公开(公告)号：US20140004635A1

公开(公告)日：2014-01-02

申请号：US13915988

申请日：2013-06-12

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu TAKAHASHI ,  Shinya AKIZUKI ,  Toshimasa SUGIMURA ,  Takeshi MATSUMURA ,  Daisuke UENDA

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L21/6836 ,  H01L33/0079 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2933/0025

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes:forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; andattaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.

Abstract translation: 根据本发明的实施例的制造LED的方法包括：在基板的一个表面上的包括基板和发光元件的LED晶片的基板的外侧上形成反射层; 并且在形成反射层之前将耐热压敏粘合片附着在发光元件的外侧上。

公开(公告)号：US20140000793A1

公开(公告)日：2014-01-02

申请号：US13913807

申请日：2013-06-10

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu TAKAHASHI ,  Shinya AKIZUKI ,  Toshimasa SUGIMURA ,  Takeshi MATSUMURA ,  Daisuke UENDA

IPC: H01L33/00

CPC classification number: H01L33/005 ,  H01L21/6836 ,  H01L24/27 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/27

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.

Abstract translation: 根据本发明的实施例的制造LED的方法包括对包括发光元件和基板的LED晶片的基板进行背面磨削，其中所述后研磨包括经由双层结构将LED晶片固定到工作台上， 双面压敏粘合片，然后研磨基材。

公开(公告)号：US20140004636A1

公开(公告)日：2014-01-02

申请号：US13917135

申请日：2013-06-13

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu TAKAHASHI ,  Shinya AKIZUKI ,  Toshimasa SUGIMURA ,  Takeshi MATSUMURA ,  Daisuke UENDA

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.

Abstract translation: 一种制造LED的方法，包括：背面研磨包括发光元件和所述基板的LED晶片的基板; 并且在后磨削之前和在后研磨中研磨基底之后，将保护片附接到LED晶片。

公开(公告)号：US20140106133A1

公开(公告)日：2014-04-17

申请号：US14051120

申请日：2013-10-10

Applicant: NITTO DENKO CORPORATION

Inventor： Tsuyoshi Torinari ,  Eiji Toyoda ,  Yusaku Shimizu ,  Daisuke UENDA

IPC: B32B27/08 ,  B32B27/36 ,  B32B27/38

CPC classification number: B32B27/08 ,  B32B7/06 ,  B32B27/36 ,  B32B27/38 ,  B32B2307/30 ,  B32B2307/584 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2571/00 ,  C09J7/29 ,  Y10T428/24752 ,  Y10T428/31515

Abstract: An object of the invention is to prevent staining of processing equipment by a resin originated from a resin sheet during pressing. The present invention achieves the object by a laminate having a support, a resin sheet that is laminated on a part of the support, and a release sheet that is laminated on the resin sheet, in which a peel force F1 between the support and the resin sheet is larger than a peel force F2 between the resin sheet and the release sheet.

Abstract translation: 本发明的目的是防止在压制期间由树脂片产生的树脂对加工设备造成污染。 本发明通过具有支撑体的层叠体，层叠在支撑体的一部分上的树脂片和层叠在树脂片上的剥离片来实现目的，其中支撑体和树脂之间的剥离力F1 片材大于树脂片材和剥离片材之间的剥离力F2。

公开(公告)号：US20140090199A1

公开(公告)日：2014-04-03

申请号：US14038836

申请日：2013-09-27

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshio TERADA ,  Makoto NAMIKAWA ,  Daisuke UENDA ,  Asami FUNATSU

IPC: B08B1/00

CPC classification number: B08B1/006 ,  B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  C11D3/162 ,  C11D17/049 ,  H05K3/26

Abstract: A cleaning sheet comprising a cleaning layer and a releasable protective film laminated on the cleaning layer, wherein each of the relative intensities of the fragment ions of CH3Si+, C3H9Si+, C5H15Si2O+, C5H15Si3O3+, C7H21Si3O2+, CH3SiO−, CH3SiO2− and Si+ in the cleaning layer, when the protective film is peeled off the cleaning layer, is 0.1 or less according to time-of-flight secondary ion mass spectrometry, relative to C2H3+ in the case of positive ion or O− in the case of negative ion.

Abstract translation: 一种清洁片，其包括层压在所述清洁层上的清洁层和可释放保护膜，其中所述清洁层中的CH 3 Si +，C 3 H 9 Si +，C 5 H 15 Si 2 O +，C 5 H 15 Si 3 O 3 +，C 7 H 21 Si 3 O 2 +，CH 3 SiO - ，CH 3 SiO 2 - 和Si +的碎片离子的相对强度 当保护膜从清洁层剥离时，根据飞行时间二次离子质谱法，在负离子情况下相对于C2H3 +为0.1或更小，在负离子的情况下为0.1。

公开(公告)号：US20140090196A1

公开(公告)日：2014-04-03

申请号：US14039286

申请日：2013-09-27

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshio TERADA ,  Makoto NAMIKAWA ,  Daisuke UENDA ,  Asami FUNATSU

IPC: C11D17/04

CPC classification number: B08B1/006 ,  B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  C11D3/162 ,  C11D17/049 ,  H05K3/26

Abstract: A cleaning sheet comprising a cleaning layer and a releasable protective film laminated on the cleaning layer, wherein each of the relative intensities of the fragment ions Of CH3Si+, C3H9Si+, C5H15Si2O+, C5H15Si3O3+, CH3SiO−, CH3SiO2− and Si+ in the cleaning layer, when the protective film is peeled off the cleaning layer, is 0.1 or less according to time-of-flight secondary ion mass spectrometry, relative to C2H3+ in the case of positive ion or O− in the case of negative ion.

Abstract translation: 一种清洁片，其包括层压在所述清洁层上的清洁层和可释放保护膜，其中所述清洁层中的CH 3 Si +，C 3 H 9 Si +，C 5 H 15 Si 2 O +，C 5 H 15 Si 3 O 3 +，CH 3 SiO - ，CH 3 SiO 2 - 和Si +的碎片离子的每个相对强度 根据飞行时间二次离子质谱法，保护膜从清洁层剥离，相对于C2H3 +，在负离子的情况下，为0.1以下，在负离子的情况下为O。