公开(公告)号：US20180033927A1

公开(公告)日：2018-02-01

申请号：US15549136

申请日：2016-02-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christina KEITH ,  Kathy SCHMIDTKE ,  Klaus HOEHN

IPC: H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08K5/5435 ,  C08L83/00 ,  C08L83/04 ,  H01L33/486 ,  H01L2224/32225

Abstract: The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.

公开(公告)号：US20160013369A1

公开(公告)日：2016-01-14

申请号：US14769699

申请日：2014-03-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Kathy SCHMIDTKE ,  Ion STOLL ,  Tony ALBRECHT ,  Markus KLEIN

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/502 ,  H01L33/005 ,  H01L33/44 ,  H01L33/483 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component, comprising: a carrier (1) and a semiconductor layer sequence (20) configured for emission of electromagnetic primary radiation and arranged on the carrier (10). The semiconductor layer sequence (20) comprises a radiation main side (21) facing away from the carrier. A connecting layer is applied directly at least on the radiation main side (21) of the semiconductor layer sequence. A conversion element (40) is configured for emission of electromagnetic secondary radiation and is arranged directly on connecting layer (30), and being formed as a prefabricated body. Connecting layer (30) comprises at least one inorganic filler (31) embedded in matrix material and being formed with a layer thickness of less than or equal to 2 μm. The prefabricated body is attached to the semiconductor layer sequence by the connecting layer which is configured in order to filter out a short-wave component of the electromagnetic primary radiation.

Abstract translation: 一种光电子部件，包括：载体（1）和被配置为发射电磁一次辐射并且布置在载体（10）上的半导体层序列（20）。 半导体层序列（20）包括背离载体的辐射主侧（21）。 至少在半导体层序列的辐射主侧（21）上直接施加连接层。 转换元件（40）被配置为发射电磁次级辐射，并且直接设置在连接层（30）上，并被形成为预制体。 连接层（30）包括嵌入基质材料中的至少一种无机填料（31），并形成层厚度小于或等于2μm。 预制体通过连接层附接到半导体层序列，该连接层被配置为滤除电磁一次辐射的短波分量。