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101 条记录 (耗时 0.024 秒)

    Digital image forming apparatus
    1.
    发明授权
    Digital image forming apparatus 失效
    数字图像形成装置

    公开(公告)号：US5587801A

    公开(公告)日：1996-12-24

    申请号：US595940

    申请日：1996-02-06

    申请人： Nobuo Kamei ,  Yoshikazu Ikenoue ,  Hideo Yamamoto

    发明人： Nobuo Kamei ,  Yoshikazu Ikenoue ,  Hideo Yamamoto

    IPC分类号： G06F3/06 ,  H04N1/04 ,  H04N1/21 ,  H04N1/32 ,  H04N1/10

    CPC分类号： H04N1/3248 ,  H04N1/32486 ,  H04N2201/3287 ,  H04N2201/3295

    摘要： In a digital copying apparatus, the digital image data of a document to be copied are stored in a memory means, and an image is copied on a paper according to the digital image data stored in the memory means. Two clear modes are provided for clearing the image data stored in the memory means. In the first clear mode, the data in the memory means is cleared when the document is detected to be removed from the platen and the like. In the second clear mode, the data in the memory means is cleared when a new document is detected to be set on the platen glass or the like. One of the two clear modes is selected with the operational panel and the selected mode is displayed. A memory clear command is sent to the memory means at an appropriate timing in the two clear modes, and the memory clear is executed by the memory means. The memory clear command is sent only after the copying operation is completed or it is inhibited to clear the image data when a latent image is being formed according to the image data.

    摘要翻译： 在数字复印装置中，要复制的文件的数字图像数据被存储在存储装置中，并且根据存储在存储装置中的数字图像数据将图像复制在纸张上。 提供两种清除模式以清除存储在存储装置中的图像数据。 在第一清除模式中，当检测到文档被从压板等移除时，存储装置中的数据被清除。 在第二清除模式中，当检测到新的文档被设置在稿台玻璃等上时，存储器装置中的数据被清除。 使用操作面板选择两种清除模式之一，并显示所选模式。 存储器清除命令在两个清除模式中的适当定时被发送到存储器装置，并且存储器清除由存储器装置执行。 仅在复印操作完成之后发送存储器清除命令，或者当根据图像数据形成潜像时禁止清除图像数据。

    Method of fabricating semiconductor device
    2.
    发明授权
    Method of fabricating semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号：US08222109B2

    公开(公告)日：2012-07-17

    申请号：US12760152

    申请日：2010-04-14

    申请人： Hideo Yamamoto ,  Kei Takehara

    发明人： Hideo Yamamoto ,  Kei Takehara

    IPC分类号： H01L21/8242 ,  H01L21/336

    CPC分类号： H01L29/7813 ,  H01L29/0696 ,  H01L29/1095 ,  H01L29/42368 ,  H01L29/66727 ,  H01L29/66734

    摘要： A method of fabricating a semiconductor device according to the present invention includes forming a first trench and a second trench by etching the first trench further, in an epitaxial layer formed over a substrate, extending a width of the second trench, forming an oxidize film by oxidizing the extended second trench, and filling an electrode material in the first trench and the second trench including the oxidized film formed therein. The method of fabricating a semiconductor device according to the present invention enables to fabricate a semiconductor device that improves the withstand voltage between a drain and a source and reduce the on-resistance.

    摘要翻译： 根据本发明的制造半导体器件的方法包括通过在形成在衬底上的外延层中进一步蚀刻第一沟槽来形成第一沟槽和第二沟槽，延伸第二沟槽的宽度，通过第二沟槽的宽度形成氧化膜 氧化延伸的第二沟槽，并且填充第一沟槽中的电极材料和包括其中形成的氧化膜的第二沟槽。 根据本发明的制造半导体器件的方法能够制造提高漏极和源极之间的耐受电压并降低导通电阻的半导体器件。

    LAMINATED SHEET FOR BURNING HAVING MARKING PART
    3.
    发明申请
    LAMINATED SHEET FOR BURNING HAVING MARKING PART 审中-公开
    具有标记部分的层压板

