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公开(公告)号：US5935314A
公开(公告)日：1999-08-10
申请号：US919344
申请日：1997-08-28
IPC分类号： C08K3/00 , C08K7/16 , C08K7/18 , C08L63/00 , C09C1/30 , C09C3/04 , H01L23/29 , H01L23/31 , C04B14/00
CPC分类号： H01L23/295 , C08K7/18 , C09C1/3009 , C09C3/04 , C01P2004/32 , C01P2004/61 , C01P2006/12 , C01P2006/22 , C01P2006/80 , H01L2924/0002 , Y10T428/12528
摘要： By removing a fraction of fine particles having a particle size of less than 2 .mu.m from starting inorganic filler particles having a mean particle size of 10-50 .mu.m and adding thereto particles having a mean particle size of 0.1-2 .mu.m and a specific surface area of 3-10 m.sup.2 /g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 .mu.m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.
摘要翻译： 通过从平均粒径为10-50μm的起始无机填料颗粒中除去一小部分粒径小于2μm的细颗粒，并加入平均粒度为0.1-2μm的颗粒和 比表面积为3-10m2 / g（BET），得到平均粒径为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。
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公开(公告)号：US5940688A
公开(公告)日：1999-08-17
申请号：US919242
申请日：1997-08-28
IPC分类号： C08K3/36 , H01B3/40 , H01L23/29 , H01L21/302 , C08L63/00 , H01L21/463
CPC分类号： H01L23/293 , C08K3/36 , H01B3/40 , H01L2924/0002
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and 80-90 wt % of a particulate inorganic filler, fine particles having a particle size of less than 3 .mu.m account for 10-40 wt % of the inorganic filler, and the inorganic filler has a specific surface area of less than 2.5 m.sup.2 /g as measured by a nitrogen adsorption BET method. The inorganic filler satisfies that when a blend of a bisphenol F type liquid epoxy resin having a viscosity of 30-45 poises at 25.degree. C. as measured by Gardner-Holdt method with 75 wt % of the inorganic filler is measured for viscosity at 25.degree. C. by means of an E type viscometer, the viscosity at a shear rate of 0.6 s.sub.-1 is less than 50,000 poises and the ratio of the viscosity at a shear rate of 0.6 s.sup.-1 to the viscosity at a share rate of 10 s.sup.-1 is less than 2.5/1. The epoxy resin composition has a low melt viscosity enough to mold on semiconductor devices without die pad and wire deformation.
摘要翻译： 在包含环氧树脂，固化剂和80-90重量％的颗粒状无机填料的环氧树脂组合物中，粒径小于3微米的微粒占无机填料的10-40重量％ 并且通过氮吸附BET法测量的无机填料的比表面积小于2.5m 2 / g。 无机填料满足当通过Gardner-Holdt法测定的25℃粘度为30-45泊的双酚F型液体环氧树脂与75重量％的无机填料的共混物在25℃下测定粘度 通过E型粘度计，剪切速率为0.6s-1时的粘度小于50,000泊，剪切速率为0.6s-1时的粘度与粘度分别为 10 s-1小于2.5 / 1。 环氧树脂组合物具有低的熔融粘度，足以在半导体器件上模制而没有模具垫和线变形。
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公开(公告)号：US06207296B1
公开(公告)日：2001-03-27
申请号：US09326588
申请日：1999-06-07
IPC分类号： H01L2912
CPC分类号： H01L23/295 , C01P2004/32 , C01P2004/61 , C01P2006/12 , C01P2006/22 , C01P2006/80 , C08K7/18 , C09C1/3009 , C09C3/04 , H01L2924/0002 , Y10T428/12528 , C08L63/00 , H01L2924/00
摘要： By removing a fraction of fine particles having a particle size of less than 2 &mgr;m from starting inorganic filler particles having a mean particle size of 10-50 mm and adding thereto particles having a mean particle size of 0.1-2 &mgr;m and a specific surface area of 3-10 m2/g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 &mgr;m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.
摘要翻译： 通过从平均粒径为10-50mm的起始无机填料颗粒中除去粒径小于2μm的一部分细粒，并加入平均粒径为0.1-2μm的颗粒和比表面积 为3-10m 2 / g（BET），得到平均粒度为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。
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4.发明授权
公开(公告)号：US5994785A
公开(公告)日：1999-11-30
申请号：US305453
申请日：1999-05-06
CPC分类号： H01L23/293 , C08G59/18 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70% by weight of an inorganic filler, at least one of the epoxy resin and the curing agent has such a molecular weight distribution as to provide an average dispersity Mw/Mn of less than 1.6, a two-nucleus compound content of less than 8% by weight and a seven- and more-nucleus compound content of less than 32% by weight. When the composition is cured at 180.degree. C. for 90 seconds into a primary product having Tg1 and the primary product postcured at 180.degree. C. for 5 hours into a secondary product having Tg2, the relationship: (Tg2-Tg1)/Tg2
摘要翻译： 在包含环氧树脂，固化剂和至少70重量％的无机填料的环氧树脂组合物中，环氧树脂和固化剂中的至少一种具有这样的分子量分布，以提供平均分散度Mw / Mn小于1.6，双核化合物含量小于8重量％，核多化合物含量小于32重量％。 当组合物在180℃下固化90秒，使其具有Tg1的初级产物和在180℃下后固化的初级产物5小时，形成具有Tg2的二次产物，其关系式为：（Tg2-Tg1）/ Tg2 < 0.1满足。 组合物快速固化并有效模塑，固化成可靠的产品，不需要后固化。
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5.发明授权
公开(公告)号：US5645864A
公开(公告)日：1997-07-08
申请号：US639331
申请日：1996-04-25
申请人： Noriaki Higuchi
发明人： Noriaki Higuchi
CPC分类号： B29C45/14655 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , Y10S425/047
摘要： A resin encapsulating molding die for manufacturing a semiconductor device includes a cavity piece having a cavity on which a lead frame with a mounted semiconductor element may be placed, with the semiconductor element in the cavity, and a gate piece having a gate portion including a sub-runner through which a molten resin for encapsulating the semiconductor element is introduced into the cavity, the gate piece being detachable from the cavity piece. The molding die also includes a sealing dam disposed adjacent the sub-runner for blocking flow of molten resin from the sub-runner toward leads of the lead frame. The sealing dam may be a clamp structure for clamping the leads closest to the gate portion, the sealing dam and cavity piece may be a continuous unitary structure, and the sealing dam may have a parting surface substantially coplanar with a parting surface of the cavity piece.
