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公开(公告)号：US20240209482A1
公开(公告)日：2024-06-27
申请号：US18286681
申请日：2022-04-13
发明人： Kazutoshi TAKEDA , Shinsuke TAKATANI , Ryu HIRAYAMA , Minako FUKUCHI , Yoshiaki IWASE , Makoto NIWA , Makoto HIRAKAWA
CPC分类号： C22C38/02 , C22C38/04 , C22C38/06 , H01F1/14791 , H01F1/18 , H02K15/024 , H02K1/02
摘要： This electrical steel sheet contains: as a chemical composition, in a unit of mass %, 2.5% to 3.9% of Si; 0.001% to 3.0% of Al; and 0.05% to 5.0% of Mn, the remainder being Fe and impurities, and, on one surface or both surfaces thereof, an insulating coating containing a curing accelerator is formed.
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2.发明公开公开(公告)号：US20240190119A1
公开(公告)日：2024-06-13
申请号：US18286501
申请日：2022-04-13
发明人： Kazutoshi TAKEDA , Shinsuke TAKATANI , Ryu HIRAYAMA , Minako FUKUCHI , Yoshiaki IWASE , Makoto NIWA , Makoto HIRAKAWA
IPC分类号： B32B37/12 , B30B9/28 , B32B7/12 , B32B15/04 , B32B15/18 , B32B37/10 , C09J5/02 , C22C38/02 , C22C38/04 , C22C38/06 , H02K1/02 , H02K15/02
CPC分类号： B32B37/12 , B30B9/28 , B32B7/12 , B32B15/043 , B32B15/18 , B32B37/10 , C09J5/02 , C22C38/02 , C22C38/04 , C22C38/06 , H02K1/02 , H02K15/02 , B32B2309/12 , B32B2311/30 , C22C2202/02
摘要： This bonded and stacked core manufacturing method is for manufacturing a bonded and stacked core by performing press working on a strip-shaped steel sheet with a press working oil applied to one surface or both surfaces thereof, applying an adhesive to one surface of the strip-shaped steel sheet to obtain a plurality of steel sheet components, and stacking and bonding the steel sheet components, in which a curing accelerator having an average viscosity of 0.01 Pa·s to 100 Pa·s is applied to one surface or both surfaces of the strip-shaped steel sheet before the press working oil is applied.
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公开(公告)号：US20210009865A1
公开(公告)日：2021-01-14
申请号：US16978274
申请日：2019-03-01
申请人： TOAGOSEI CO., LTD.
发明人： Yuya OKIMURA , Makoto HIRAKAWA , Masashi YAMADA
IPC分类号： C09J123/26 , C09J123/14 , C09J123/20 , C09J123/08 , C09J151/06 , C09J163/00 , C09J11/06 , B32B15/08 , B32B15/20 , B32B7/12
摘要： Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass % or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass % in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.
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公开(公告)号：US20200079980A1
公开(公告)日：2020-03-12
申请号：US16470767
申请日：2017-12-15
申请人： TOAGOSEI CO., LTD.
发明人： Makoto HIRAKAWA , Masashi YAMADA
IPC分类号： C09J151/06 , C09J123/10 , C09J163/04 , C08K5/544 , C08K5/00 , C08K5/09 , C08K5/49 , C08K3/013 , C08K3/04 , C08K3/08 , C09J7/00 , B32B15/088
摘要： The present invention is an adhesive composition that is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin with use of a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds.
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5.发明申请公开(公告)号：US20190256750A1
公开(公告)日：2019-08-22
申请号：US16314713
申请日：2017-07-03
申请人： TOAGOSEI CO., LTD.
发明人： Makoto HIRAKAWA , Masashi YAMADA , Anna SEKIOKA
IPC分类号： C09J177/00 , C09J11/06 , C09J163/00 , B32B15/08 , B32B15/20
摘要： An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25° C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).
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公开(公告)号：US20220411630A1
公开(公告)日：2022-12-29
申请号：US17778985
申请日：2020-11-25
申请人： TOAGOSEI CO., LTD.
IPC分类号： C08L75/06 , C08L63/04 , B32B15/095 , B32B15/092 , B32B15/20
摘要： A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.
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公开(公告)号：US20220306859A1
公开(公告)日：2022-09-29
申请号：US17605715
申请日：2020-04-15
申请人： TOAGOSEI CO., LTD.
发明人： Yuya OKIMURA , Masahiro TORII , Makoto HIRAKAWA , Masashi YAMADA
摘要： Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyamide resin (C); as well as a bonding film, a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.
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公开(公告)号：US20220259427A1
公开(公告)日：2022-08-18
申请号：US17621882
申请日：2020-06-23
申请人： TOAGOSEI CO., LTD
发明人： Yuya OKIMURA , Masahiro TORII , Makoto HIRAKAWA , Masashi YAMADA
IPC分类号： C08L75/06 , C08L23/26 , C09D175/06
摘要： Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyolefin resin (C); as well as a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.
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公开(公告)号：US20210384574A1
公开(公告)日：2021-12-09
申请号：US17288345
申请日：2019-10-29
申请人： TOAGOSEI CO., LTD.
发明人： Takahiro ITO , Makoto HIRAKAWA , Hideki HIRAOKA
IPC分类号： H01M50/129 , C08F255/02 , C09J151/06 , C09J11/06 , H01M10/0525
摘要： An adhesive composition including: an organic solvent; (A) a polyolefin that has an acid anhydride group and that is soluble in the organic solvent; and a cross-linking agent, in which a ring-opening ratio of an anhydrous ring of the acid anhydride group in (A) the polyolefin is from 0 to 60%, and a thermally fusible member using the same.
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公开(公告)号：US20210317348A1
公开(公告)日：2021-10-14
申请号：US17272502
申请日：2019-09-03
申请人： TOAGOSEI CO., LTD.
发明人： Takahiro ITOU , Makoto HIRAKAWA
IPC分类号： C09J123/26 , C09J11/06 , B32B15/08 , B32B7/12 , H01M50/124 , H01M10/0525
摘要： An adhesive composition, comprising: an organic solvent; (A) a polyolefin that has an acidic group and/or an acid anhydride group and that is soluble in the organic solvent; and an isocyanate compound, wherein the isocyanate compound is (B) an isocyanate compound having an alicyclic structure, and/or a derivative thereof.
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