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公开(公告)号：US10375338B2
公开(公告)日：2019-08-06
申请号：US15421881
申请日：2017-02-01
Applicant: OmniVision Technologies, Inc.
Inventor： Zheng Yang , Hiroaki Ebihara , Chun-Ming Tang , Chao-Fang Tsai , Rui Wang , Tiejun Dai
IPC: H04N5/378 , H04N5/369 , H04N5/374 , H01L27/146 , H04N5/3745
Abstract: A hybrid bonded image sensor has a photodiode die with macrocells having at least one photodiode and a bond contact; a supporting circuitry die with multiple supercells, each supercell having at least one macrocell unit having a bond contact coupled to the bond contact of a macrocell of the photodiode die. Each macrocell unit lies within a supercell and has a reset transistor adapted to reset photodiodes of the macrocell of the photodiode die. Each supercell has at least one common source amplifier adapted to receive signal from the bond contact of a selected macrocell unit of the supercell, the common source amplifier coupled to drive a column line through a selectable source follower. In embodiments, the common source amplifiers of several supercells drive the selectable source follower through a distributed differential amplifier.
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公开(公告)号：US10263031B2
公开(公告)日：2019-04-16
申请号：US15421911
申请日：2017-02-01
Applicant: OmniVision Technologies, Inc.
Inventor： Rui Wang , Hiroaki Ebihara , Zheng Yang , Chun-Ming Tang , Chao-Fang Tsai , Tiejun Dai
IPC: H01J40/14 , H01L27/146 , H04N5/3745 , H04N5/369
Abstract: A hybrid-bonded image sensor has a photodiode die with multiple macrocells; each macrocell has at least one photodiode and a coupling region. The coupling regions couple to a coupling region of a macrocell unit of a supporting circuitry die where they feed an input of an amplifier and a feedback capacitor. The feedback capacitor also couples to output of the amplifier, and the amplifier inverts between the input and the output. The method includes resetting a photodiode of the photodiode die; coupling signal from photodiode through the bond point to the supporting circuitry die to a feedback capacitor and to an input of the amplifier, the feedback capacitor also coupled to an inverting output of the amplifier; and amplifying the signal with the amplifier, where a capacitance of the feedback capacitor determines a gain of the amplifier.
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公开(公告)号：US09961292B1
公开(公告)日：2018-05-01
申请号：US15420531
申请日：2017-01-31
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Liping Deng , Zheng Yang , Chun-Ming Tang , Tiejun Dai
CPC classification number: H03F3/082 , H03F1/0261 , H03F1/223 , H04N5/355 , H04N5/3745
Abstract: A pixel circuit includes a photodiode, and a transfer transistor coupled to the photodiode. A floating diffusion is coupled to the transfer transistor coupled to transfer image charge from the photodiode to the floating diffusion. An amplifier circuit includes an input coupled to the floating diffusion, an output coupled to generate an image data signal of the pixel circuit, and a variable bias terminal coupled to receive a variable bias signal. A reset switch is coupled between the output and input of the amplifier circuit to reset the amplifier circuit in response to a reset signal. A variable bias generator circuit is coupled to generate the variable bias signal in response to a reset signal to transition the variable bias signal from a first bias signal value to a second bias signal value in response to a transition of the reset signal from an active state to an inactive state.
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Patent Agency Ranking
公开(公告)号：US09712774B1
公开(公告)日：2017-07-18
申请号：US14996141
申请日：2016-01-14
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Tianjia Sun , Qingfei Chen , Chun-Ming Tang , Jingyi Liu
IPC: H04N5/378 , H04N5/374 , G06T1/20 , H01L27/146 , H04N5/363 , H04N5/365 , H04N5/3745
CPC classification number: H04N5/378 , H01L27/14641 , H01L27/14643 , H04N5/3577 , H04N5/363 , H04N5/3658 , H04N5/37455
Abstract: A method of implementing dynamic ground sharing in an image sensor with pipeline architecture starts with a pixel array capturing image data. Pixel array includes pixels to generate pixel data signals, respectively. A readout circuitry acquires the image data from a row in the pixel array. An analog-to-digital conversion (ADC) circuitry included in the readout circuitry samples the image data from the row to obtain sampled input data. When the ADC circuitry is sampling, a ground sharing switch is closed to couple the pixel array and the ADC circuitry to a common ground. When the ADC circuitry is not sampling, the ground sharing switch is open to separate the pixel array and the ADC circuitry from the common ground. The ADC circuitry converts the sampled image data from analog to digital to obtain an ADC output. Other embodiments are described.
