-
公开(公告)号:US20120221884A1
公开(公告)日:2012-08-30
申请号:US13036826
申请日:2011-02-28
申请人: Nicholas P. Carter , Donald S. Gardner , Eric C. Hannah , Helia Naeimi , Shekhar Y. Borkar , Matthew Haycock
发明人: Nicholas P. Carter , Donald S. Gardner , Eric C. Hannah , Helia Naeimi , Shekhar Y. Borkar , Matthew Haycock
IPC分类号: G06F11/07
CPC分类号: G06F11/0781 , G06F11/0772 , G06F11/0793 , G06F11/1425 , G06F11/1428
摘要: Generally, this disclosure provides error management across hardware and software layers to enable hardware and software to deliver reliable operation in the face of errors and hardware variation due to aging, manufacturing tolerances, etc. In one embodiment, an error management module is provided that gathers information from the hardware and software layers, and detects and diagnoses errors. A hardware or software recovery technique may be selected to provide efficient operation, and, in some embodiments, the hardware device may be reconfigured to prevent future errors and to permit the hardware device to operate despite a permanent error.
摘要翻译: 通常,本公开提供跨越硬件和软件层的错误管理,以使硬件和软件能够在由于老化,制造公差等导致的错误和硬件变化的情况下提供可靠的操作。在一个实施例中,提供了一种错误管理模块, 来自硬件和软件层的信息,并检测和诊断错误。 可以选择硬件或软件恢复技术来提供有效的操作,并且在一些实施例中,硬件设备可以被重新配置以防止将来的错误,并允许硬件设备在永久性错误的情况下操作。
-
2.
公开(公告)号:US06924510B2
公开(公告)日:2005-08-02
申请号:US10140255
申请日:2002-05-06
IPC分类号: G02B6/12 , G02B6/122 , G02B6/13 , G02B6/138 , G02B6/42 , G02B6/43 , H01L31/173 , H01L33/00 , H01L33/34 , H01L29/26
CPC分类号: H01L33/34 , G02B6/12004 , G02B6/1221 , G02B6/13 , G02B6/138 , G02B6/42 , G02B6/4214 , G02B6/4228 , G02B6/43 , G02B2006/12121 , H01L31/173
摘要: A light-emitting device and optical communication system based on the light-emitting device is disclosed. The light-emitting device is formed in a float-zone substrate. The light-emitting device includes on the substrate lower surface a reflective layer and on the upper surface spaced apart doped regions. The portion of the upper surface between the doped regions is textured and optionally covered with an antireflection coating to enhance light emission. The light-emitting device can operate as a laser or as a light-emitting diode, depending on the reflectivities of the antireflection coating and the reflective layer.
摘要翻译: 公开了一种基于发光装置的发光装置和光通信系统。 发光装置形成在浮区衬底中。 发光装置在基板下表面上包括反射层,并且在上表面上包括间隔开的掺杂区域。 掺杂区域之间的上表面的部分被纹理化并且任选地被抗反射涂层覆盖以增强发光。 取决于抗反射涂层和反射层的反射率,发光器件可以作为激光器或发光二极管工作。
-
公开(公告)号:US20100115301A1
公开(公告)日:2010-05-06
申请号:US12684257
申请日:2010-01-08
申请人: Siva G. Narendra , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: G06F1/26
CPC分类号: H01L25/18 , G06F1/189 , G06F1/26 , H01L25/0657 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.
摘要翻译: 公开了一种中央处理单元(CPU)。 CPU包括CPU管芯; 以及以三维封装布局结合到CPU裸片的电压调节器芯片。
-
公开(公告)号:US08288846B2
公开(公告)日:2012-10-16
申请号:US12660305
申请日:2010-02-24
申请人: Siva G. Narendra , James W. Tschanz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , James W. Tschanz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: H01L23/495 , H01L23/52 , H01L21/00
CPC分类号: H01L25/0657 , H01L25/18 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要翻译: 公开了一种集成电路(IC)封装。 IC封装包括第一裸片; 以及以三维封装布局结合到CPU管芯的第二管芯。
-
公开(公告)号:US07698576B2
公开(公告)日:2010-04-13
申请号:US10955746
申请日:2004-09-30
申请人: Siva G. Narendra , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: G06F1/26
CPC分类号: H01L25/18 , G06F1/189 , G06F1/26 , H01L25/0657 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.
