公开(公告)号：US20150171042A1

公开(公告)日：2015-06-18

申请号：US14566309

申请日：2014-12-10

Applicant: NXP B.V.

Inventor： Hendrik Bouman ,  Roel Daamen ,  Coenraad Tak

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/17 ,  G01D11/245 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2924/0132 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/146 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A sensor package comprises a sensor chip bonded to an intermediate carrier, with the sensor element over an opening in the carrier. The package is for soldering to a board, during which the intermediate carrier protects the sensor part of the sensor chip.

Abstract translation: 传感器组件包括粘结到中间载体的传感器芯片，传感器元件位于载体的开口上。 该封装用于焊接到电路板，在此期间，中间载体保护传感器芯片的传感器部分。