摘要翻译： 一种用于制造半导体器件的树脂封装模制模具，包括具有空腔的空腔件，其中可以放置具有安装的半导体元件的引线框架，半导体元件位于空腔中，以及栅极片，具有包括子部分的栅极部分 通过其将用于封装半导体元件的熔融树脂引入到空腔中，门片可从腔体件拆卸。 成型模具还包括邻近子流道设置的密封坝，用于阻止熔融树脂从引线框架的引线流向副流道。 密封坝可以是用于夹紧最靠近浇口部分的引线的夹紧结构，密封坝和空腔件可以是连续的单一结构，并且密封坝可以具有与空腔件的分离表面基本上共面的分型表面 。
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公开(公告)号：US5412157A
公开(公告)日：1995-05-02
申请号：US91929
申请日：1993-07-16
申请人： Hideya Yagoura , Noriaki Higuchi , Haruo Shimamoto
发明人： Hideya Yagoura , Noriaki Higuchi , Haruo Shimamoto
CPC分类号： H01L21/4842 , H01L23/49558 , H05K3/3426 , H01L2924/0002 , H05K2201/10424 , H05K2201/10689 , H05K3/3489 , Y02P70/613 , Y10T29/4922
摘要： A semiconductor device includes a molded resin encapsulating a semiconductor chip, outer leads extending from the molded resin and having free ends, and a resin layer connecting and supporting the outer leads along the entire length of the outer leads. The resin layer may have an activating ability for soldering. A method for manufacturing a semiconductor device includes preparing a semiconductor device having a molded resin and a plurality of outer lead portions extending from the molded resin and connected to a lead frame, forming a resin film on and between the outer lead portions; cutting the lead portions to provide cantilevered outer leads having free ends; lead-forming the outer leads with lead-forming dies while heating the resin film to form a resin layer connecting and supporting the outer leads along the entire lengths of the outer leads, and taking the semiconductor device out of the lead-forming dies after the resin layer has been cured.
摘要翻译： 半导体器件包括封装半导体芯片的模制树脂，从模制树脂延伸并具有自由端的外部引线以及沿外部引线的整个长度连接和支撑外部引线的树脂层。 树脂层可以具有用于焊接的活化能力。 一种制造半导体器件的方法包括制备具有模制树脂的半导体器件和从模制树脂延伸并连接到引线框架的多个外引线部分，在外引线部分之间和之间形成树脂膜; 切割引线部分以提供具有自由端的悬臂式外引线; 在加热树脂膜的同时对引线形成外引线，以形成沿着外引线的整个长度连接和支撑外引线的树脂层，并且将半导体器件从引线成形模具中取出 树脂层已经固化。
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7.发明授权
公开(公告)号：US4994224A
公开(公告)日：1991-02-19
申请号：US362467
申请日：1989-03-16
CPC分类号： B29C45/14016 , B29C45/1418 , B29C45/42 , B29C2045/14213 , B29C2045/14286
摘要： An injection molding device and a method for manufacturing a foil decorated molding use a first half of a mold and a second half of a mold with a transfer foil having a transfer layer on a substrate film transported into a space between the first half of the mold and the second half of the mold. A heating and removing device has a heating device and a molding removal device moved into the space to hold, with the removal device, a molding attached temporarily to the first half of the mold, and to heat the foil at the side of the second half of the mold with the heating device. When the first and second halves of the mold are closed, the heating and removing device is moved outside the space to remove the molding from the removal device.
摘要翻译： PCT No.PCT / JP88 / 00734 Sec。 371日期：1989年3月16日 102（e）日期1989年3月16日PCT Filed 1988年7月21日PCT公布。 第WO89 / 00912号公报 日本1989年2月9日。注射成型装置和箔装饰成型方法使用具有转印层的模具的第一半和模具的后半部分，所述转印箔具有转印层，所述转印箔具有转印层 在模具的前半部分和模具的后半部分之间。 加热去除装置具有加热装置和移动到空间中的成型除去装置，通过移除装置将模具临时悬挂到模具的前半部分，并且在第二半部分的一侧加热箔片 的模具与加热装置。 当模具的第一和第二半部闭合时，加热和移除装置移动到空间外部以从移除装置移除模制品。
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