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公开(公告)号：US20170352142A1
公开(公告)日：2017-12-07
申请号：US15605292
申请日：2017-05-25
发明人： Hideo TSUCHIYA
摘要： An inspection method according to the embodiments includes applying light of a light source to an inspection target; receiving light from the inspection target to obtain a first image of the inspection target by a sensor; based on an image of a first pattern comprising repetitive patterns unresolvable with a wavelength of the light source in the first image, calculating a deviation of luminance values with respect to each of first regions in the first pattern by a processor; obtaining a second image of the inspection target by the sensor; correcting luminance values of the second image by the processor based on the deviations of the luminance values; and comparing the repetitive patterns of the corrected second image with each other by a comparer.
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公开(公告)号：US20180045656A1
公开(公告)日：2018-02-15
申请号：US15724614
申请日：2017-10-04
发明人： Hideo TSUCHIYA , Riki OGAWA
IPC分类号： G01N21/956 , G06T3/60 , G01N21/95 , G06T7/00
CPC分类号： G01N21/956 , G01N21/9501 , G06T3/60 , G06T7/0004 , G06T7/0008 , G06T2200/24 , G06T2207/10004 , G06T2207/10056 , G06T2207/10148 , G06T2207/30144 , G06T2207/30148 , G06T2207/30204
摘要： Disclosed is a template substrate for use in adjusting a focus offset to detect a defect using an optical image obtained by irradiating a substrate with light emitted from a light source. The template substrate includes a first pattern constructed with a repetitive pattern that is not resolved by the wavelength of the light source, and at least one alignment mark that is arranged on the same plane as the first pattern. The alignment mark includes a second pattern constructed with a repetitive pattern that is not resolved by the wavelength of the light source, and a programmed defect that is provided in the second pattern and not resolved by the wavelength of the light source. The alignment mark includes the second pattern, and a region, where the second pattern is not arranged but a mark used in alignment is formed by contrast with a region where the second pattern is arranged.
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公开(公告)号：US20150279024A1
公开(公告)日：2015-10-01
申请号：US14208757
申请日：2014-03-13
发明人： Hideo TSUCHIYA , Manabu ISOBE , Hiroteru AKIYAMA , Makoto YABE , Takafumi INOUE , Nobutaka KIKUIRI
CPC分类号： G06T7/0006 , G01N21/95607 , G01N2021/95615 , G03F1/84 , G03F7/7065 , G06K9/6215 , G06T7/0008 , G06T7/001 , G06T7/74 , G06T2200/24 , G06T2207/30108 , G06T2207/30148 , G06T2207/30168
摘要： An inspection method comprising, virtually dividing a sample, in which a plurality of chip patterns are formed, into a plurality of strip-shaped stripes along a predetermined direction to acquire an optical image of the chip pattern in each of the stripes, performing filtering based on design data of the chip pattern to produce a reference image corresponding to the optical image, comparing the chip pattern using a die-to-database method and comparing a repetitive pattern portion in the chip pattern using a cell method, obtaining at least one of a dimension difference and a dimension ratio between a pattern of the optical image and a pattern of the reference image compared to the pattern of the optical image by the die-to-database method; and obtaining a dimension distribution of the plurality of chip patterns from at least one of the dimension difference and the dimension ratio.
摘要翻译： 一种检查方法，其特征在于，沿着规定的方向，将形成有多个芯片图案的样品实际上分割为多个条状条，从而获得每个条纹中的芯片图案的光学图像， 对所述芯片图案的设计数据进行编码以产生与所述光学图像相对应的参考图像，使用芯片到数据库方法比较所述芯片图案，并使用单元方法比较所述芯片图案中的重复图案部分，获得至少一个 通过模 - 数据库方法与光学图像的图案相比，光学图像的图案和参考图像的图案之间的尺寸差和尺寸比; 以及从所述尺寸差和尺寸比中的至少一个获得所述多个芯片图案的尺寸分布。
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公开(公告)号：US20160305892A1
公开(公告)日：2016-10-20
申请号：US15096313
申请日：2016-04-12
发明人： Hideo TSUCHIYA
IPC分类号： G01N21/956 , G01N21/95 , G06T7/00
CPC分类号： G01N21/956 , G01N21/9501 , G01N2021/95676 , G01N2201/067 , G06T7/001 , G06T2207/10148 , G06T2207/30148
摘要： An inspection method for inspecting a substrate by using an optical image obtained by irradiating the substrate with light from a light source through an optical unit, and causing the light reflected by the substrate to be incident to a sensor, includes adjusting a focus offset value such that a focal distance for setting the signal-to-noise ratio of a programmed defect to the maximum level, is obtained by acquiring the optical image while changing a focal distance between the surface in which a first pattern is provided and the optical unit. The substrate includes the first pattern, a second pattern on the same plane as the first pattern, the programmed defect in the second pattern, and a third pattern on the same plane as the first pattern. The existence of a defect is detected by acquiring the optical image of the first pattern after the focus offset is adjusted.
