Conductive film as the connector for thin film display device
    1.
    发明授权
    Conductive film as the connector for thin film display device 有权
    导电膜作为薄膜显示装置的连接器

    公开(公告)号:US07115956B2

    公开(公告)日:2006-10-03

    申请号:US10430443

    申请日:2003-05-07

    IPC分类号: H01L29/76

    摘要: In the manufacture of a semiconductor device, there are provided a method that enables reduction in the number of manufacturing steps thereof and a structure for realizing the method, to thereby realize improvement in yield and reduction in manufacturing cost. Wirings (source wiring, drain wiring, and the like), which are respectively formed in a row direction and a column direction on an element substrate, are formed of the same conductive film. In this case, one of the respective wirings in the row direction and the column direction is discontinuously formed at a portion where the wirings intersect with each other, and an insulating film is formed on the wirings. Thereafter, a connection wiring for connecting discontinuous wirings is formed of the same film as that for forming an electrode provided on the insulating film. As a result, a continuous wiring is formed.

    摘要翻译: 在半导体装置的制造中,提供了能够减少其制造步骤数量的方法和实现该方法的结构,从而实现产量的提高和制造成本的降低。 在元件基板上分别沿行方向和列方向形成的布线(源极配线,漏极配线等)由相同的导电膜形成。 在这种情况下,在布线方向和列方向上的各个布线中的一个在布线彼此交叉的部分处不连续地形成,并且在布线上形成绝缘膜。 此后,用于连接不连续布线的连接布线由与形成在绝缘膜上的电极形成相同的膜形成。 结果,形成连续布线。

    Semiconductor device with organic compound layer
    2.
    发明授权
    Semiconductor device with organic compound layer 有权
    具有有机化合物层的半导体器件

    公开(公告)号:US07453101B2

    公开(公告)日:2008-11-18

    申请号:US11028536

    申请日:2005-01-05

    IPC分类号: H01L21/04

    摘要: In the manufacture of a semiconductor device, there are provided a method that enables reduction in the number of manufacturing steps thereof and a structure for realizing the method, to thereby realize improvement in yield and reduction in manufacturing cost. Wirings (source wiring, drain wiring, and the like), which are respectively formed in a row direction and a column direction on an element substrate, are formed of the same conductive film. In this case, one of the respective wirings in the row direction and the column direction is discontinuously formed at a portion where the wirings intersect with each other, and an insulating film is formed on the wirings. Thereafter, a connection wiring for connecting discontinuous wirings is formed of the same film as that for forming an electrode provided on the insulating film. As a result, a continuous wiring is formed.

    摘要翻译: 在半导体装置的制造中,提供了能够减少其制造步骤数量的方法和实现该方法的结构,从而实现产量的提高和制造成本的降低。 在元件基板上分别沿行方向和列方向形成的布线(源极配线,漏极配线等)由相同的导电膜形成。 在这种情况下,在布线方向和列方向上的各个布线中的一个在布线彼此交叉的部分处不连续地形成,并且在布线上形成绝缘膜。 此后,用于连接不连续布线的连接布线由与形成在绝缘膜上的电极形成相同的膜形成。 结果,形成连续布线。

    Semiconductor device and manufacturing method thereof
    3.
    发明申请
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US20050116227A1

    公开(公告)日:2005-06-02

    申请号:US11028536

    申请日:2005-01-05

    摘要: In the manufacture of a semiconductor device, there are provided a method that enables reduction in the number of manufacturing steps thereof and a structure for realizing the method, to thereby realize improvement in yield and reduction in manufacturing cost. Wirings (source wiring, drain wiring, and the like), which are respectively formed in a row direction and a column direction on an element substrate, are formed of the same conductive film. In this case, one of the respective wirings in the row direction and the column direction is discontinuously formed at a portion where the wirings intersect with each other, and an insulating film is formed on the wirings. Thereafter, a connection wiring for connecting discontinuous wirings is formed of the same film as that for forming an electrode provided on the insulating film. As a result, a continuous wiring is formed.

    摘要翻译: 在半导体装置的制造中,提供了能够减少其制造步骤数量的方法和实现该方法的结构,从而实现产量的提高和制造成本的降低。 在元件基板上分别沿行方向和列方向形成的布线(源极配线,漏极配线等)由相同的导电膜形成。 在这种情况下,在布线方向和列方向上的各个布线中的一个在布线彼此交叉的部分处不连续地形成,并且在布线上形成绝缘膜。 此后,用于连接不连续布线的连接布线由与形成在绝缘膜上的电极形成相同的膜形成。 结果,形成连续布线。

    Method for forming large area display wiring by droplet discharge, and method for manufacturing electronic device and semiconductor device
    4.
    发明授权
    Method for forming large area display wiring by droplet discharge, and method for manufacturing electronic device and semiconductor device 有权
    通过液滴喷射形成大面积显示布线的方法,以及用于制造电子器件和半导体器件的方法

    公开(公告)号:US07575965B2

    公开(公告)日:2009-08-18

    申请号:US10579443

    申请日:2004-11-29

    IPC分类号: H01L21/84

    摘要: It is conceivable that the problem that a signal is delayed by resistor of a wiring in producing a display which displays large area becomes remarkable. The present invention provides a manufacturing process using a droplet discharge method suitable for a large-sized substrate.In the present invention, after forming a base layer 11 (or base pretreatment) which enhances adhesiveness over a substrate in advance and forming an insulating film, a mask having a desired pattern shape is formed, and a desired depression is formed by using the mask. A metal material is filled in the depression having a mask 13 and a sidewall made from an insulating film by a droplet discharge method to form an embedded wiring (a gate electrode, a capacitor wiring, lead wiring or the like. Afterwards, it is flattened by a planarization processing, for example, a press or a CMP processing.

