Electrostatic chuck, and method of and apparatus for processing sample
    2.
    发明授权
    Electrostatic chuck, and method of and apparatus for processing sample 失效
    静电吸盘,以及样品处理方法及装置

    公开(公告)号:US5946184A

    公开(公告)日:1999-08-31

    申请号:US927278

    申请日:1997-09-11

    IPC分类号: H01L21/683 H02N13/00

    CPC分类号: H01L21/6833 Y10T279/23

    摘要: An electrostatic chuck includes a pair of electrodes having different polarities; and a dielectric film, formed on top surfaces of the pair of electrodes, on which a sample is to be electrostatically attracted and held when a DC voltage is applied between the pair of electrodes; wherein the respective amounts of electric charges stored on attracting portions of the dielectric film corresponding to the pair of electrodes, directly before stopping supply of the DC voltage applied between the pair of electrodes, are substantially equal to each other. With this chuck, the electric charges stored on the attracting portions of the dielectric film after stopping supply of the DC voltage can be eliminated due to the balance between the electric charges having different polarities. The electrostatic chuck is subjected to a significantly reduced residual attracting force.

    摘要翻译: 静电卡盘包括具有不同极性的一对电极; 以及形成在所述一对电极的顶表面上的电介质膜,当在所述一对电极之间施加直流电压时,待静电吸引和保持样品的电介质膜; 其特征在于,在停止施加在所述一对电极之间的直流电压的供给之前,直接在与所述一对电极对应的所述电介质膜的吸引部分上存储的各种电荷量基本相等。 利用该卡盘,可以通过在极性不同的电荷之间的平衡来消除在停止供给直流电压之后存储在电介质膜的吸引部分上的电荷。 静电吸盘受到显着降低的残留吸引力。

    Electrostatic chuck, and method of and apparatus for processing sample using the chuck
    3.
    发明授权
    Electrostatic chuck, and method of and apparatus for processing sample using the chuck 失效
    静电吸盘,使用卡盘处理样品的方法和设备

    公开(公告)号:US06243251B1

    公开(公告)日:2001-06-05

    申请号:US09382779

    申请日:1999-08-25

    IPC分类号: H02N1300

    CPC分类号: H01L21/6833 Y10T279/23

    摘要: An electrostatic chuck includes a pair of electrodes having different polarities, and a dielectric film, formed on top surfaces of the pair of electrodes, on which a sample to be electrostatically attracted and held when a DC voltage is applied between the pair of electrodes, wherein the respective amounts of electric charges stored on attracting portions of the dielectric film corresponding to the pair of electrodes, directly before stopping supply of the DC voltage applied between the pair of electrodes, are substantially equal to each other. With this chuck, the electric charges stored on the attracting portions of the dielectric film after stopping supply of the DC voltage can be eliminated due to the balance between the electric charges having different polarities. The electrostatic chuck is subjected to a significantly reduced residual attracting force.

    摘要翻译: 静电卡盘包括具有不同极性的一对电极和形成在一对电极的顶表面上的电介质膜,当在一对电极之间施加直流电压时,待静电吸引并保持的样品,其中 在停止施加在该对电极之间的直流电压的供给之前,直接在与该对电极对应的电介质膜的吸引部分上存储的电荷的相应量基本相等。 利用该卡盘,可以通过在极性不同的电荷之间的平衡来消除在停止供给直流电压之后存储在电介质膜的吸引部分上的电荷。 静电吸盘受到显着降低的残留吸引力。

    Electrostatic chuck, and method of and apparatus for processing sample using the chuck

    公开(公告)号:US06373681B1

    公开(公告)日:2002-04-16

    申请号:US09833557

    申请日:2001-04-13

    IPC分类号: H02N1300

    摘要: A sample processing method includes electrostatically attracting and holding a sample on an electrostatic chuck which includes a pair of electrodes having different polarities and being concentrically disposed, and a dielectric film formed on top surfaces of the pair of electrodes, by applying a DC voltage between the pair of electrodes. The sample which is attracted and held on the chuck through the dielectric film is subjected to plasma processing while applying a bias voltage. The application of the bias voltage applied during plasma processing is stopped after termination of processing the sample, and an unbalance between electric charges stored on attracting portions of the dielectric film formed on the electrodes is eliminated by continuing generation of the plasma for a specific time after stopping the application of the bias voltage. The plasma is extinguished after an elapse of the specific time.

    Plasma processing apparatus
    6.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US08940128B2

    公开(公告)日:2015-01-27

    申请号:US12853427

    申请日:2010-08-10

    摘要: The invention aims at suppressing the self bias generated at the surface of the inner wall of the vacuum processing chamber, to thereby suppress the chipping of the inner wall surface of the vacuum processing chamber or the consumption of the inner parts of the vacuum processing chamber. The present invention provides a plasma processing apparatus comprising a vacuum processing chamber, a vacuum processing chamber lid sealing an upper portion of the vacuum processing chamber, an induction antenna, a Faraday shield disposed between the induction antenna and the vacuum processing chamber lid, and a high frequency power supply for supplying high frequency power to the induction antenna, wherein the induction antenna is divided into two or more parts, the Faraday shield is divided into a division number corresponding to the division number of the induction antenna, and high frequency voltages are applied thereto via a matching box from the one high frequency power supply.

