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公开(公告)号:US20240355858A1
公开(公告)日:2024-10-24
申请号:US18136762
申请日:2023-04-19
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Takayuki Goto , Kazufumi Watanabe , Rui Wang
IPC: H01L27/146 , H01L23/00
CPC classification number: H01L27/14636 , H01L24/05 , H01L24/06 , H01L24/08 , H01L27/14634 , H01L2224/05551 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05571 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/0603 , H01L2224/06051 , H01L2224/0615 , H01L2224/0616 , H01L2224/06505 , H01L2224/08121 , H01L2224/08145 , H01L2224/08501
Abstract: A stacked semiconductor device comprising a first semiconductor substrate, a second semiconductor substrate, an insulating medium disposed between the first semiconductor substrate and the second semiconductor substrate, a plurality of connection pads including a first connection pad and a second connection pad, a first connection pad shield structure, and a second connection pad shield structure. The plurality of connection pads is disposed within the insulating medium and configured to provide one or more electrical connections extending between the first semiconductor substrate and the second semiconductor substrate. The first connection pad is disposed between the first connection pad shield structure and the second connection pad shield structure.
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公开(公告)号:US20240355765A1
公开(公告)日:2024-10-24
申请号:US18136757
申请日:2023-04-19
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Takayuki Goto , Kazufumi Watanabe , Rui Wang
IPC: H01L23/00 , H01L27/146
CPC classification number: H01L24/06 , H01L24/05 , H01L24/08 , H01L27/14634 , H01L27/14636 , H01L2224/05552 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/0603 , H01L2224/06051 , H01L2224/0615 , H01L2224/0616 , H01L2224/06177 , H01L2224/06505 , H01L2224/06517 , H01L2224/08121 , H01L2224/08145 , H01L2224/08501 , H01L2224/09505
Abstract: A stacked semiconductor device comprising a first semiconductor substrate, a second semiconductor substrate, an insulating medium disposed between the first semiconductor substrate and the second semiconductor substrate, a plurality of connection pads including a first connection pad and a second connection pad adjacent to the first connection pad, and a first connection pad shield structure disposed within the insulating medium between at least the first connection pad and the second connection pad is described. The plurality of connection pads is disposed within the insulating medium and configured to provide one or more electrical connections extending between the first semiconductor substrate and the second semiconductor substrate.
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公开(公告)号:US11871135B2
公开(公告)日:2024-01-09
申请号:US17592389
申请日:2022-02-03
Applicant: OmniVision Technologies, Inc.
Inventor: Selcuk Sen , Liang Zuo , Rui Wang , Xuelian Liu , Min Qu , Hiroaki Ebihara
IPC: H04N25/779 , H01L27/146 , H04N25/621 , H04N25/76 , H04N25/60 , H04N25/704 , H04N25/42 , H04N25/13
CPC classification number: H04N25/779 , H01L27/14609 , H01L27/14643 , H04N25/42 , H04N25/60 , H04N25/623 , H04N25/704 , H04N25/76 , H04N25/134
Abstract: In an embodiment, a method of reducing resistance-capacitance delay along photodiode transfer lines of an image sensor includes forking a plurality of photodiode transfer lines each into a plurality of sublines coupled together and to a first decoder-driver at a first end of each subline; and distributing selection transistors of a plurality of multiple-photodiode cells among the plurality of sublines. In embodiments, the sublines may be recombined at a second end of the sublines and driven by a second decoder-driver at the second end.
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公开(公告)号:US11706543B2
公开(公告)日:2023-07-18
申请号:US17531465
申请日:2021-11-19
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Chengcheng Xu , Rui Wang , Bi Yuan , Liang Zuo
IPC: H04N5/232 , H04N25/75 , H04N25/74 , H04N25/76 , H04N25/709 , H04N25/772 , H04N25/766 , H04N25/50
CPC classification number: H04N25/75 , H04N25/709 , H04N25/74 , H04N25/76 , H04N25/766 , H04N25/772 , H04N25/50
Abstract: An image sensing device includes an image sensing circuit, a voltage supply grid, bitlines, and a control circuit. The image sensing circuit includes pixels arranged in rows and columns. Each one of the bitlines is coupled to a corresponding one of the columns. The voltage supply grid is coupled to the pixels. The control circuit is coupled to output at least a row select signal and a transfer signal to the rows. Each one of the rows is selectively coupled to the bitlines to selectively output image data signals in response to the row select signal and the transfer signal. Each one of the rows is further selectively coupled to the bitlines to selectively clamp the bitlines in response to the row select signal and the transfer signal. Each one of the rows is selectively decoupled from the bitlines in response to the row select signal.
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公开(公告)号:US10826470B2
公开(公告)日:2020-11-03
申请号:US16352673
申请日:2019-03-13
Applicant: OmniVision Technologies, Inc.
Inventor: Liang Zuo , Rui Wang , Hiroaki Ebihara , Nijun Jiang
Abstract: A ramp generator includes an integrator including a first stage having first and second inputs and first and second outputs, and a second stage including first and second transistors coupled between a power supply rail and ground. A node between the first and second transistors is coupled to the output of the integrator amplifier. A control terminal of the first transistor is coupled to the first output of the first stage, and a control terminal of the second transistor is coupled to the second output of the first stage. A first current flows from the output to ground during a ramp event in the ramp signal generated from the output. Trimming circuitry is coupled to the output of the integrator amplifier to provide a second current to the output of the integrator amplifier in response to trimming inputs. The second current substantially matches the first current.
