摘要:
A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要:
A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要:
A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.
摘要:
A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要:
A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.
摘要:
A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要:
A recombinant avian infectious coryza vaccine and a process for preparing the same are provided. A process for preparing a recombinant avian infectious coryza vaccine which comprises step of constructing E. coli that may produce as an inclusion body a fusion peptide consisting of peptides derived from outer-membrane protein of Avibacterium paragarinarum serotype A and serotype C, step of culturing said E. coli and colleting and purifying inclusion body from culture, and step of preparing a preparation comprising said purified inclusion body, and an avian infectious coryza vaccine comprising as an active ingredient the fusion peptide. A linker sequence may be inserted between the respective peptides comprising the fusion peptide. For the peptide derived from the serotypes A and C, an amino acid sequence region of Region 2 or its vicinity responsible for protection from infection may be used.
摘要:
Disclosed is a method for developing silver halide photographic photosensitive materials with a developer containing a sulfite wherein said developer contains 20 mol % or more of potassium ion based on the total alkali metal ions, 0.04 mol/l or more of bromine ion or a compound represented by the following formula (I): ##STR1## wherein R.sub.1 represents a hydroxyalkyl group having 2-10 carbon atoms and R.sub.2 and R.sub.3 each represent a hydrogen atom, an alkyl group having 1-10 carbon atoms or a hydroxyalkyl group having 2-10 carbon atoms and the developer is filtered by a filter containing physical development nuclei before, during or after development of the photosensitive materials with the developer. The method is especially effective in processing using an automatic processor. According to the present method, formation of silver sludges is effectively inhibited and thus, stain of roll and belt of the processors can be prevented. According to the present method, formation of silver sludges is effectively inhibited and thus, stain of roll and belt of the processors can be prevented.
摘要:
Provided is an image receiving material for silver complex diffusion transfer process which comprises a support, an image receiving layer provided on the support and an upper layer provided on the image receiving layer wherein physical development nuclei are distributed densely in the vicinity of the surface of the support and gradually diminishing towards the upper layer and a color toning agent is contained densely in the upper layer and gradually diminishing towards the surface of the support and the physical development nuclei and the color toning agent are thus mutually distributed. The image receiving material is produced by coating on a support a hydrophilic colloid coating solution for image receiving layer which contains physical development nuclei and contains substantially no color toning agent and thereon at least one hydrophilic colloid coating solution which contains at least one color toning agent and contains substantially no physical development nuclei. The physical development nuclei are preferably prepared by reducing or sulfurizing a heavy metal ion in a solution containing low molecular weight gelatin as defined in the specification.
摘要:
A process for producing a hollow metal cast product having a desired interior contour is provided. The process comprises the steps of preparing a first lost model having an outer contour substantially corresponding to a desired interior contour of the finished product, depositing a metallic or ceramic material or a mixture thereof over the surface of said first lost model by spraying to form a layer defining a hollow core block, placing said hollow core block in a first mold, pouring or injecting a material for forming a second lost mold into said first mold to form a second lost model, coating a refractory material over said second lost model to form a second mold for casting, removing second lost mold to form a cavity, casting a molten metal or alloy into said cavity, and staving said second mold to take out a finished product.