)号：US20170155025A1
公开(公告)日：2017-06-01
申请号：US15363773
申请日：2016-11-29
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
CPC classification number: H01L33/62 , H01L33/483 , H01L33/486
Abstract: A light emitting device includes a support substrate; a conductive wiring located on an upper surface of the support substrate; a light emitting element disposed on an upper surface of the conductive wiring via a bonding member interposed therebetween; and a frame body located on an upper surface of the support substrate. The frame body has a plurality of recessed portions on an inner lateral surface surrounding the light emitting element in a top view of the light emitting device. The conductive wiring includes an underlying portion located directly under the light emitting element, and at least two extended portions extending from the underlying portion to a location inside of at least two respective ones of the recessed portions in a top view of the light emitting device.
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公开(公告)号：US20200241412A1
公开(公告)日：2020-07-30
申请号：US16744659
申请日：2020-01-16
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
Abstract: A method for manufacturing an optical member includes: forming a mask pattern on a glass member, the mask pattern comprising oxygen and indium; performing dry etching on the glass member using the mask pattern as a mask, while using an etching gas comprising fluorine; after performing the dry etching, performing wet etching on the glass member using the mask pattern as a mask, while using an etching solution comprising fluorine; and after alternately repeating performing the dry etching and the wet etching a plurality of times, removing the mask pattern.
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公开(公告)号：US20180301608A1
公开(公告)日：2018-10-18
申请号：US15949975
申请日：2018-04-10
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
CPC classification number: H01L33/62 , H01L33/483 , H01L33/486
Abstract: A light emitting device includes a support substrate; a conductive wiring located on an upper surface of the support substrate; a light emitting element disposed on an upper surface of the conductive wiring via a bonding member interposed therebetween; and a frame body located on an upper surface of the support substrate. The frame body has a plurality of recessed portions on an inner lateral surface surrounding the light emitting element in a top view of the light emitting device. The conductive wiring includes an underlying portion located directly under the light emitting element, and at least two extended portions extending from the underlying portion to a location inside of at least two respective ones of the recessed portions in a top view of the light emitting device.
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公开(公告)号：US20240105459A1
公开(公告)日：2024-03-28
申请号：US18467920
申请日：2023-09-15
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
IPC: H01L21/308 , H01L33/00
CPC classification number: H01L21/3081 , H01L33/0075
Abstract: A method for manufacturing a semiconductor element includes preparing a semiconductor structure body that includes a p-side layer and an n-side layer; forming a first carbon film on the p-side layer by vapor deposition, the vapor deposition utilizing carbon ions generated by an arc discharge without introducing a gas to a discharge space, the discharge space being a vacuum; forming a second carbon film on the n-side layer by the vapor deposition; removing the first carbon film; and removing the second carbon film. A first bias voltage of the forming during the first carbon film on the p-side layer is higher than a second bias voltage of the forming during the second carbon film on the n-side layer.
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5.发明申请公开(公告)号：US20190259926A1
公开(公告)日：2019-08-22
申请号：US16282286
申请日：2019-02-21
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI , Takayoshi WAKAKI
Abstract: A method for forming a light-transmissive member includes: a step (A) including locating a cured resin body having a principal surface and containing a silicone resin, and a die including a plurality of convex portions, such that the principal surface and the plurality of convex portions face each other, and pressing the die onto the principal surface of the resin body in a heated state to form a plurality of concave portions at the principal surface; and a step (B) including, after the step (A), irradiating the principal surface of the resin body with ultraviolet rays.
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Patent Agency Ranking
公开(公告)号：US20210257513A1
公开(公告)日：2021-08-19
申请号：US17232788
申请日：2021-04-16
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
Abstract: A light-emitting device includes a light-emitting element which emits ultraviolet light, and a fluorescent layer provided on the light-emitting element. The fluorescent layer includes fluorescent particles. The fluorescent particles are excited by the ultraviolet light emitted by the light-emitting element and the excited fluorescent particles emit ultraviolet light of a wavelength longer than the ultraviolet light emitted by the light-emitting element.
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公开(公告)号：US20200075802A1
公开(公告)日：2020-03-05
申请号：US16537270
申请日：2019-08-09
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
Abstract: A light-emitting device includes a light-emitting element which emits ultraviolet light, and a fluorescent layer provided on the light-emitting element. The fluorescent layer includes fluorescent particles. The fluorescent particles are excited by the ultraviolet light emitted by the light-emitting element and the excited fluorescent particles emit ultraviolet light of a wavelength longer than the ultraviolet light emitted by the light-emitting element.
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8.发明公开公开(公告)号：US20240170624A1
公开(公告)日：2024-05-23
申请号：US18513504
申请日：2023-11-17
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI
IPC: H01L33/58 , H01L25/075
CPC classification number: H01L33/58 , H01L25/0753 , H01L2933/0058
Abstract: A manufacturing method of an optical member includes: preparing an optical member intermediate having light transmissivity, the optical member intermediate including an upper surface including a peripheral portion and recessed portions recessed from the peripheral portion, the peripheral portion including first regions and second regions, each of the first regions being defined by a circle surrounded by three or more of the recessed portions and passing through a point on an outer edge of each of the three or more of the recess portions in a top view; and irradiating the upper surface of the optical member intermediate with plasma under an atmosphere containing at least one selected from the group consisting of an oxygen radical, CF4, CHF3, and SF6 to make a height of a center of each of the first regions to be higher than a height of each of the second regions.
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公开(公告)号：US20230317896A1
公开(公告)日：2023-10-05
申请号：US18189860
申请日：2023-03-24
Applicant: NICHIA CORPORATION
Inventor： Takashi ISHII , Takayoshi WAKAKI , Naoki MUSASHI
CPC classification number: H01L33/60 , H01L33/505
Abstract: A light-emitting device includes a substrate, a light-emitting element on the substrate, a wavelength conversion member on the light-emitting element and including a first surface, an optical member above the first surface, a light-transmitting layer between the wavelength conversion member and the optical member and having a refractive index lower than a refractive index of the optical member, and a light-reflecting member surrounding the light-emitting element, the wavelength conversion member, the light-transmitting layer, and the optical member. The upper surface of the optical member includes a first region and a second region adjacent to the first region. The first region includes a first exit surface of which internal angle relative to the first surface is a first angle. The second region includes a second exit surface having a second angle narrower than the first angle. The second region is located in one corner region of the optical member.
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公开(公告)号：US20210313495A1
公开(公告)日：2021-10-07
申请号：US17351928
申请日：2021-06-18
Applicant: NICHIA CORPORATION
Inventor： Naoki MUSASHI , Takayoshi WAKAKI
Abstract: A light emitting device includes: a light emitting element having a top surface; and a light-transmissive member covering at least the top surface of the light emitting element, the light-transmissive member having a principal surface located above the top surface of the light emitting element. The principal surface of the light-transmissive member comprises a plurality of concave portions.
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