    公开(公告)号：US20120021211A1

    公开(公告)日：2012-01-26

    申请号：US13138211

    申请日：2009-12-22

    申请人： Shoi Nozaki ,  Hideo Yamamoto ,  Kenji Takehisa

    发明人： Shoi Nozaki ,  Hideo Yamamoto ,  Kenji Takehisa

    IPC分类号： B32B3/00 ,  B29C71/02

    CPC分类号： B44C1/1729 ,  G06K19/02 ,  Y10T156/1163 ,  Y10T428/266

    摘要： A primary object of the present invention is to provide a laminated sheet for firing having an identification part, the sheet being directly attachable to an adherend, having excellent heat resistance, being free from cracks, etc., during rapid temperature changes such as a rapid temperature increase and rapid water-cooling, and being flexible to follow the change in shape of the adherend. The laminated sheet for firing of the present invention comprises a protective sheet, a temporary adhesion layer, a heat-resistant base layer, a combustible adhesive layer, and a release sheet, which are laminated in this order; the heat-resistant base layer having a thickness of 30 μm or less, comprising a silicone resin and an inorganic powder, and having the identification part, the identification part being formed from a heat-resistant ink containing an inorganic pigment.

    摘要翻译： 本发明的主要目的是提供一种用于焙烧的层压片材，其具有识别部分，该片材可直接附着于被粘物，具有优异的耐热性，在快速温度变化期间没有裂纹等，例如快速 温度升高，水冷却快，并且能够灵活地跟随被粘物的形状变化。 本发明的层叠烧成体包含依次层叠的保护片，临时粘合层，耐热基层，可燃性粘合层，剥离片等。 所述耐热基层具有30μm以下的厚度，包含有机硅树脂和无机粉末，并且具有所述识别部，所述识别部由含有无机颜料的耐热油墨形成。

    Semiconductor device and method for manufacturing the same
    6.
    发明申请
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20100171172A1

    公开(公告)日：2010-07-08

    申请号：US12659454

    申请日：2010-03-09

    申请人： Yoshimitsu Murase ,  Kenya Kobayashi ,  Hideo Yamamoto ,  Atsushi Kaneko

    发明人： Yoshimitsu Murase ,  Kenya Kobayashi ,  Hideo Yamamoto ,  Atsushi Kaneko

    IPC分类号： H01L29/78

    CPC分类号： H01L29/7813 ,  H01L29/4236 ,  H01L29/66734

    摘要： A semiconductor device, includes a semiconductor layer of a second conductive type, a first diffused region of a first conductive type formed in the semiconductor layer, a second diffused region of the second conductive type selectively formed in the first diffused region, a trench formed in the semiconductor layer, a polysilicon formed in the trench with an insulator intervening, a first oxide film formed on the polysilicon so that the first oxide film is buried in the trench, a second oxide film formed on the first oxide film so that the second oxide film is buried in the trench, and a flowable insulator film formed on the second oxide film so that the flowable insulator film is buried in the trench.

    摘要翻译： 一种半导体器件，包括第二导电类型的半导体层，形成在半导体层中的第一导电类型的第一扩散区域，选择性地形成在第一扩散区域中的第二导电类型的第二扩散区域，形成在 半导体层，形成在具有绝缘体的沟槽中的多晶硅，形成在多晶硅上的第一氧化物膜，使得第一氧化物膜被埋在沟槽中，形成在第一氧化物膜上的第二氧化物膜，使得第二氧化物 膜被埋在沟槽中，以及形成在第二氧化物膜上的可流动的绝缘膜，使得可流动的绝缘膜被埋在沟槽中。

    Voice Recognition Program
    8.
    发明申请
    Voice Recognition Program 审中-公开
    语音识别程序

    公开(公告)号：US20080177542A1

    公开(公告)日：2008-07-24

    申请号：US11908334

    申请日：2005-03-11

    申请人： Hideo Yamamoto

    发明人： Hideo Yamamoto

    IPC分类号： G10L15/00

    CPC分类号： G10L15/22 ,  G10L15/1815 ,  G10L25/78 ,  G10L2015/088

    摘要： A voice recognition program according to claim 1 makes a computer execute a start determining word recognizing step for checking whether a start determining word for a sentence recognition is inputted by voice or not, an end determining word recognizing step for checking whether an end determining word for the sentence recognition is inputted by voice or not after the voice input of the start determining word, and a sentence recognizing step for recognizing by voice an intermediate sentence between the start determining word and the end determining word when it is judged that the start determining word and the end determining word are inputted in the start determining word recognizing step and the end determining word recognizing step. Thereby, it simplifies an input work of a fixed sentence, that is applicable to a preparation of a medical record or the like, that improves usability for a user such as a doctor who is unused to a PC operation and that is able to reduce largely a labor and a time for inputting work of the doctor or the like.

