METHOD FOR ELECTRON BEAM INDUCED ETCHING
    1.
    发明申请
    METHOD FOR ELECTRON BEAM INDUCED ETCHING 有权
    电子束诱导蚀刻的方法

    公开(公告)号:US20110183444A1

    公开(公告)日:2011-07-28

    申请号:US13058587

    申请日:2009-08-13

    IPC分类号: H01L21/66 C23F1/08

    摘要: The invention relates to a method for electron beam induced etching of a material (100, 200) with the method steps providing at least one etching gas at a position of the material (100, 200) at which an electron beam impacts on the material (100, 200) and simultaneously providing at least one passivation gas which is adapted for slowing down or inhibiting a spontaneous etching by the at least one etching gas

    摘要翻译: 本发明涉及一种用于电子束感应蚀刻材料(100,200)的方法,该方法步骤在电子束撞击材料(100,200)的位置提供至少一种蚀刻气体( 100,200),并且同时提供至少一个钝化气体,所述钝化气体适于减缓或抑制所述至少一种蚀刻气体的自发蚀刻