摘要翻译: 公开了一种中央处理单元(CPU)。 CPU包括CPU管芯; 以及以三维封装布局结合到CPU裸片的电压调节器芯片。
-
公开(公告)号:US20100219516A1
公开(公告)日:2010-09-02
申请号:US12660305
申请日:2010-02-24
申请人: Siva G. Narendra , James W. Tschanz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , James W. Tschanz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: H01L23/495
CPC分类号: H01L25/0657 , H01L25/18 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要翻译: 公开了一种集成电路(IC)封装。 IC封装包括第一裸片; 以及以三维封装布局结合到CPU管芯的第二管芯。
-
公开(公告)号:US20140089687A1
公开(公告)日:2014-03-27
申请号:US13626357
申请日:2012-09-25
申请人: Siva G. Narendra , James W. Tschanz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , James W. Tschanz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: G06F1/26
CPC分类号: G06F1/26 , G06F1/3206 , G06F1/324 , G06F1/3296 , H01L23/34 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , Y02D10/126 , Y02D10/172
摘要: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要翻译: 公开了一种集成电路(IC)封装。 IC封装包括第一裸片; 以及以三维封装布局结合到CPU管芯的第二管芯。
-
公开(公告)号:US07671456B2
公开(公告)日:2010-03-02
申请号:US11825252
申请日:2007-07-03
申请人: Siva G. Narendra , James W. Tschantz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , James W. Tschantz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: H01L23/495 , H01L23/52
CPC分类号: H01L25/0657 , H01L25/18 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
-
公开(公告)号:US07247930B2
公开(公告)日:2007-07-24
申请号:US10955383
申请日:2004-09-30
申请人: Siva G. Narendra , James W. Tschantz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
发明人: Siva G. Narendra , James W. Tschantz , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
IPC分类号: H01L23/495
CPC分类号: H01L25/0657 , H01L25/18 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.
摘要翻译: 公开了一种中央处理单元(CPU)。 CPU包括CPU管芯; 以及以三维封装布局结合到CPU裸片的电源管理裸片。
-
10.
公开(公告)号:US07169631B2
公开(公告)日:2007-01-30
申请号:US11195203
申请日:2005-08-02
IPC分类号: H01L21/66
CPC分类号: H01L33/34 , G02B6/12004 , G02B6/1221 , G02B6/13 , G02B6/138 , G02B6/42 , G02B6/4214 , G02B6/4228 , G02B6/43 , G02B2006/12121 , H01L31/173
摘要: A light-emitting device and optical communication system based on the light-emitting device is disclosed. The light-emitting device is formed in a float-zone substrate. The light-emitting device includes on the substrate lower surface a reflective layer and on the upper surface spaced apart doped regions. The portion of the upper surface between the doped regions is textured and optionally covered with an antireflection coating to enhance light emission. The light-emitting device can operate as a laser or as a light-emitting diode, depending on the reflectivities of the antireflection coating and the reflective layer.
摘要翻译: 公开了一种基于发光装置的发光装置和光通信系统。 发光装置形成在浮区衬底中。 发光装置在基板下表面上包括反射层,并且在上表面上包括间隔开的掺杂区域。 掺杂区域之间的上表面的部分被纹理化并且任选地被抗反射涂层覆盖以增强发光。 取决于抗反射涂层和反射层的反射率,发光器件可以作为激光器或发光二极管工作。
-
-
-
-
-
-
-
-
-