公开(公告)号：US06630628B2

公开(公告)日：2003-10-07

申请号：US10072261

申请日：2002-02-07

申请人： Nurwati S Devnani ,  William S Burton ,  Sari K Christensen

发明人： Nurwati S Devnani ,  William S Burton ,  Sari K Christensen

IPC分类号： H05K103

CPC分类号： H05K1/0224 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0253 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09672 ,  H05K2201/09681 ,  H05K2203/1178 ,  Y10T428/24917

摘要： A high-performance, integrated circuit interconnection laminate. Power/ground layers in laminates fabricated with open areas to permit out gassing of gases generated during high temperature lamination are located such that they do not lie under/over critical traces on signal layers. This placement of the open areas enables a reduction in cross-talk between signal layers lying on opposite sides of a power/ground layer and a reduction in signal delay.

摘要翻译： 高性能，集成电路互连层压板。 在开放区域制造的层压板中的电源/接地层被放置成允许在高温层压期间产生的气体的放气，使得它们不位于信号层上的/超过临界迹线之上。 这种开放区域的放置使得能够减少位于电源/接地层的相对侧上的信号层之间的串扰，并减少信号延迟。