公开(公告)号：US20060097029A1

公开(公告)日：2006-05-11

申请号：US11062959

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Yukio Ozaki

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K1/0016 ,  B23K2101/40

摘要： A method of flip-chip bonding can favorably activate the bonding surfaces and remove oxide films when bonding pads and bumps of a semiconductor chip and a substrate and avoids problems such as the bumps being excessively flattened and the bonds between connection terminals being destroyed by subsequent ultrasonic vibration. The method includes an aligning step 2 that aligns and places in contact bumps or pads of a semiconductor chip and pads or bumps of a substrate, a leveling step 4 that levels the shapes of the bumps by pressing together the semiconductor chip and the substrate with a first predetermined load, a bonding preparation step 6 that applies ultrasonic vibration to the semiconductor chip and/or the substrate so that the amplitude of the ultrasonic vibration gradually increases while the first predetermined load weakens, and a bonding step 8 that bonds the bumps and pads by applying ultrasonic vibration to the semiconductor chip and/or the substrate in a state where the semiconductor chip and the substrate are pressed together with a second predetermined load that is smaller than the first predetermined load.

摘要翻译： 倒装芯片接合的方法可以有利地激活接合表面并且在接合半导体芯片和基板的焊盘和凸点时去除氧化膜，并且避免诸如凸块过度平坦的问题，并且连接端子之间的接合被随后的超声波破坏 振动。 该方法包括：对准步骤2，其对准和放置在半导体芯片的接触凸块或焊盘以及衬底的焊盘或凸块;调平步骤4，其通过将半导体芯片和衬底压在一起来调整凸块的形状 第一预定负载，对半导体芯片和/或基板施加超声波振动的接合准备步骤6，使得当第一预定负载变弱时超声波振动的幅度逐渐增加;以及接合步骤8，其将凸块和焊盘 通过在半导体芯片和基板以比第一预定负载小的第二预定负载被压在一起的状态下，向半导体芯片和/或基板施加超声波振动。

公开(公告)号：US20090146652A1

公开(公告)日：2009-06-11

申请号：US12292650

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US07424966B2

公开(公告)日：2008-09-16

申请号：US11062789

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K1/06 ,  B23K5/20 ,  B23K37/00

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

公开(公告)号：US20060090833A1

公开(公告)日：2006-05-04

申请号：US11041375

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B32B37/00 ,  B29C65/00 ,  B29C65/08

CPC分类号： B23K20/106 ,  B23K20/10 ,  B23K2101/42 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014

摘要： The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

摘要翻译： 超声波安装方法能够将电子部件的凸块均匀地接合到电路板，并且提高超声波安装电子部件的可靠性。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 超声波振动沿平行于电子部件的表面的方向施加，并且负载与超声波振动的振动循环一起垂直地施加到电子部件的表面。

公开(公告)号：US20060030076A1

公开(公告)日：2006-02-09

申请号：US11246267

申请日：2005-10-11

申请人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

IPC分类号： H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.

摘要翻译： 本发明的半导体器件能够限制合金化金属和改善半导体芯片和安装基板之间的电连接。 半导体器件包括：具有端子部分的半导体芯片; 以及用于电连接的凸块，在端子部分处形成凸点。 每个凸块由包括芯构件和护套构件的双层线制成，并且通过柱凸块接合工艺形成。

公开(公告)号：US20090146653A1

公开(公告)日：2009-06-11

申请号：US12292651

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

公开(公告)号：US07416921B2

公开(公告)日：2008-08-26

申请号：US11066483

申请日：2005-02-28

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Kimio Nakamura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Kimio Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75753 ,  H01L2224/81205 ,  H01L2224/81232 ,  H01L2224/81801 ,  H01L2224/83099 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/19043 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.

摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。

公开(公告)号：US20060099809A1

公开(公告)日：2006-05-11

申请号：US11066483

申请日：2005-02-28

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Kimio Nakamura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Kimio Nakamura

IPC分类号： H01L21/44

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75753 ,  H01L2224/81205 ,  H01L2224/81232 ,  H01L2224/81801 ,  H01L2224/83099 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/19043 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.

摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。

公开(公告)号：US07514788B2

公开(公告)日：2009-04-07

申请号：US11979165

申请日：2007-10-31

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L21/302

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US07471081B2

公开(公告)日：2008-12-30

申请号：US11326598

申请日：2006-01-06

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。