公开(公告)号：US20170297302A1

公开(公告)日：2017-10-19

申请号：US15513905

申请日：2015-08-07

申请人： TOAGOSEI CO., LTD.

发明人： Yuya OKIMURA ,  Masashi YAMADA

IPC分类号： B32B7/12 ,  B32B27/06 ,  B32B27/32 ,  B32B27/38 ,  C09J7/02 ,  H01B3/40 ,  H01B3/44 ,  H01B7/04 ,  H01B7/08 ,  H05K1/03 ,  B32B15/20 ,  H01B1/02 ,  H05K1/09 ,  C09J123/26

摘要： An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

公开(公告)号：US20210009865A1

公开(公告)日：2021-01-14

申请号：US16978274

申请日：2019-03-01

申请人： TOAGOSEI CO., LTD.

发明人： Yuya OKIMURA ,  Makoto HIRAKAWA ,  Masashi YAMADA

IPC分类号： C09J123/26 ,  C09J123/14 ,  C09J123/20 ,  C09J123/08 ,  C09J151/06 ,  C09J163/00 ,  C09J11/06 ,  B32B15/08 ,  B32B15/20 ,  B32B7/12

摘要： Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass % or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass % in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

公开(公告)号：US20160222192A1

公开(公告)日：2016-08-04

申请号：US15022630

申请日：2014-09-08

申请人： TOAGOSEI CO., LTD.

发明人： Masaru TAKASHIMA ,  Yuya OKIMURA ,  Mesashi YAMADA

IPC分类号： C08K5/5357 ,  H05K1/02 ,  H05K3/46 ,  C09J153/00 ,  C09J7/02

CPC分类号： C08K5/5357 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2405/00 ,  C08K5/0066 ,  C08K5/5317 ,  C09J7/22 ,  C09J7/25 ,  C09J7/30 ,  C09J109/02 ,  C09J109/06 ,  C09J153/005 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2453/00 ,  C09J2477/006 ,  C09J2479/086 ,  H05K1/02 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/305 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/012

摘要： The flame-retardant adhesive composition contains a styrene-based elastomer containing a carboxyl group, an epoxy resin, and a phosphorus-containing oligomer including a structural unit represented by general formula (1), and the epoxy resin content is 1-20 parts by mass and the phosphorus-containing oligomer content is 10-50 parts by mass with respect to 100 parts by mass of the styrene-based elastomer containing carboxyl groups. (wherein, R1 and R2 are each independently a hydrogen atom or a methyl group, n is an integer of 1-20.)

摘要翻译： 阻燃性粘合剂组合物含有含有羧基的苯乙烯系弹性体，环氧树脂和含有通式（1）表示的结构单元的含磷低聚物，环氧树脂含量为1-20份 相对于含有羧基的苯乙烯系弹性体100质量份，含磷低聚物含量为10〜50质量份。 （其中，R 1和R 2各自独立地为氢原子或甲基，n为1-20的整数。）

公开(公告)号：US20220411630A1

公开(公告)日：2022-12-29

申请号：US17778985

申请日：2020-11-25

申请人： TOAGOSEI CO., LTD.

发明人： Masahiro TORII ,  Yuya OKIMURA ,  Hironori KUTSUNA ,  Makoto HIRAKAWA ,  Masashi YAMADA

IPC分类号： C08L75/06 ,  C08L63/04 ,  B32B15/095 ,  B32B15/092 ,  B32B15/20

摘要： A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.

公开(公告)号：US20220306859A1

公开(公告)日：2022-09-29

申请号：US17605715

申请日：2020-04-15

申请人： TOAGOSEI CO., LTD.

发明人： Yuya OKIMURA ,  Masahiro TORII ,  Makoto HIRAKAWA ,  Masashi YAMADA

IPC分类号： C08L75/06 ,  C08L63/04 ,  C08L77/06 ,  C08G59/24

摘要： Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyamide resin (C); as well as a bonding film, a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.

公开(公告)号：US20220259427A1

公开(公告)日：2022-08-18

申请号：US17621882

申请日：2020-06-23

申请人： TOAGOSEI CO., LTD

发明人： Yuya OKIMURA ,  Masahiro TORII ,  Makoto HIRAKAWA ,  Masashi YAMADA

IPC分类号： C08L75/06 ,  C08L23/26 ,  C09D175/06

摘要： Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyolefin resin (C); as well as a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.

公开(公告)号：US20170259544A1

公开(公告)日：2017-09-14

申请号：US15329890

申请日：2015-07-21

申请人： TOAGOSEI CO., LTD.

发明人： Yuya OKIMURA ,  Masashi YAMADA

IPC分类号： B32B27/38 ,  B32B27/32 ,  H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  B32B7/12 ,  C09J7/02

CPC分类号： B32B27/38 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/12 ,  B32B15/20 ,  B32B25/08 ,  B32B27/00 ,  B32B27/08 ,  B32B27/10 ,  B32B27/28 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2255/10 ,  B32B2255/12 ,  B32B2255/26 ,  B32B2307/204 ,  B32B2307/546 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2309/105 ,  B32B2457/08 ,  C08L25/06 ,  C08L53/025 ,  C08L63/00 ,  C09J7/35 ,  C09J125/06 ,  C09J125/10 ,  C09J153/025 ,  C09J163/00 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2400/163 ,  C09J2425/00 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2479/086 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0158

摘要： A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.