    摘要翻译: 可以想到,在制作显示大面积的显示器时,由布线的电阻器延迟信号的问题变得显着。 本发明提供一种使用适合于大尺寸基板的液滴喷射方法的制造方法。 在本发明中,在形成预先形成基板上的粘合性的基底层11(或基底预处理)之后,形成绝缘膜的情况下,形成具有期望的图案形状的掩模,通过使用掩模 。 通过液滴喷射法将金属材料填充在具有掩模13和由绝缘膜制成的侧壁的凹部中,以形成嵌入布线(栅电极,电容器布线,引线布线等),然后将其平坦化 通过平坦化处理,例如压制或CMP处理。

    Electronic device and semiconductor device and method for manufacturing the same
    6.
    发明申请
    Electronic device and semiconductor device and method for manufacturing the same 有权
    电子器件及半导体器件及其制造方法

    公开(公告)号:US20070096096A1

    公开(公告)日:2007-05-03

    申请号:US10579443

    申请日:2004-11-29

    IPC分类号: H01L29/04 H01L21/84

    摘要: It is conceivable that the problem that a signal is delayed by resistor of a wiring in producing a display which displays large area becomes remarkable. The present invention provides a manufacturing process using a droplet discharge method suitable for a large-sized substrate. In the present invention, after forming a base layer 11 (or base pretreatment) which enhances adhesiveness over a substrate in advance and forming an insulating film, a mask having a desired pattern shape is formed, and a desired depression is formed by using the mask. A metal material is filled in the depression having a mask 13 and a sidewall made from an insulating film by a droplet discharge method to form an embedded wiring (a gate electrode, a capacitor wiring, lead wiring or the like. Afterwards, it is flattened by a planarization processing, for example, a press or a CMP processing.

    摘要翻译: 可以想到,在制作显示大面积的显示器时,由布线的电阻器延迟信号的问题变得显着。 本发明提供一种使用适合于大尺寸基板的液滴喷射方法的制造方法。 在本发明中,在形成预先形成基板上的粘合性的基底层11(或基底预处理)之后,形成绝缘膜的情况下,形成具有期望的图案形状的掩模,通过使用掩模 。 通过液滴喷射法将金属材料填充在具有掩模13和由绝缘膜制成的侧壁的凹部中,以形成嵌入布线(栅电极,电容器布线,引线布线等),然后将其平坦化 通过平坦化处理,例如压制或CMP处理。

    Electronic device and semiconductor device and method for manufacturing the same
    8.
    发明授权
    Electronic device and semiconductor device and method for manufacturing the same 有权
    电子器件及半导体器件及其制造方法

    公开(公告)号:US07897968B2

    公开(公告)日:2011-03-01

    申请号:US12504840

    申请日:2009-07-17

    IPC分类号: H01L29/04

    摘要: It is conceivable that the problem that a signal is delayed by resistor of a wiring in producing a display which displays large area becomes remarkable. The present invention provides a manufacturing process using a droplet discharge method suitable for a large-sized substrate.In the present invention, after forming a base layer 11 (or base pretreatment) which enhances adhesiveness over a substrate in advance and forming an insulating film, a mask having a desired pattern shape is formed, and a desired depression is formed by using the mask. A metal material is filled in the depression having a mask 13 and a sidewall made from an insulating film by a droplet discharge method to form an embedded wiring (a gate electrode, a capacitor wiring, lead wiring or the like. Afterwards, it is flattened by a planarization processing, for example, a press or a CMP processing.

    摘要翻译: 可以想到,在产生显示大面积的显示器中,由布线的电阻器延迟信号的问题变得显着。 本发明提供一种使用适合于大尺寸基板的液滴喷射方法的制造方法。 在本发明中,在形成预先形成基板上的粘合性的基底层11(或基底预处理)之后,形成绝缘膜的情况下,形成具有期望的图案形状的掩模,通过使用掩模 。 通过液滴喷射法将金属材料填充在具有掩模13和由绝缘膜制成的侧壁的凹部中,以形成嵌入布线(栅电极,电容器布线,引线布线等),然后将其平坦化 通过平坦化处理,例如压制或CMP处理。

    Semiconductor device and heating system

    公开(公告)号:US10257884B2

    公开(公告)日:2019-04-09

    申请号:US12207112

    申请日:2008-09-09

    申请人: Hideaki Kuwabara

    发明人: Hideaki Kuwabara

    IPC分类号: H05B1/02

    摘要: A device that warms a surface of a living body required to be warmed at an appropriate timing at any place indoors and outdoors or the sea without causing low temperature burns. A sheet having a heat generating function including a circuit capable of receiving electric power without contact over a sheet containing plastic or a fibrous body, a heat generating circuit, and a circuit that controls the temperature of the heat generating circuit is manufactured. The user with the sheet transmits the radio signal from the transmission device outdoors or indoors to heat the heat generating circuit on the sheet and the heat can be conducted to the skin of the user. Temperature can be automatically adjusted by the circuit for controlling the temperature of the heat generating circuit.