摘要翻译： 一种用于通过使用通过光学单元从光源照射基板而获得的光学图像并使由基板反射的光入射到传感器的光学图像来检查基板的检查方法包括： 通过在改变其中提供第一图案的表面与光学单元之间的焦距的同时获取光学图像来获得用于将编程缺陷的信噪比设置为最大电平的焦距。 衬底包括第一图案，在与第一图案相同的平面上的第二图案，第二图案中的编程缺陷以及与第一图案在同一平面上的第三图案。 通过在调整聚焦偏移之后获取第一图案的光学图像来检测缺陷的存在。
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公开(公告)号：US20160171674A1
公开(公告)日：2016-06-16
申请号：US14953993
申请日：2015-11-30
发明人： Hideo TSUCHIYA , Nobutaka KIKUIRI
CPC分类号： G06T7/001 , G06K9/036 , G06T2207/30148
摘要： An inspection apparatus according to embodiments includes a lightening unit, an imaging unit, a first storage unit, a comparison unit, and a first determination unit. The lighting unit irradiates a sample including a defect to be inspected with a lighting light. The imaging unit obtains an optical image formed by the lightening light transmitted through or reflected by the sample to be inspected. The first storage unit stores information on a defect correction method for the defect. The comparison unit compares the optical image and a reference image based on the information on the defect correction method. The first determination unit determines, based on a comparison result by the comparison unit and the information on the defect correction method, whether correction of the defect is appropriate.
摘要翻译： 根据实施例的检查装置包括发光单元，成像单元，第一存储单元，比较单元和第一确定单元。 照明单元用照明光照射包含要检查的缺陷的样品。 成像单元获得通过被检测样品透射或反射的发光光形成的光学图像。 第一存储单元存储关于缺陷的缺陷校正方法的信息。 比较单元基于关于缺陷校正方法的信息来比较光学图像和参考图像。 第一确定单元基于比较单元的比较结果和关于缺陷校正方法的信息，确定缺陷的校正是否合适。
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6.发明申请MASK INSPECTION APPARATUS, MASK EVALUATION METHOD AND MASK EVALUATION SYSTEM 有权屏蔽检查装置，掩蔽评估方法和掩蔽评估系统公开(公告)号：US20150379707A1
公开(公告)日：2015-12-31
申请号：US14748967
申请日：2015-06-24
发明人： Hideo TSUCHIYA , Nobutaka Kikuiri , Ikunao Isomura
CPC分类号： G06K9/6218 , G06T7/001 , G06T2207/30148
摘要： A mask inspection apparatus includes an optical image acquisition unit configured to acquire an optical image by irradiating light on a mask, a reference image generation unit configured to generate a reference image from design data of the mask, a comparison circuit configured to compare the optical image with the reference image, a pattern data extraction unit configured to obtain coordinates of a defective portion determined to be defective by the comparison unit and to extract, from the design data, pattern data of a predetermined dimension range including the coordinates, and an interface unit configured to supply an aerial image measurement apparatus with information associated with the defect, the information including the defect coordinates and the extracted pattern data.
