APPARATUS AND METHOD FOR INVESTIGATING AND/OR MODIFYING A SAMPLE
    4.
    发明申请
    APPARATUS AND METHOD FOR INVESTIGATING AND/OR MODIFYING A SAMPLE 有权
    用于调查和/或修改样品的装置和方法

    公开(公告)号:US20110210181A1

    公开(公告)日:2011-09-01

    申请号:US12745059

    申请日:2010-05-27

    Abstract: An apparatus and a method for investigating and/or modifying a sample is disclosed. The apparatus comprises a charged particle source, at least one particle optical element forming a charged particle beam of charged particles emitted by said charged particle source. The apparatus further comprises an objective lens which generates a charged particle probe from said charged particle beam. The objective lens defines a particle optical axis. A first electrostatic deflection element is arranged—in a direction of propagation of charged particles emitted by said charged particle source—downstream of the objective lens. The electrostatic deflection element deflecting the charged particle beam in a direction perpendicular to said charged particle optical axis and has a deflection bandwidth of at least 10 MHz.

    Abstract translation: 公开了一种用于调查和/或修改样品的装置和方法。 所述装置包括带电粒子源,至少一个粒子光学元件,形成由所述带电粒子源发射的带电粒子的带电粒子束。 该装置还包括从所述带电粒子束产生带电粒子探针的物镜。 物镜定义了粒子光轴。 第一静电偏转元件布置在由物镜的下游的所述带电粒子源发射的带电粒子的传播方向上。 静电偏转元件使垂直于所述带电粒子光轴的方向偏转带电粒子束并具有至少10MHz的偏转带宽。

    METHOD FOR ELECTRON BEAM INDUCED ETCHING
    5.
    发明申请
    METHOD FOR ELECTRON BEAM INDUCED ETCHING 有权
    电子束诱导蚀刻的方法

    公开(公告)号:US20110183444A1

    公开(公告)日:2011-07-28

    申请号:US13058587

    申请日:2009-08-13

    CPC classification number: H01L21/3065 H01L21/31116 H01L21/32136

    Abstract: The invention relates to a method for electron beam induced etching of a material (100, 200) with the method steps providing at least one etching gas at a position of the material (100, 200) at which an electron beam impacts on the material (100, 200) and simultaneously providing at least one passivation gas which is adapted for slowing down or inhibiting a spontaneous etching by the at least one etching gas

    Abstract translation: 本发明涉及一种用于电子束感应蚀刻材料(100,200)的方法,该方法步骤在电子束撞击材料(100,200)的位置提供至少一种蚀刻气体( 100,200),并且同时提供至少一个钝化气体,所述钝化气体适于减缓或抑制所述至少一种蚀刻气体的自发蚀刻

    Method for high-resolution processing of thin layers using electron beams
    6.
    发明授权
    Method for high-resolution processing of thin layers using electron beams 有权
    使用电子束对薄层进行高分辨率处理的方法

    公开(公告)号:US07786403B2

    公开(公告)日:2010-08-31

    申请号:US10927956

    申请日:2004-08-27

    CPC classification number: G03F1/74 C23F1/12 H01J2237/31744 H01L21/32135

    Abstract: A method for etching a chromium layer in a vacuum chamber which may comprise introducing a halogen compound into the vacuum chamber, directing an electron beam onto the area of the chromium layer to be etched and/or introducing an oxygen including compound into the vacuum chamber. A further method for the highly resolved removal of a layer out of metal and/or metal oxide which may be arranged on an isolator or a substrate having poor thermal conductivity, may comprise arranging the layer inside a vacuum chamber, bombarding the layer with a focused electron beam with an energy of 3-30 keV, wherein the electron beam may be guided such that the energy transfer per time and area causes a localized heating of the layer above its melting and/or vaporization point and wherein the removal of the layer may be performed without the supply of reaction gases into the vacuum chamber.

    Abstract translation: 一种用于在真空室中蚀刻铬层的方法,其可以包括将卤素化合物引入真空室,将电子束引导到要蚀刻的铬层的区域和/或将含氧化合物引入真空室中。 用于高分辨率地去除可以布置在具有差热导率的隔离器或基板上的金属和/或金属氧化物层的另外的方法可以包括将层布置在真空室内,用聚焦的方式轰击该层 电子束的能量为3-30keV,其中电子束可被引导,使得每时间和面积的能量传递导致该层在其熔化和/或蒸发点之上的局部加热,并且其中该层的去除可以 在没有将反应气体供应到真空室中的情况下进行。

    PROCEDURE FOR ETCHING OF MATERIALS AT THE SURFACE WITH FOCUSSED ELECTRON BEAM INDUCED CHEMICAL REACTIONS AT SAID SURFACE
    7.
    发明申请
    PROCEDURE FOR ETCHING OF MATERIALS AT THE SURFACE WITH FOCUSSED ELECTRON BEAM INDUCED CHEMICAL REACTIONS AT SAID SURFACE 有权
    用表面化学电子束诱导化学反应在表面上蚀刻材料的程序

    公开(公告)号:US20080011718A1

    公开(公告)日:2008-01-17

    申请号:US11772755

    申请日:2007-07-02

    Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface—irradiation and removal step.

