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    Overhead installed communication equipment
    1.
    发明授权
    Overhead installed communication equipment 失效
    架空通讯设备

    公开(公告)号：US5930111A

    公开(公告)日：1999-07-27

    申请号：US951006

    申请日：1997-10-15

    申请人： Naoya Yamazaki ,  Yasushi Kojima ,  Hisato Sato

    发明人： Naoya Yamazaki ,  Yasushi Kojima ,  Hisato Sato

    IPC分类号： H05K7/02 ,  G02B6/44 ,  H04B10/00 ,  H04B10/272 ,  H04Q1/10 ,  H04Q1/14 ,  H05K5/06 ,  H05K7/20

    CPC分类号： G02B6/4422 ,  G02B6/4446 ,  G02B6/4452 ,  H04Q1/026 ,  H04Q1/10 ,  H04Q1/114

    摘要： An overhead installed communication system includes a cabinet body which includes an electronic circuit device and a door which is supported by the cabinet body through a hinge so that the door can be opened and closed. The system is installed overhead and external cables are introduced into the system. A box is provided inside the door, and the box is sealed in a condition where a lid is closed. A connector is provided in the box, electric wires extending from the electronic circuit device are connected to the connector and the external cables are connected to the connector after being introduced into the system.

    摘要翻译： 架空安装的通信系统包括：机壳主体，其包括电子电路装置和通过铰链由机壳主体支撑的门，使得门能够被打开和关闭。 系统安装在系统中，并将外部电缆引入系统。 在门内设置一个盒子，并且盒子被封闭在盖子关闭的状态下。 连接器设置在箱体中，从电子电路装置延伸的电线连接到连接器，外部电缆在被引入系统之后连接到连接器。

    Cooling structure for electronics devices
    2.
    发明授权
    Cooling structure for electronics devices 失效
    电子设备的冷却结构

    公开(公告)号：US5243218A

    公开(公告)日：1993-09-07

    申请号：US794221

    申请日：1991-11-19

    申请人： Hideki Zenitani ,  Mitsuo Okawachi ,  Hisato Sato ,  Haruhiko Horizoe ,  Naoya Yamazaki

    发明人： Hideki Zenitani ,  Mitsuo Okawachi ,  Hisato Sato ,  Haruhiko Horizoe ,  Naoya Yamazaki

    IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/538 ,  H01L25/11 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

    CPC分类号： H05K7/20436 ,  H01L23/4006 ,  H01L23/433 ,  H01L23/5387 ,  H01L25/115 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/189

    摘要： A cooling structure for LSI or the like devices to be mounted in a small size electronic apparatus housing. A main printed circuit board has mounted thereon first electronic devices with low heat generation; at least one auxiliary printed circuit board has mounted thereon a second electronic device with high heat generation, which is connected with one edge of the main printed circuit board (1) through a flexible printed circuit tape (5); a holder (6) fixed on the main printed circuit board (1) for resiliently supporting the auxiliary printed circuit board (2) at a distance above the former when the latter is turned over and is above the main printed circuit board (1) by bending the flexible printed circuit tape (5) so that a heat conductive surface of the second electronic device (4) is exposed outside. This printed circuit board assembly (A) is accommodated in a housing (B) made of a heat conductive material so that the heat conductive surface of the second electronic device (4) is brought into close and resilient contact with the inner wall (14) of the hosing (B).

    摘要翻译： 用于安装在小型电子设备外壳中的LSI等的装置的冷却结构。 主印刷电路板上安装有低发热量的第一电子装置; 至少一个辅助印刷电路板上安装有通过柔性印刷电路胶带（5）与主印刷电路板（1）的一个边缘连接的具有高发热量的第二电子设备。 固定在主印刷电路板（1）上的保持器（6），用于当辅助印刷电路板（2）翻转后在与前者相隔一定距离处弹性地支撑辅助印刷电路板（2），并且在主印刷电路板（1）上方通过 弯曲柔性印刷电路胶带（5），使得第二电子装置（4）的导热表面暴露在外部。 该印刷电路板组件（A）容纳在由导热材料制成的壳体（B）中，使得第二电子装置（4）的导热表面与内壁（14）紧密弹性接触， 的动作（B）。

    Connector mounting structure
    3.
    发明授权
    Connector mounting structure 有权
    连接器安装结构

    公开(公告)号：US07387517B2

    公开(公告)日：2008-06-17

    申请号：US11896265

    申请日：2007-08-30

    申请人： Kiyonori Kusuda ,  Hisato Sato

    发明人： Kiyonori Kusuda ,  Hisato Sato

    IPC分类号： H01R12/00

    CPC分类号： H01R12/725 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4284

    摘要： In a connector mounting structure, a printed-wiring board has a cut portion, a modular connector connecting pattern provided adjacent to the cut portion, and a connecting pattern provided isolated from the modular connector connecting pattern and connecting an SFP connector. Also, the printed-wiring board and a front board are combined in order that the cut portion faces a plane of an opening which the front board has. When a modular connector is inserted into the opening, the modular connector is supported by the opening and the cut portion and concurrently the modular connector is electrically contacted with the modular connector connecting pattern. When an SFP front cage is inserted into the opening, the SFP front cage is supported by the opening and the cut portion and concurrently an SFP module becomes connectable to the SFP connector through the SFP front cage.

    摘要翻译： 在连接器安装结构中，印刷电路板具有切割部分，与切割部分相邻设置的模块化连接器连接图案以及与模块化连接器连接图案隔离并连接SFP连接器的连接图案。 此外，印刷电路板和前板被组合，使得切割部分面向前板具有的开口的平面。 当模块化连接器插入开口中时，模块化连接器由开口和切割部分支撑，并且模块化连接器与模块化连接器连接图案电接触。 当SFP前盖插入开口时，SFP前保持架由开口和切口部分支撑，并且SFP模块可通过SFP前保持架连接到SFP连接器。

    Nematic liquid crystalline compounds
    7.
    发明授权
    Nematic liquid crystalline compounds 失效
    向列液晶化合物

    公开(公告)号：US4207252A

    公开(公告)日：1980-06-10

    申请号：US955351

    申请日：1978-10-27

    申请人： Hisato Sato ,  Haruyoshi Takatsu

    发明人： Hisato Sato ,  Haruyoshi Takatsu

    IPC分类号： C09K19/28 ,  C07C153/11

    CPC分类号： C09K19/28

    摘要： A nematic liquid crystalline compound of the general formula ##STR1## wherein R.sub.1 represents a linear alkyl group containing 3 to 8 carbon atoms and R.sub.2 represents a linear alkyl g group containing 3 to 7 carbon atoms, or a cyano group, with the proviso that when R.sub.2 represents a linear alkyl group containing 3 carbon atoms, R.sub.1 does not represent a linear alkyl group containing 3 or 7 carbon atoms, and when R.sub.2 represents a cyano group, R.sub.1 does not represent a linear alkyl group containing 3 carbon atoms.

    摘要翻译： 一种通式为“IMAGE”的向列型液晶化合物，其中R 1表示含有3至8个碳原子的直链烷基，R 2表示含3至7个碳原子的直链烷基，或氰基，条件是当 R2表示含有3个碳原子的直链烷基，R1不表示含有3或7个碳原子的直链烷基，当R 2表示氰基时，R 1不表示含有3个碳原子的直链烷基。