摘要翻译： 掩模检查装置包括：光学图像获取单元，被配置为通过在掩模上照射光来获取光学图像;参考图像生成单元，被配置为从掩模的设计数据生成参考图像;比较电路，被配置为比较光学图像 利用参考图像，图案数据提取单元，被配置为获得由比较单元确定为有缺陷的缺陷部分的坐标，并从设计数据中提取包括坐标的预定尺寸范围的图案数据，以及接口单元 配置为向空间图像测量装置提供与缺陷相关联的信息，该信息包括缺陷坐标和提取的图案数据。
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公开(公告)号：US20140314304A1
公开(公告)日：2014-10-23
申请号：US14255014
申请日：2014-04-17
发明人： Takafumi INOUE , Hideo TSUCHIYA
IPC分类号： G06T7/00
CPC分类号： G06T7/001 , G06T2207/10061 , G06T2207/20021 , G06T2207/30141
摘要： In accordance with one aspect of this invention, a pattern inspection apparatus includes an optical image acquisition unit configured to acquire optical images regarding dies of a target object to be inspected on which the dies having a same pattern formed therein is arranged; a sub-optical image division unit configured to divide an optical image of the optical images regarding a die of the dies positioned in a non-resolved pattern region into sub-optical images using non-resolved pattern region information capable of recognizing the non-resolved pattern region in which a non-resolved pattern that is not resolved is formed; a first comparison unit configured to compare the sub-optical images divided from the optical image of the same die regarding the non-resolved pattern region pixel by pixel; and a second comparison unit configured to compare optical images of the optical images regarding different dies of the dies pixel by pixel.
摘要翻译： 根据本发明的一个方面，一种图案检查装置包括光学图像获取单元，被配置为获取关于其上布置有具有相同图案的模具的被检查对象物体的模具的光学图像; 子光学图像分割单元，被配置为使用能够识别未解析图案区域的未解析图案区域信息，将位于未分辨图案区域中的模具的模具的光学图像的光学图像分割为子光学图像 形成未解析的未解析图案的图案区域; 第一比较单元，被配置为比较从相同裸片的光学图像划分的子光学图像关于未分辨图案区域逐个像素; 以及第二比较单元，被配置为比较针对所述管芯的不同管芯的光学图像的光学图像。
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公开(公告)号：US20190279348A1
公开(公告)日：2019-09-12
申请号：US16271909
申请日：2019-02-11
IPC分类号： G06T7/00 , G01N21/956 , G06T5/50
摘要： Provided is a pattern inspection method including: irradiating a substrate with an electron beam, a pattern being formed on the substrate; acquiring an inspection image as a secondary electron image of the pattern; setting a pixel value equal to or less than a first threshold value minus a half of a predetermined detection width of the inspection image and a pixel value equal to or more than the first threshold value plus a half of the predetermined detection width of the inspection image to unprocessed; acquiring a difference image between the inspection image having the pixel value having less than the first threshold value minus the half of the predetermined detection width and the pixel value having more of the first threshold value plus the half of the predetermined detection width being set to unprocessed and a reference image of the inspection image; and performing inspection on the basis of the difference image.
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公开(公告)号：US20190277782A1
公开(公告)日：2019-09-12
申请号：US16292466
申请日：2019-03-05
IPC分类号： G01N23/2251 , G01N23/2206
摘要： An electron beam inspection apparatus includes an acquisition processing circuitry to acquire surface material information presenting a surface material of the substrate and a value of an acceleration voltage of an electron beam; a sequence determination processing circuitry to determine a scan sequence of a plurality of stripe regions on the basis of the surface material of the substrate and the value of the acceleration voltage, the plurality of stripe regions obtained by virtually dividing an inspection region of the substrate in a stripe shape; a secondary electron image acquisition mechanism including a detector for detecting a secondary electron and configured to scan the plurality of stripe regions of the substrate according to a determined scan sequence and to acquire a secondary electron image of the substrate; and a comparison processing circuitry to compare the secondary electron image with a corresponding reference image.
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公开(公告)号：US20180261424A1
公开(公告)日：2018-09-13
申请号：US15913083
申请日：2018-03-06
发明人： Hideo TSUCHIYA
IPC分类号： H01J37/22 , H01J37/244
CPC分类号： H01J37/222 , H01J37/20 , H01J37/244 , H01J37/28 , H01J2237/20228 , H01J2237/2448 , H01J2237/2817
摘要： An electron beam inspection apparatus includes an analyzing circuit to input design pattern data of design pattern of a semiconductor element, and specify a position of a pattern portion including a feature point, which has previously been set, by analyzing the design pattern data; and a comparison circuit to input information on a specified position of the pattern portion including the feature point, and determine by comparing a secondary electron image and a design substrate pattern image of a region corresponding to the secondary electron image while varying a determine threshold value for the pattern portion including the feature point by using the information.
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