    Abstract translation: 本发明涉及通过在所述表面处聚焦的电子束诱导的化学反应在表面处蚀刻材料的方法。 本发明的特征在于,在真空气氛中,待蚀刻的材料用至少一束分子,至少一束光子和至少一束电子照射,由此照射的材料和 分子束以使得由所述材料和所述分子组合物预定的化学反应发生并形成反应产物的方式被激发,并且从材料表面照射和去除步骤中除去所述反应产物。

    Apparatus and method for investigating or modifying a surface with a beam of charged particles
    8.
    发明授权
    Apparatus and method for investigating or modifying a surface with a beam of charged particles 有权
    用带电粒子束调查或修改表面的装置和方法

    公开(公告)号:US07232997B2

    公开(公告)日:2007-06-19

    申请号:US11106368

    申请日:2005-04-14

    Abstract: An apparatus for investigating and/or modifying a sample with charged particles, in particular a scanning electron microscope, is provided. The apparatus comprises a beam (1, 2) of charged particles, a shielding element (10) having an opening (30) for the beam of charged particles to pass through, wherein the opening (30) is sufficiently small and the shielding element (10) sufficiently closely positioned to the surface (20) of the sample to reduce the influence of charge accumulation effects at the surface on the beam of charged particles.

    Abstract translation: 提供了一种用于研究和/或修饰具有带电粒子的样品的装置,特别是扫描电子显微镜。 该设备包括带电粒子的束(1,2),具有用于带电粒子束通过的开口(30)的屏蔽元件(10),其中开口(30)足够小并且屏蔽元件 10)足够紧密地定位于样品的表面(20),以减少带电粒子束上的表面处的电荷累积效应的影响。

    Method for high-resolution processing of thin layers using electron beams
    9.
    发明申请
    Method for high-resolution processing of thin layers using electron beams 有权
    使用电子束对薄层进行高分辨率处理的方法

    公开(公告)号:US20050087514A1

    公开(公告)日:2005-04-28

    申请号:US10927956

    申请日:2004-08-27

    CPC classification number: G03F1/74 C23F1/12 H01J2237/31744 H01L21/32135

    Abstract: A method for etching a chromium layer in a vacuum chamber which may comprise introducing a halogen compound into the vacuum chamber, directing an electron beam onto the area of the chromium layer to be etched and/or introducing an oxygen including compound into the vacuum chamber. A further method for the highly resolved removal of a layer out of metal and/or metal oxide which may be arranged on an isolator or a substrate having poor thermal conductivity, may comprise arranging the layer inside a vacuum chamber, bombarding the layer with a focused electron beam with an energy of 3-30 keV, wherein the electron beam may be guided such that the energy transfer per time and area causes a localized heating of the layer above its melting and/or vaporization point and wherein the removal of the layer may be performed without the supply of reaction gases into the vacuum chamber.

    Abstract translation: 一种用于在真空室中蚀刻铬层的方法,其可以包括将卤素化合物引入真空室,将电子束引导到要蚀刻的铬层的区域和/或将含氧化合物引入真空室中。 用于高分辨率地去除可以布置在具有差热导率的隔离器或基板上的金属和/或金属氧化物层的另外的方法可以包括将层布置在真空室内,用聚焦的方式轰击该层 电子束的能量为3-30keV,其中电子束可被引导,使得每时间和面积的能量传递导致该层在其熔化和/或蒸发点之上的局部加热,并且其中该层的去除可以 在没有将反应气体供应到真空室中的情况下进行。

    Focused ion-beam fabrication of fiber probes for use in near field scanning optical microscopy
    10.
    发明授权
    Focused ion-beam fabrication of fiber probes for use in near field scanning optical microscopy 失效
    用于近场扫描光学显微镜的光纤探头的聚焦离子束制造

    公开(公告)号:US06633711B1

    公开(公告)日:2003-10-14

    申请号:US09584788

    申请日:2000-06-01

    CPC classification number: G01Q60/22

    Abstract: A method of forming a fiber probe having an aperture for use in near-field scanning optical microscopy. The method includes a first steps of coating an optical fiber having a tapered tip with a metal layer. Next is a step of milling the tapered tip and metal layer such that an aperture is formed through the metal layer at the tapered tip. The milling step includes focused ion-beam milling the tapered tip and metal layer. The focused ion-beam milling can be done by raster scanning the focused ion-beam in a rectangular pattern at an apex of the tapered tip. Also, the fiber probe made through the above outlined method is used in near-field scanning optical microscopy.

    Abstract translation: 一种形成具有用于近场扫描光学显微镜的孔径的光纤探针的方法。 该方法包括用金属层涂覆具有锥形尖端的光纤的第一步骤。 接下来是铣削锥形尖端和金属层的步骤,使得在锥形尖端处通过金属层形成孔。 铣削步骤包括聚焦离子束铣削锥形尖端和金属层。 聚焦离子束研磨可以通过在锥形尖端的顶点处以矩形图案光栅扫描聚焦离子束来完成。 此外,通过上述方法制造的光纤探针也用于近场扫描光学显微镜

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