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公开(公告)号：US20230005895A1
公开(公告)日：2023-01-05
申请号：US17778000
申请日：2020-11-02
Applicant: NICHIA CORPORATION
Inventor： Kenji OZEKI , Kosuke SATO , Chinami NAKAI , Takashi ISHII , Atsushi KOJIMA
Abstract: A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.
A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.-
公开(公告)号：US20200243717A1
公开(公告)日：2020-07-30
申请号：US16751589
申请日：2020-01-24
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Kazuya NAKAO
IPC: H01L33/26
Abstract: A method of manufacturing a light-emitting element including, in the following order, steps of: preparing a wafer on which a semiconductor layer including an light-emission layer is formed; forming a resist film comprising a main body and a protrusion; forming a first metal film; forming a second metal film on the resist film and on the first metal film; pulling the protrusion of the resist film upward by raising and then lowering a temperature of the wafer; forming a third metal film on the second metal film and covering an end of the first metal film by the third metal film; and removing the resist film. In the step of forming the second metal film, the end of the first metal film is exposed from the second metal film.
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公开(公告)号：US20170117442A1
公开(公告)日：2017-04-27
申请号：US15399196
申请日：2017-01-05
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Keiji EMURA
CPC classification number: H01L33/387 , H01L33/06 , H01L33/38
Abstract: A light emitting element has: first and second conductivity type semiconductor layers, first and second electrodes disposed on the same face side of the first and second conductivity type semiconductor layers, respectively. In plan view, the first electrode has a first connecting portion, a first extending portion, and two second extending portions, and the second electrode has a second connecting portion and two third extending portions. The first extending portion of the first electrode extends linearly from the first connecting portion toward the second connecting portion, and the two second extending portions extend parallel to the first extending portion on two sides of the first extending portion. The second extending portions each has two bent portions. The third extending portions extend parallel to the first extending portion between the first extending portion and the two second extending portions.
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公开(公告)号：US20240363807A1
公开(公告)日：2024-10-31
申请号：US18764641
申请日：2024-07-05
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Keiji EMURA
CPC classification number: H01L33/387 , H01L33/06 , H01L33/38
Abstract: A light emitting element includes: a semiconductor structure; first and second electrodes formed above the semiconductor structure. In a plan view: the first electrode consists of a first pad electrode configured to be bonded with a first conductive wire and electrically connected to a first external electrode or a first external terminal, a first extending portion extending from the first pad electrode, and two second extending portions extending from the first pad electrode, the second electrode consists of a second pad electrode configured to be bonded with a second conductive wire and electrically connected to a second external electrode or a second external terminal, and two third extending portions extending from the second pad electrode.
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公开(公告)号：US20180097149A1
公开(公告)日：2018-04-05
申请号：US15835175
申请日：2017-12-07
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Keiji EMURA
CPC classification number: H01L33/387 , H01L33/06 , H01L33/38
Abstract: A light emitting element has semiconductor layers and first and second electrodes disposed. In plan view, the first electrode has a first connecting portion, a first extending portion, and two second extending portions, and the second electrode has a second connecting portion and two third extending portions. The first extending portion of the first electrode extends linearly from the first connecting portion toward the second connecting portion, and the two second extending portions extend parallel to the first extending portion on two sides of the first extending portion. The second extending portions each has two bent portions. The third extending portions extend parallel to the first extending portion between the first extending portion and the second extending portion. With respect to an extending direction of the first extending portion, each of the second extending portions extends beyond a position of the second connecting portion.
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Patent Agency Ranking
公开(公告)号：US20140103379A1
公开(公告)日：2014-04-17
申请号：US14054868
申请日：2013-10-16
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Yoshitaka SUMITOMO , Dai WAKAMATSU , Yoshiyuki AIHARA , Kimihiro MIYAMOTO , Satoshi KINOSHITA
CPC classification number: H01L33/10 , H01L33/005 , H01L33/0095 , H01L33/46 , H01L2924/0002 , H01L2924/00
Abstract: The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer. The second metal layer has an adhesion with respect to the translucent substrate higher than the adhesion between the first metal layer and the translucent substrate.