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公开(公告)号:US10750111B2
公开(公告)日:2020-08-18
申请号:US16222832
申请日:2018-12-17
Applicant: OmniVision Technologies, Inc.
Inventor: Hiroaki Ebihara , Rui Wang , Zheng Yang , Eiichi Funatsu
IPC: H04N5/378 , H01L27/146 , H04N5/374
Abstract: An image sensor includes a pixel array including a plurality of pixels. A bit line coupled to a column of pixels is separated in to a plurality of electrically portions that are coupled to corresponding portions of rows of the pixel array. A first switching circuit of a readout circuit is coupled to the bit line. A first switching circuit is configured to couple a bit line current source to the bit line to provide a DC current coupled to flow through the bit line and through the first switching circuit during a readout operation of a pixel coupled to the bit line. A second switching circuit is configured to couple and ADC to the bit line during the readout operation of the pixel. Substantially none of the DC current provided by the bit line current source flows through the second switching circuit during the readout operation of the pixel.
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公开(公告)号:US20190386057A1
公开(公告)日:2019-12-19
申请号:US16008434
申请日:2018-06-14
Applicant: OmniVision Technologies, Inc.
Inventor: Rui Wang , Zheng Yang , Hiroaki Ebihara , Tiejun Dai
IPC: H01L27/146
Abstract: A group of shared pixels comprises: a first shared pixel comprising a first photodiode and a first transfer gate; a second shared pixel comprising a second photodiode and a second transfer gate; a third shared pixel comprising a third photodiode and a third transfer gate; a fourth shared pixel comprising a fourth photodiode and a first transfer gate; a first floating diffusion shared by the first shared pixel and the second shared pixel; a second floating diffusion shared by the third shared pixel and the fourth shared pixel; a capacitor coupled to the first floating diffusion through a first dual conversion gain transistor, and the second floating diffusion through a second dual conversion gain transistor; wherein the capacitor is formed in an area covering most of the first shared pixel, the second shared pixel, the third shared pixel, and the fourth shared pixel.
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公开(公告)号:US20190246057A1
公开(公告)日:2019-08-08
申请号:US15890762
申请日:2018-02-07
Applicant: OmniVision Technologies, Inc.
Inventor: Hiroaki Ebihara , Rui Wang , Yandong Chen , Eiichi Funatsu
IPC: H04N5/3745 , H04N5/378 , H01L27/146 , H04N5/355 , H04N5/235 , H04N5/357
CPC classification number: H04N5/37455 , H01L27/14605 , H01L27/14609 , H01L27/14643 , H04N5/2355 , H04N5/3559 , H04N5/3575 , H04N5/37452 , H04N5/378
Abstract: A method includes reading a first analog reference signal from a first storage node in a dual conversion gain pixel, and converting the first analog reference signal to a first digital reference signal using a comparator coupled to the dual conversion gain pixel. The method also includes reading a first analog image signal from the first storage node, and converting the first analog image signal to a first digital image signal using the comparator. A second analog image signal may be read from the first storage node and a second storage node in the dual conversion gain pixel, and the second analog image signal may be converted to a second digital image signal. A second analog reference signal may be read from the first storage node and the second storage node, and the second analog reference signal may be converted to a second digital reference signal using the comparator.
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公开(公告)号:US10356351B1
公开(公告)日:2019-07-16
申请号:US15890762
申请日:2018-02-07
Applicant: OmniVision Technologies, Inc.
Inventor: Hiroaki Ebihara , Rui Wang , Yandong Chen , Eiichi Funatsu
IPC: H04N5/335 , H04N5/3745 , H04N5/378 , H01L27/146 , H04N5/355 , H04N5/235 , H04N5/357
CPC classification number: H04N5/37455 , H01L27/14605 , H01L27/14609 , H01L27/14643 , H04N5/2355 , H04N5/3559 , H04N5/3575 , H04N5/37452 , H04N5/378
Abstract: A method includes reading a first analog reference signal from a first storage node in a dual conversion gain pixel, and converting the first analog reference signal to a first digital reference signal using a comparator coupled to the dual conversion gain pixel. The method also includes reading a first analog image signal from the first storage node, and converting the first analog image signal to a first digital image signal using the comparator. A second analog image signal may be read from the first storage node and a second storage node in the dual conversion gain pixel, and the second analog image signal may be converted to a second digital image signal. A second analog reference signal may be read from the first storage node and the second storage node, and the second analog reference signal may be converted to a second digital reference signal using the comparator.
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公开(公告)号:US09961279B1
公开(公告)日:2018-05-01
申请号:US15384872
申请日:2016-12-20
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Rui Wang , Tiejun Dai
CPC classification number: H01L27/14643 , H01L27/1461 , H01L27/14612 , H04N5/2353 , H04N5/3594 , H04N5/374 , H04N5/376
Abstract: A pixel circuit includes a transfer transistor coupled between a photodiode and a floating diffusion to selectively transfer image charge accumulated in the photodiode to the floating diffusion. A selection circuit is coupled to select one of a first transfer control signal, a second transfer control signal, or a third transfer control signal to control the transfer transistor. The selection circuit is coupled to output the first transfer control signal in response to a precharge enable signal during a read out operation of a different row than a row in which the transfer transistor is included, to output the second transfer control signal in response to a sample enable signal during a read out operation of the row in which the transfer transistor is included, and output the third transfer control signal to partially turn on the transfer transistor during an idle state of the pixel circuit.
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