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公开(公告)号：US07825575B2
公开(公告)日：2010-11-02
申请号：US11517588
申请日：2006-09-08
申请人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
发明人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H05B33/00
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/60 , H01L2224/16225
摘要： A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.
摘要翻译： 一种具有固态元件的固态元件器件; 用于安装固体元件的电力接收/供应部分，以及从固态元件接收/供给电力的装置; 以及波长转换部分，其具有形成在具有与用于密封固态元件的受电/供应部分相同的热膨胀系数的密封玻璃内的荧光体层，所述荧光体层通过将玻璃和荧光体 相互融合，融化玻璃。
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公开(公告)号：US20070064131A1
公开(公告)日：2007-03-22
申请号：US11517588
申请日：2006-09-08
申请人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
发明人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H04N5/335
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/60 , H01L2224/16225
摘要： A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.
摘要翻译： 一种具有固态元件的固态元件器件; 用于安装固体元件的电力接收/供应部分，以及从固态元件接收/供给电力的装置; 以及波长转换部分，其具有形成在具有与用于密封固态元件的受电/供应部分相同的热膨胀系数的密封玻璃内的荧光体层，所述荧光体层通过将玻璃和荧光体 相互融合，融化玻璃。
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公开(公告)号：US07999398B2
公开(公告)日：2011-08-16
申请号：US11882601
申请日：2007-08-02
申请人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
发明人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L23/28
CPC分类号： H01L33/56 , C03C3/066 , H01L24/17 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/00014 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.
摘要翻译： 固体装置具有固态成分，将固态成分安装在其上用于从固态成分接收/供给电力的电力接收供给部和密封固体成分的玻璃密封部。 玻璃密封部由B 2 O 3 -SiO 2 -Li 2 O-Na 2 O-ZnO-Nb 2 O 5基玻璃形成，该玻璃由21重量％〜23重量％的B 2 O 3，11重量％〜13重量％的SiO 2，1重量％〜 1.5重量％的Li 2 O和2重量％至2.5重量％的Na 2 O.
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公开(公告)号：US20080029780A1
公开(公告)日：2008-02-07
申请号：US11882601
申请日：2007-08-02
申请人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
发明人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , C03C3/066 , H01L24/17 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/00014 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.
摘要翻译： 固体装置具有固态成分，将固态成分安装在其上用于从固态成分接收/供给电力的电力接收供给部和密封固体成分的玻璃密封部。 玻璃密封部分由B 2 O 3 -S 3 O 3 -SiO 2 -Li 2 O 2 Na 2 O 2形成， 由2重量％〜23重量％的B 2 O 2 ZnO 2 Nb 2 O 5 O 5系基体玻璃组成， 3重量％，1重量％〜13重量％的SiO 2，1重量％〜1.5重量％的Li 2 O， 和2重量％至2.5重量％的Na 2 O。
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公开(公告)号：US20090078959A1
公开(公告)日：2009-03-26
申请号：US12292262
申请日：2008-11-14
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
IPC分类号： H01L33/00
CPC分类号： C03C8/08 , C03C8/24 , H01L33/501 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/181 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state optical device includes a solid-state element, a power supplying/retrieving portion on which the solid-state element is mounted, the power supplying/retrieving portion supplying or retrieving electric power to/from the solid-state element, and a glass sealing material that seals the solid-state element. The glass sealing material has a thermal expansion coefficient equivalent to that of the power supplying/retrieving portion. The glass sealing material includes a P2O5—Al2O3—ZnO-based low-melting glass that includes 55 to 62 wt % of P2O5, 5 to 12 wt % of Al2O3 and 20 to 40 wt % of ZnO in weight %.
摘要翻译： 固体光学器件包括固态元件，固态元件安装在其上的供电/取出部分，向固态元件供电或从固态元件取回电力的供电/取出部分，以及 密封固态元件的玻璃密封材料。 玻璃密封材料具有与供电/取出部分相当的热膨胀系数。 玻璃密封材料包括P2O5-Al2O3-ZnO基低熔点玻璃，其包含55至62重量％的P 2 O 5，5至12重量％的Al 2 O 3和20至40重量％的以重量％计的ZnO。
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公开(公告)号：US07470926B2
公开(公告)日：2008-12-30
申请号：US11220777
申请日：2005-09-08
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
CPC分类号： C03C8/08 , C03C8/24 , H01L33/501 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/181 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state optical device having: a solid-state element; a power supplying/retrieving portion that supplies or retrieves electric power to/from the solid-state element; and a glass sealing material that seals the solid-state element. The glass sealing material is made of a P2O5—ZnO-based low-melting glass that has 45 to 50 wt % of P2O5 and 15 to 35 wt % of ZnO.
摘要翻译： 一种固态光学器件，具有：固态元件; 供电/取出部分，用于向/从固态元件供电或取回电力; 以及密封固态元件的玻璃密封材料。 玻璃密封材料由P2O5-ZnO系低熔点玻璃制成，其具有45〜50重量％的P 2 O 5和15〜35重量％的ZnO。
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公开(公告)号：US20060049421A1
公开(公告)日：2006-03-09
申请号：US11220777
申请日：2005-09-08
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
IPC分类号： H01L33/00
CPC分类号： C03C8/08 , C03C8/24 , H01L33/501 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/181 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state optical device having: a solid-state element; a power supplying/retrieving portion that supplies or retrieves electric power to/from the solid-state element; and a glass sealing material that seals the solid-state element. The glass sealing material is made of a P2O5—ZnO-based low-melting glass that has 45 to 50 wt % of P2O5 and 15 to 35 wt % of ZnO.
摘要翻译： 一种固态光学器件，具有：固态元件; 供电/取出部分，用于向/从固态元件供电或取回电力; 以及密封固态元件的玻璃密封材料。 玻璃密封材料由具有45〜50重量％的P 2 O 3的低磷玻璃制成， > 5和15〜35重量％的ZnO。
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公开(公告)号：US07667223B2
公开(公告)日：2010-02-23
申请号：US12292262
申请日：2008-11-14
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Naruhito Sawanobori , Masaaki Ohtsuka , Hiroki Watanabe , Kazuya Aida
CPC分类号： C03C8/08 , C03C8/24 , H01L33/501 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/181 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state optical device includes a solid-state element, a power supplying/retrieving portion on which the solid-state element is mounted, the power supplying/retrieving portion supplying or retrieving electric power to/from the solid-state element, and a glass sealing material that seals the solid-state element. The glass sealing material has a thermal expansion coefficient equivalent to that of the power supplying/retrieving portion. The glass sealing material includes a P2O5—Al2O3—ZnO-based low-melting glass that includes 55 to 62 wt % of P2O5, 5 to 12 wt % of Al2O3 and 20 to 40 wt % of ZnO in weight %.
摘要翻译： 固体光学器件包括固态元件，固态元件安装在其上的供电/取出部分，向固态元件供电或从固态元件取回电力的供电/取出部分，以及 密封固态元件的玻璃密封材料。 玻璃密封材料具有与供电/取出部分相当的热膨胀系数。 玻璃密封材料包括P2O5-Al2O3-ZnO基低熔点玻璃，其包含55至62重量％的P 2 O 5，5至12重量％的Al 2 O 3和20至40重量％的以重量％计的ZnO。
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公开(公告)号：US08685766B2
公开(公告)日：2014-04-01
申请号：US13419093
申请日：2012-03-13
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L21/56
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.
摘要翻译： 一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子 并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。
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公开(公告)号：US20120171789A1
公开(公告)日：2012-07-05
申请号：US13419093
申请日：2012-03-13
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.
摘要翻译： 一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子 并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。
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