公开(公告)号：US10525668B2

公开(公告)日：2020-01-07

申请号：US15445061

申请日：2017-02-28

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji Furuta ,  Yoshio Terada ,  Tadashi Takahashi ,  Mitsuhiro Kanada

IPC: B32B7/12 ,  B32B27/36 ,  B32B37/12 ,  C09J133/06 ,  C09J7/38 ,  C09J7/22 ,  C09J7/29 ,  C09J7/28 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/12 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32

Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.

公开(公告)号：US20130267623A1

公开(公告)日：2013-10-10

申请号：US13908275

申请日：2013-06-03

Applicant: NITTO DENKO CORPORATION

Inventor： Hironori Yasuda ,  Takayuki Yamamoto ,  Mitsuhiro Kanada ,  Kaori Ozawa

IPC: C08L75/06 ,  C08L33/20 ,  C08J9/36 ,  C08L33/00

CPC classification number: C08L75/06 ,  B29C35/0805 ,  B29C2035/0833 ,  B29K2105/04 ,  C08J9/0061 ,  C08J9/122 ,  C08J9/36 ,  C08J2201/024 ,  C08J2201/032 ,  C08J2203/08 ,  C08J2375/04 ,  C08J2475/00 ,  C08L33/00 ,  C08L33/20 ,  Y10T428/249953

Abstract: Disclosed is a thermoplastic resin foam which is obtained by subjecting a thermoplastic resin composition containing a thermoplastic elastomer and an active-energy-ray-curable resin to foam molding to give a foamed structure, and irradiating the foamed structure with an active energy ray to allow the active-energy-ray-curable resin to form a cross-linked structure in the foamed structure. Also disclosed is a thermoplastic resin foam which is obtained by subjecting a thermoplastic resin composition containing a thermoplastic elastomer, an active-energy-ray-curable resin, and a thermal cross-linking agent to foam molding to give a foamed structure, irradiating the foamed structure with an active energy ray to allow the active-energy-ray-curable resin to form a cross-linked structure in the foamed structure, and heating the resulting foamed structure bearing the cross-linked structure to thereby allow the thermal cross-linking agent to form another cross-linked structure in the foamed structure.

Abstract translation: 公开了一种热塑性树脂发泡体，其通过使含有热塑性弹性体的热塑性树脂组合物和活性能量射线固化树脂进行发泡成型以得到发泡结构，并且通过活性能量射线照射发泡结构体来获得， 活性能量射线固化树脂，以在发泡结构中形成交联结构。 还公开了一种热塑性树脂泡沫体，其通过使包含热塑性弹性体的热塑性树脂组合物，活性能量射线固化树脂和热交联剂进行发泡成型以得到发泡结构，照射发泡 具有活性能量射线的结构，以使活性能量射线固化树脂在发泡结构中形成交联结构，并加热所得到的具有交联结构的发泡结构，从而允许热交联剂 以在泡沫结构中形成另一种交联结构。

公开(公告)号：US11565238B2

公开(公告)日：2023-01-31

申请号：US16603388

申请日：2018-01-22

Applicant: NITTO DENKO CORPORATION

Inventor： Toru Iseki ,  Kohei Doi ,  Mitsuhiro Kanada ,  Kazumichi Kato ,  Hideyuki Tokuyama

IPC: B01J20/26 ,  C09J7/10 ,  B01J20/28 ,  B01J20/30 ,  H01L21/683

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as −40° C., 23° C., or 125° C. is represented by V1 (N/1 cm□), V2 (N/1 cm□), or V3 (N/1 cm□) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (−40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm□), H2 (N/1 cm□), or H3 (N/1 cm□), relationships of V1