公开(公告)号：US20150155849A1

公开(公告)日：2015-06-04

申请号：US14513221

申请日：2014-10-14

申请人： NIHON DEMPA KOGYO CO., LTD.

发明人： KENICHI KIKUCHI

IPC分类号： H03H9/17 ,  B23K1/00 ,  H03H9/215

CPC分类号： H03H9/172 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/008 ,  B23K2101/36 ,  H03H9/1014 ,  H03H9/1021 ,  H03H9/215

摘要： A surface mounting quartz crystal unit includes a ceramic substrate, a holding terminal, a metal cover, a signal line terminal and a ground terminal, and a metal layer. The holding terminal holds a crystal resonator on the substrate. The metal cover is arranged to cover the crystal resonator. The signal line terminal and a ground terminal are formed on a rear surface of the substrate. The metal layer bonds the substrate to the metal cover at a part on a front surface of the substrate. The part is in contact with the metal cover. The substrate has a first through via inside the substrate. The first through via connects the holding terminal to the signal line terminal. The substrate has a through conductor at the substrate. The through conductor connects the metal layer to the ground terminal.

摘要翻译： 表面贴装石英晶体单元包括陶瓷基板，保持端子，金属盖，信号线端子和接地端子以及金属层。 保持端子在基板上保持晶体谐振器。 金属盖布置成覆盖晶体谐振器。 信号线端子和接地端子形成在基板的后表面上。 金属层在衬底的前表面上的部分处将衬底粘合到金属覆盖物上。 该部件与金属盖接触。 衬底在衬底内具有第一通孔。 第一通孔将保持端子连接到信号线端子。 基板在基板上具有贯通导体。 贯通导体将金属层连接到接地端子。

公开(公告)号：US20170345993A1

公开(公告)日：2017-11-30

申请号：US15599474

申请日：2017-05-19

申请人： NIHON DEMPA KOGYO CO., LTD.

发明人： KENICHI KIKUCHI

IPC分类号： H01L41/09 ,  H01L41/18 ,  H01L41/08 ,  H01L41/313 ,  H01L41/047

CPC分类号： H01L41/0913 ,  H01L41/0477 ,  H01L41/0815 ,  H01L41/18 ,  H01L41/313 ,  H03H9/0509 ,  H03H9/0533 ,  H03H9/1021 ,  H03H9/17

摘要： A piezoelectric device includes a piezoelectric vibrating piece, a base, a wire, a conductive adhesive, and a buffer layer. The piezoelectric vibrating piece includes excitation electrodes and extraction electrodes at both principal surfaces. The base includes the piezoelectric vibrating piece and a first wiring electrode and a second wiring electrode connected to the extraction electrodes. The wire connects the extraction electrode on a surface opposite to a side of the base among the extraction electrodes to one wiring electrode of the first wiring electrode and the second wiring electrode. The conductive adhesive connects the extraction electrode at the base side among the extraction electrodes to the other wiring electrode among the first wiring electrode and the second wiring electrode. The buffer layer reduces stress of the wire between the extraction electrode to which the wire is connected and the piezoelectric vibrating piece.

公开(公告)号：US20160226466A1

公开(公告)日：2016-08-04

申请号：US15015104

申请日：2016-02-03

申请人： NIHON DEMPA KOGYO CO., LTD.

发明人： TOSHIMASA TSUDA ,  KENICHI KIKUCHI ,  TOMOTAKA KURODA ,  DAISUKE NISHIYAMA ,  HIROYUKI SASAKI ,  MAKOTO HATANO ,  HIROYA ISHIKAWA

IPC分类号： H03H9/10 ,  C22C30/04 ,  B23K35/26 ,  C22C30/02

CPC分类号： B23K35/262 ,  C22C30/02 ,  C22C30/04 ,  H03H9/1021

摘要： A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

摘要翻译： 焊料材料包括至少五种元素的合金，包括Sn，Cu，Sb和In，以及20质量％以下的Ag。 焊料材料的固相线温度高于290℃，焊料的液相线温度为379℃以下，高于固相线温度，液相线温度与固相线温度之间的温差为 70℃以下。