THERMOBONDABLE POLYESTER FILM, PROCESS FOR PRODUCTION OF IC CARDS OR IC TAGS WITH THE SAME, AND IC CARDS WITH IC TAGS
    5.
    发明申请
    THERMOBONDABLE POLYESTER FILM, PROCESS FOR PRODUCTION OF IC CARDS OR IC TAGS WITH THE SAME, AND IC CARDS WITH IC TAGS 审中-公开
    可热熔聚酯薄膜,用于生产IC卡或IC标签的方法,以及带有IC标签的IC卡

    公开(公告)号:US20090032602A1

    公开(公告)日:2009-02-05

    申请号:US11912810

    申请日:2006-04-28

    IPC分类号: B32B7/12 G06K19/02

    摘要: [Summary] [Problem] Provision of a thermoadhesive polyester film having improved thermal adhesiveness and ruggedness absorbability and sliding quality while maintaining environmental suitability (halogen-free), heat resistance, and chemical resistance as a plastic material that constitutes IC cards or IC tags. [Solving Means] A thermoadhesive polyester film wherein a thermoadhesive layer is laminated on one face or both faces of a biaxially stretched polyester film, the thermoadhesive layer having a thickness of 5 to 30 μm, consisting of a mixture of a non-crystalline polyester resin A having a glass transition temperature of 50 to 95° C. and a thermoplastic resin B incompatible therewith, the thermoplastic resin B being any of (a) a crystalline resin having a melting point of 50 to 180° C., (b) a non-crystalline resin having a glass transition temperature of −50 to 150° C., and (c) a mixture thereof, and contained at 1 to 30% by mass in the thermoadhesive layer.

    摘要翻译: 发明内容提供一种具有改进的热粘合性和坚固性吸收性和滑动质量的热粘合性聚酯膜,同时保持构成IC卡或IC标签的塑料材料的环境适应性(无卤素),耐热性和耐化学性。 [解决方案]一种热粘合性聚酯膜,其中将热粘合层层合在双轴拉伸聚酯膜的一面或两面上,该热粘合层的厚度为5〜30μm,由非结晶性聚酯树脂 A的玻璃化转变温度为50〜95℃,热塑性树脂B不相容,热塑性树脂B为(a)熔点为50〜180℃的结晶性树脂,(b) 玻璃化转变温度为-50〜150℃的非结晶性树脂,(c)其混合物,在热粘合层中含有1〜30质量%。