Process for the preparation of powder coating compositions
    5.
    发明授权
    Process for the preparation of powder coating compositions 失效
    粉末涂料组合物的制备方法

    公开(公告)号:US06828363B2

    公开(公告)日:2004-12-07

    申请号:US09935619

    申请日:2001-08-23

    IPC分类号: C08K300

    摘要: The invention relates to a method of preparation for polymers, particularly binders for powder coatings and powder coatings which are prepared as a solution in a supercritical fluid phase. Binders for powder coatings are prepared from at least two ethylenically unsaturated monomers capable of free-radical or ionic copolymerization, and conventional initiators and regulators in supercritical fluids, whereby polymerization is carried out in the homogeneous phase, and, after the reaction has ended, either the composition or the phase parameters of the mixture are altered so that at least two phases with supercritical fluid are obtained, and the phase containing predominantly polymer is separated and the polymer is separated as a powder from the sc fluid by depressurization or the polymer phase is further processed under supercritical phase conditions to the powder coating.

    摘要翻译: 本发明涉及一种制备聚合物的方法,特别是制备为超临界流体相中溶液的粉末涂料和粉末涂料的粘合剂。 用于粉末涂料的粘合剂由至少两种能够进行自由基或离子共聚的烯键式不饱和单体和超临界流体中的常规引发剂和调节剂制备,其中聚合在均相中进行,反应结束后, 改变混合物的组成或相参数,使得获得具有超临界流体的至少两相,并且主要包含聚合物的相分离,并且通过减压将聚合物作为粉末与sc流体分离,或者聚合物相是 在超临界相条件下进一步加工成粉末涂料。

    Pressfit contact for connecting an electronic component to a circuit board and pressfit tool and method for producing a pressfit contact
    10.
    发明授权
    Pressfit contact for connecting an electronic component to a circuit board and pressfit tool and method for producing a pressfit contact 有权
    用于将电子部件连接到电路板的冲压接点和用于生产压接触头的压配工具和方法

    公开(公告)号:US08579638B2

    公开(公告)日:2013-11-12

    申请号:US13377504

    申请日:2010-06-09

    IPC分类号: H01R12/00

    摘要: A press-in contact and a press-in tool for connecting an electronic component to a printed circuit board, the press-in contact of the electronic component being pressed into a contact opening of the printed circuit board by the press-in tool. Also a method for producing a press-in contact. The press-in contact includes at least one guide region which can be received in a guide contour of the press-in tool in a position-fixing manner. The maximum length of the guide region is a multiple of the maximum width or is substantially equal to or only slightly shorter than the maximum width and/or the guide region is highly rigid in the press-in direction (z direction) and flexible in the other directions (x/y directions). The method according to the invention is characterized in that contiguous, interlinked contours of the press-in contacts, which contours are produced as a ribbon or band, are supplied to a separating station and are separated at predetermined separation points into individual press-in contacts.

    摘要翻译: 一种用于将电子部件连接到印刷电路板的压入式接触件和压入式工具,电子部件的压入接触被压入工具压入印刷电路板的接触开口。 还有一种制造压入式接触的方法。 压入式触头包括至少一个引导区域,该引导区域可以以定位方式容纳在压入工具的引导轮廓中。 引导区域的最大长度是最大宽度的倍数,或者基本上等于或稍短于最大宽度,和/或引导区域在压入方向(z方向)上是高度刚性的,并且在 其他方向(x / y方向)。 根据本发明的方法的特征在于,将形成为带状或带状的轮廓的压入式触点的连续的相互连接的轮廓提供给分离站,并在预定的分离点处分离成单独的压入触点 。