Abstract translation: 本发明提供了在半透明基板的主表面上具有半导体层的半导体发光器件和与具有半导体层的主表面相对的第二主表面上的反射层，其能够使反射层从 透光性基板被抑制。 半导体发光器件包括与透光性基板的第二主面接触配置的第一金属层，与第一金属的至少第二主面或半透明基板的侧面相接触地设置的第二金属层 层和设置在第二金属层上的第三金属层。 第一金属层相对于从发光层发射的光的峰值波长的反射率高于第二金属层的反射率。 第二金属层相对于透光性基板具有比第一金属层和透光性基板之间的粘合性高的粘接性。
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公开(公告)号：US20230387373A1
公开(公告)日：2023-11-30
申请号：US18320668
申请日：2023-05-19
Applicant: NICHIA CORPORATION
Inventor： Hiroki TOMINAGA , Kosuke SATO
IPC: H01L33/62 , H01L25/075 , H01L23/00
CPC classification number: H01L33/62 , H01L25/0753 , H01L24/32 , H01L24/29 , H01L24/83 , H01L24/30 , H01L2224/29023 , H01L2224/29013 , H01L2224/30131 , H01L2224/32227 , H01L2224/83931 , H01L2933/0066 , H01L2924/12041
Abstract: A method of manufacturing a light emitting module includes: providing an intermediate structure that includes a wiring board having an upper surface and including a metal layer, a first conducting member on the metal layer, and a second conducting member on the metal layer; disposing, on the intermediate structure, a resist layer having openings; providing a light emitting element including a first electrode and a second electrode, and disposing the light emitting element on the resist layer such that the first electrode and the second electrode respectively face the first conducting member and the second conducting member while a portion of an outer periphery of the lower surface of the light emitting element is exposed from the resist layer in the openings; forming a first bonding member on the first conducting member and forming a second bonding member on the second conducting member; and removing the resist layer.
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公开(公告)号：US20210202798A1
公开(公告)日：2021-07-01
申请号：US17200316
申请日：2021-03-12
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Keiji EMURA
Abstract: A light emitting element includes a semiconductor structure, and first and second electrodes. In a plan view, the first electrode has a first connecting portion, and a first extending portion and exactly two second extending portions. The second electrode has a second connecting portion, and exactly two third extending portions. The first extending portion extends linearly from the first electrode connecting portion toward the second electrode connecting portion. Each of the two third extending portions includes a bent portion, and a linear portion located between the first extending portion and a respective one of linear portions of the two second extending portions, and along an imaginary line that extends through the two second extending portions and the two third extending portions in a direction perpendicular to the direction in which the first extending portion extends, an entirety of the second electrode is located inward of the two second extending portions.
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公开(公告)号：US20140183564A1
公开(公告)日：2014-07-03
申请号：US14136610
申请日：2013-12-20
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO
IPC: H01L33/36
CPC classification number: H01L33/36 , H01L33/20 , H01L33/38 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting element includes a first conductivity-type semiconductor layer, a first electrode, a second conductivity-type semiconductor layer and a second electrode. The second conductivity-type semiconductor layer has a square peripheral shape. The first electrode includes a first connecting portion on a first diagonal line and a first extending portion extending from the first connecting portion onto the first diagonal line. The second electrode includes a second connecting portion on the first diagonal line facing the first connecting portion via the first extending portion. Two second extending portions extend from the second connecting portion and having a first portion and a second portion respectively. The first connecting portion includes an end portion closer to the second connecting portion than a straight line intersecting the tip ends of the two second extending portions, and a center portion at a side father from the second connecting portion than the second diagonal line.
Abstract translation: 发光元件包括第一导电型半导体层，第一电极，第二导电型半导体层和第二电极。 第二导电型半导体层具有正方形的周边形状。 第一电极包括第一对角线上的第一连接部分和从第一连接部分延伸到第一对角线上的第一延伸部分。 第二电极包括经由第一延伸部分的面对第一连接部分的第一对角线上的第二连接部分。 两个第二延伸部分分别从第二连接部分延伸并具有第一部分和第二部分。 所述第一连接部包括比所述两个第二延伸部的前端交叉的直线更靠近所述第二连接部的端部，以及比所述第二对角线从所述第二连接部的父侧的中心部。
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公开(公告)号：US20230238489A1
公开(公告)日：2023-07-27
申请号：US18295511
申请日：2023-04-04
Applicant: NICHIA CORPORATION
Inventor： Kosuke SATO , Keiji EMURA
CPC classification number: H01L33/387 , H01L33/38 , H01L33/06
Abstract: A light emitting element includes: a semiconductor structure; first and second electrodes formed above the semiconductor structure; and a protective film. In a plan view: the first electrode has a first connecting portion, a first extending portion, and two second extending portions, the second electrode has a second connecting portion, and two third extending portions, the first extending portion extends linearly in a direction from the first connecting portion toward the second connecting portion, the two second extending portions are located on opposite sides of the first extending portion, respectively, with each of the second extending portions having two bent portions and a linear portion extending parallel to the first extending portion and located between the two bent portions, and the two third extending portions are located between the first extending portion and the two second extending portions, respectively.
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