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公开(公告)号：US09843753B2
公开(公告)日：2017-12-12
申请号：US14930099
申请日：2015-11-02
Applicant: OmniVision Technologies, Inc.
Inventor： Tianjia Sun , Chun-Ming Tang , Jingyi Liu , Xin Hu
CPC classification number: H04N5/3698 , G03B7/26 , H02M3/156 , H04N5/23241
Abstract: An imaging system includes an image sensor and a row-period compensator. The image sensor includes an array of photosensitive pixels and electrical circuitry for controlling the array of photosensitive pixels and for reading accumulated electrical charge therefrom. The electrical circuitry is at least partially powered from a positive power rail and a negative power rail. The row-period compensator is for compensating for a change in current drawn by the electrical circuitry during at least part of a row-period of the image sensor, and the row-period compensator is electrically coupled between the positive and negative power rails. A method for compensating for a change in current drawn by electrical circuitry of an image sensor includes controlling a magnitude of compensation current drawn by a row-period compensator, to compensate for a change in current drawn by the electrical circuitry of the image sensor.
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公开(公告)号：US20170127003A1
公开(公告)日：2017-05-04
申请号：US14930099
申请日：2015-11-02
Applicant: OmniVision Technologies, Inc.
Inventor： Tianjia Sun , Chun-Ming Tang , Jingyi Liu , Xin Hu
CPC classification number: H04N5/3698 , G03B7/26 , H02M3/156 , H04N5/23241
Abstract: An imaging system includes an image sensor and a row-period compensator. The image sensor includes an array of photosensitive pixels and electrical circuitry for controlling the array of photosensitive pixels and for reading accumulated electrical charge therefrom. The electrical circuitry is at least partially powered from a positive power rail and a negative power rail. The row-period compensator is for compensating for a change in current drawn by the electrical circuitry during at least part of a row-period of the image sensor, and the row-period compensator is electrically coupled between the positive and negative power rails. A method for compensating for a change in current drawn by electrical circuitry of an image sensor includes controlling a magnitude of compensation current drawn by a row-period compensator, to compensate for a change in current drawn by the electrical circuitry of the image sensor.
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公开(公告)号：US09859312B1
公开(公告)日：2018-01-02
申请号：US15427928
申请日：2017-02-08
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Rui Wang , Hiroaki Ebihara , Zheng Yang , Chun-Ming Tang , Chao-Fang Tsai , Tiejun Dai
IPC: H01L27/146
CPC classification number: H01L27/14603 , H01L27/14634 , H01L27/14636 , H01L27/1464
Abstract: An image sensor includes a photodiode disposed in a first semiconductor material, and the photodiode is positioned to absorb image light through the backside of the first semiconductor material. A first floating diffusion is disposed proximate to the photodiode and coupled to receive image charge from the photodiode in response to a transfer signal applied to a transfer gate disposed between the photodiode and the first floating diffusion. A second semiconductor material, including a second floating diffusion, is disposed proximate to the frontside of the first semiconductor material. A dielectric material is disposed between the first semiconductor material and the second semiconductor material, and includes a first bonding via extending from the first floating diffusion to the second floating diffusion, a second bonding via disposed laterally proximate to the first bonding via, and a third bonding via disposed laterally proximate to the first bonding via.
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公开(公告)号：US20170208276A1
公开(公告)日：2017-07-20
申请号：US14996141
申请日：2016-01-14
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Tianjia Sun , Qingfei Chen , Chun-Ming Tang , Jingyi Liu
IPC: H04N5/378 , G06T1/20 , H01L27/146 , H04N5/374
CPC classification number: H04N5/378 , H01L27/14641 , H01L27/14643 , H04N5/3577 , H04N5/363 , H04N5/3658 , H04N5/37455
Abstract: A method of implementing dynamic ground sharing in an image sensor with pipeline architecture starts with a pixel array capturing image data. Pixel array includes pixels to generate pixel data signals, respectively. A readout circuitry acquires the image data from a row in the pixel array. An analog-to-digital conversion (ADC) circuitry included in the readout circuitry samples the image data from the row to obtain sampled input data. When the ADC circuitry is sampling, a ground sharing switch is closed to couple the pixel array and the ADC circuitry to a common ground. When the ADC circuitry is not sampling, the ground sharing switch is open to separate the pixel array and the ADC circuitry from the common ground. The ADC circuitry converts the sampled image data from analog to digital to obtain an ADC output. Other embodiments are described.
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