公开(公告)号：US20140321804A1

公开(公告)日：2014-10-30

申请号：US14047978

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Ronald Ho ,  Ivan Shubin ,  John E. Cunningham

IPC: G02B6/12

CPC classification number: G02B6/4274 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

Abstract translation: 芯片封装包括在芯片封装中彼此靠近的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面电耦合到插入件的顶表面，并且该顶表面又电耦合到面向顶表面的输入/输出（I / O）集成电路的前表面 。 此外，I / O集成电路的前表面电耦合到光集成电路的顶表面，其中光集成电路的顶表面面向I / O集成电路的前表面。

公开(公告)号：US08971676B1

公开(公告)日：2015-03-03

申请号：US14047918

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Ronald Ho ,  John E. Cunningham

IPC: G02B6/12

CPC classification number: G02B6/12 ,  G02B6/42 ,  G02B6/4274 ,  G02B6/428 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10121

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，输入/输出（I / O）集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路，并与光学集成电路上的光学器件进行通信。 通过将集成电路，集成电路和I / O集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US09250403B2

公开(公告)日：2016-02-02

申请号：US14047910

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Frankie Y. Liu ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Guoliang Li ,  Ivan Shubin ,  Ronald Ho ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: G02B6/12 ,  G02B6/42 ,  H01L25/065 ,  H01L23/00 ,  H05K3/36

CPC classification number: G02B6/4274 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括与芯片封装中的每一个相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面通过插入件的顶表面电耦合到光集成电路的前表面，其中顶表面面向集成电路的前表面和光集成电路的前表面 。 此外，集成电路和光集成电路可以在插入器的同一侧上。 通过将光集成电路和集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US09297971B2

公开(公告)日：2016-03-29

申请号：US14047978

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Ronald Ho ,  Ivan Shubin ,  John E. Cunningham

IPC: G02B6/42 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H05K3/36

CPC classification number: G02B6/4274 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

Abstract translation: 芯片封装包括在芯片封装中彼此靠近的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面电耦合到插入件的顶表面，并且该顶表面又电耦合到面向顶表面的输入/输出（I / O）集成电路的前表面 。 此外，I / O集成电路的前表面电耦合到光集成电路的顶表面，其中光集成电路的顶表面面向I / O集成电路的前表面。

公开(公告)号：US09256026B2

公开(公告)日：2016-02-09

申请号：US14540651

申请日：2014-11-13

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Ronald Ho ,  John E. Cunningham

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/42 ,  G02B6/4274 ,  G02B6/428 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10121

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，输入/输出（I / O）集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路，并与光学集成电路上的光学器件进行通信。 通过将集成电路，集成电路和I / O集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US20150098677A1

公开(公告)日：2015-04-09

申请号：US14540651

申请日：2014-11-13

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Ronald Ho ,  John E. Cunningham

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/42 ,  G02B6/4274 ,  G02B6/428 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10121

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，输入/输出（I / O）集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路，并与光学集成电路上的光学器件进行通信。 通过将集成电路，集成电路和I / O集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US20140321803A1

公开(公告)日：2014-10-30

申请号：US14047910

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Frankie Y. Liu ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Guoliang Li ,  Ivan Shubin ,  Ronald Ho ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: G02B6/12

CPC classification number: G02B6/4274 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括与芯片封装中的每一个相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面通过插入件的顶表面电耦合到光集成电路的前表面，其中顶表面面向集成电路的前表面和光集成电路的前表面 。 此外，集成电路和光集成电路可以在插入器的同一侧上。 通过将光集成电路和集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。