    摘要翻译: 本发明旨在抑制在真空处理室的内壁表面产生的自偏压,从而抑制真空处理室的内壁表面的碎裂或真空处理室的内部部分的消耗。 本发明提供一种等离子体处理装置,其包括真空处理室,密封真空处理室的上部的真空处理室盖,感应天线,设置在感应天线和真空处理室盖之间的法拉第屏蔽,以及 用于向感应天线提供高频电力的高频电源,其中感应天线被分成两部分或更多部分,法拉第屏蔽被分成对应于感应天线的分割数的分频数,高频电压是 通过匹配盒从一个高频电源施加到其上。

    APPARATUS AND METHOD FOR PLASMA ETCHING
    7.
    发明申请
    APPARATUS AND METHOD FOR PLASMA ETCHING 失效
    用于等离子体蚀刻的装置和方法

    公开(公告)号:US20070184563A1

    公开(公告)日:2007-08-09

    申请号:US11735657

    申请日:2007-04-16

    摘要: A plasma etching method for a plasma etching apparatus including: a processing chamber for performing plasma etching on an object to be processed; a first gas supply source; a second gas supply source; a first gas inlet for introducing a processing gas into the processing chamber; a second gas inlet for introducing a processing gas into the processing chamber; a flow rate regulator for regulating the flow rate of the processing gas; and a gas shunt for dividing the first processing gas into a plurality of portions, wherein the second processing gas is merged with at least one part between the gas shunt and the first gas inlet and between the gas shunt and the second gas inlet.

    摘要翻译: 一种用于等离子体蚀刻装置的等离子体蚀刻方法,包括:处理室,用于对被处理物体进行等离子体蚀刻; 第一气体供应源; 第二气体供应源; 用于将处理气体引入处理室的第一气体入口; 用于将处理气体引入所述处理室的第二气体入口; 用于调节处理气体的流量的流量调节器; 以及用于将所述第一处理气体分成多个部分的气体分流器,其中所述第二处理气体与所述气体分流器和所述第一气体入口之间以及所述气体分流器和所述第二气体入口之间的至少一部分合并。

    Wafer stage for wafer processing apparatus and wafer processing method
    8.
    发明授权
    Wafer stage for wafer processing apparatus and wafer processing method 失效
    晶圆处理装置的晶片台和晶圆加工方法

    公开(公告)号:US06646233B2

    公开(公告)日:2003-11-11

    申请号:US10087747

    申请日:2002-03-05

    IPC分类号: F27B514

    CPC分类号: H01L21/67109 H01L21/6831

    摘要: A wafer stage for use in wafer processing apparatus which comprises a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate that is attached onto the liquid cooling jacket and has therein a heater and an electrode for electrostatic chuck use, the wafer stage performing wafer processing while letting a wafer be mounted on the ceramic plate, wherein the liquid cooling jacket permits attachment of the ceramic plate through a coolant gas circulating gap as formed over the liquid cooling jacket while disposing between the liquid cooling jacket and the ceramic plate more than one heat resistant seal material containing therein an elastic body for sealing the coolant gas.

    摘要翻译: 用于晶片处理装置的晶片台,其包括具有内置冷却剂液体循环路径的液体冷却套和附接到液体冷却套上的陶瓷板,并且其中具有用于静电卡盘的加热器和电极, 在将晶片安装在陶瓷板上的同时进行晶片处理的晶片台,其中液体冷却套管允许通过在液体冷却套上形成的冷却剂气体循环间隙来连接陶瓷板,同时设置在液体冷却套和陶瓷之间 在其上容纳多个耐热密封材料,其中包含用于密封冷却剂气体的弹性体。

    Plasma treatment device
    9.
    发明授权
    Plasma treatment device 有权
    等离子体处理装置

    公开(公告)号:US06245202B1

    公开(公告)日:2001-06-12

    申请号:US09155906

    申请日:1998-10-08

    IPC分类号: C23C1434

    摘要: In a high-frequency inductive plasma etching apparatus, a space between an antenna to which a high-frequency power is fed and a processing chamber is insulated with an insulating material having a suitable thickness, while the antenna is protected from a plasma or a reactive gas for plasma processing and the surface of a side in contact with the plasma is covered by an insulating material such as alumina and quartz. The insulating material and the antenna are placed in a vacuum. Since the processing chamber which contains the insulating material and the antenna can take a pressure differential with atmospheric pressure, all that is required of the insulating material is its capacity to take the plasma atmosphere. Consequently, the insulating material can be made thin and the plasma is generated uniformly in high density. Heat generated at the antenna is dissipated to the outside either by making a gap between the antenna and its surroundings as small as possible or by bringing the pressure of the gap closer to the pressure in the processing chamber. Alternatively, several Torr of a non-reactive heat-transfer promoting gas such as He gas may be introduced into fine gaps formed around the antenna to dissipate heat generated at the antenna.

    摘要翻译: 在高频感应等离子体蚀刻装置中,馈送高频功率的天线与处理室之间的空间与具有适当厚度的绝缘材料绝缘,同时天线被保护免受等离子体或反应性 用于等离子体处理的气体和与等离子体接触的一侧的表面被绝缘材料如氧化铝和石英覆盖。 将绝缘材料和天线置于真空中。 由于包含绝缘材料和天线的处理室可以承受大气压力的压力差,所以绝缘材料所需要的就是其承受等离子体气氛的能力。 因此,可以使绝缘材料变薄,并且以高密度均匀地产生等离子体。 通过在天线及其周围环境之间尽可能小的间隙或通过使间隙的压力更接近处理室中的压力而将在天线处产生的热量散发到外部。 或者,可以将诸如He气体的非反应性热传递促进气体的几个Torr引入形成在天线周围的细小间隙中,以散发在天线处产生的热量。