    摘要翻译： 根据权利要求1的语音识别程序使得计算机执行开始确定字识别步骤，用于检查是否通过语音输入用于语音识别的开始确定字，结束确定字识别步骤，用于检查是否结束确定词， 在开始确定词的语音输入之后通过语音输入句子识别，以及句子识别步骤，用于当判断出开始确定词被判定为开始确定词和结束确定词之间的中间句子时，通过语音识别 并且结束确定字被输入到开始确定字识别步骤和结束确定字识别步骤中。 从而，简化了适用于医疗记录等的准备的固定句子的输入工作，其提高了对未被使用于PC操作的医生等用户的可用性，并且能够大大减少 劳动和输入医生等工作的时间。

    Resin composition and molded object thereof
    10.
    发明授权
    Resin composition and molded object thereof 失效
    树脂组合物及其成型物

    公开(公告)号：US5889100A

    公开(公告)日：1999-03-30

    申请号：US938628

    申请日：1997-09-26

    申请人： Kunihiko Asai ,  Tomio Takada ,  Hideo Yamamoto ,  Kunio Yamamoto ,  Yoshihisa Saiki ,  Takeshi Ogawa

    发明人： Kunihiko Asai ,  Tomio Takada ,  Hideo Yamamoto ,  Kunio Yamamoto ,  Yoshihisa Saiki ,  Takeshi Ogawa

    IPC分类号： B60R19/03 ,  C08J5/00 ,  C08K3/34 ,  C08L23/16 ,  C08L51/06 ,  C08L53/00 ,  C08L53/02

    CPC分类号： C08L51/06 ,  C08L23/16 ,  C08L53/00 ,  C08L53/025 ,  C08L53/02

    摘要： A resin composition comprising: (A) a polypropylene polymer comprising a propylene/ethylene block copolymer, said polypropylene polymer having a melt flow rate of from 5 to 100 g/10 min as measured at 230.degree. C. under a load of 2.16 kg and containing components extractable with xylene at 20.degree. C., wherein the xylene-extractable components having an intrinsic viscosity as measured at 140.degree. C. in decalin of from 2.0 to 5.0 g/dl; (B) an ethylene/propylene rubber having a propylene content of from 40 to 60% by weight and a melt flow rate of from 0.5 to 10 g/10 min as measured at 230.degree. C. under a load of 2.16 kg; (C) a triblock copolymer having a melt flow rate of from more than 40 to 200 g/10 min as measured at 230.degree. C. under a load of 2.16 kg, a flat interface between said triblock copolymer and the 100.degree. C. xylene-insoluble components of said polypropylene polymer of ingredient (A) having a critical energy release rate of 20 J/m.sup.2 or higher as measured at a phase angle of from -2.degree. to -12.degree.; (D) a modified polyolefin polymer having a hydroxy group, said modified polyolefin polymer having a content of a hydroxy-containing unsaturated compound of from 0.5 to 7.0% by weight; (E) an oligomer having at least one terminal polar group, said oligomer having a number-average molecular weight of from 300 to 10,000; and (F) talc having an average particle diameter of 5 .mu.m or smaller.

    摘要翻译： 一种树脂组合物，其包含：（A）包含丙烯/乙烯嵌段共聚物的聚丙烯聚合物，所述聚丙烯聚合物在230℃，2.16kg负荷下测定的熔体流动速率为5-100g / 10min， 其中二甲苯可萃取组分在十氢萘中在140℃下测得的特性粘度为2.0-5.0g / dl; （B）在2.16kg的负荷下，在230℃下测定的丙烯含量为40〜60重量％，熔体流动速率为0.5〜10g / 10分钟的乙烯/丙烯橡胶; （C）在230℃，2.16kg负荷下测定熔体流动速率大于40至200g / 10min的三嵌段共聚物，所述三嵌段共聚物与100℃二甲苯之间的平坦界面 所述成分（A）的聚丙烯聚合物的不溶成分，其相位角为-2°至-12°，其临界能量释放速率为20J / m 2或更高; （D）具有羟基的改性聚烯烃聚合物，所述改性聚烯烃聚合物的含羟基不饱和化合物的含量为0.5-7.0重量％; （E）具有至少一个末端极性基团的低聚物，所述低聚物的数均分子量为300至10,000; 和（F）平均粒径为5μm以下的滑石。