公开(公告)号：US20170336436A1

公开(公告)日：2017-11-23

申请号：US15526333

申请日：2016-01-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUKI MAEGAWA ,  HIDEKI UEDA ,  HIDEAKI FUJIURA ,  TAKESHI UEMURA ,  HIROSHI NAKATSUKA ,  TSUYOSHI SAKAUE ,  RIE OKAMOTO ,  SHOYA KIDA

IPC: G01P15/125 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

公开(公告)号：US20200211763A1

公开(公告)日：2020-07-02

申请号：US16479629

申请日：2018-03-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KEITO KATAOKA ,  HIDEKI UEDA

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/32

Abstract: An inductor component includes a package, a coil embedded in the package, a first external electrode extending from a first end of the coil, and a second external electrode extending from a second end of the coil. The package has a bottom surface, a top surface, first and second side surfaces opposite to each other, and third and fourth side surfaces opposite to each other. The bottom surface of the package has a first step recess therein sinking toward the top surface, opening to the third side surface, and contacting the first external electrode. The bottom surface of the package further has a second step recess therein sinking toward the top surface, opening to the fourth side surface, and contacting the second external electrode. The bottom surface has a third step recess therein connected to the first step recess and sinking toward the top surface. The bottom surface has a fourth step recess therein connected to the second step recess and sinking toward the top surface. Upon being subjected to reflow-soldering, the inductor component enhances wettability to solder.

公开(公告)号：US20160202287A1

公开(公告)日：2016-07-14

申请号：US15073645

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKESHI MORI ,  KEISUKE KURODA ,  HITOSHI YOSHIDA ,  KAZUO GODA ,  TAKUMI TAURA ,  HIDEKI UEDA

IPC: G01P21/00 ,  G01P15/125 ,  G01P15/08

CPC classification number: G01P21/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0831

Abstract: An acceleration sensor includes a CV conversion circuit, an AD conversion circuit, and first and second registers. The CV conversion circuit outputs a voltage corresponding to the capacitance changes between a movable electrode and each of first and second fixed electrodes disposed to face the movable electrode. The AD conversion circuit is connected to the CV conversion circuit and has a first detection range and a second detection range. The first register is connected to the AD conversion circuit and holds a first value. The second register is connected to the AD conversion circuit and holds a second value. The first value contains information about an acceleration in the first detection range, and the second value contains information about an acceleration in the second detection range. The first and second values indicate accelerations in the same direction.

Abstract translation: 加速度传感器包括CV转换电路，AD转换电路以及第一和第二寄存器。 CV转换电路输出与可动电极和设置在可动电极之间的第一和第二固定电极中的每一个之间的电容变化相对应的电压。 AD转换电路连接到CV转换电路，具有第一检测范围和第二检测范围。 第一个寄存器连接到AD转换电路并保持第一个值。 第二寄存器连接到AD转换电路并保持第二值。 第一值包含关于第一检测范围中的加速度的信息，第二值包含关于第二检测范围中的加速度的信息。 第一个和第二个值表示相同方向的加速度。

公开(公告)号：US20180267079A1

公开(公告)日：2018-09-20

申请号：US15760615

申请日：2016-11-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO SHINOHARA ,  HITOSHI YOSHIDA ,  KAZUO GODA ,  RIE OKAMOTO ,  HIROSHI NAKATSUKA ,  MASAKO YAMAGUCHI ,  HIDEKI UEDA ,  TAKANORI AOYAGI ,  YUKI MAEGAWA ,  TAKUYA KAJIWARA ,  KEISUKE KURODA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P15/08 ,  G01P15/18 ,  H01L29/84

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0862 ,  H01L29/84

Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

公开(公告)号：US20160091526A1

公开(公告)日：2016-03-31

申请号：US14892566

申请日：2014-06-10

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： KAZUO GODA ,  NOBUYUKI IBARA ,  HITOSHI YOSHIDA ,  TAKUMI TAURA ,  SHINICHI KISHIMOTO ,  HIDEKI UEDA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P15/18

CPC classification number: G01P15/125 ,  B81B3/0081 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P3/44 ,  G01P15/18

Abstract: A configuration including a first substrate including a first movable electrode; a second substrate connected to the first substrate and including a first fixed electrode that faces the first movable electrode; and a third substrate connected to the second substrate. The first substrate, the second substrate, and the third substrate are laminated in this order, and the second substrate and the third substrate are not bonded to each other in at least a part between the first fixed electrode and the third substrate.

Abstract translation: 一种构造，包括：第一基板，包括第一可动电极; 连接到所述第一基板并包括面向所述第一可动电极的第一固定电极的第二基板; 以及连接到第二基板的第三基板。 第一基板，第二基板和第三基板按顺序层叠，并且第二基板和第三基板在第一固定电极和第三基板之间的至少一部分上彼此不接合。

公开(公告)号：US20150368089A1

公开(公告)日：2015-12-24

申请号：US14764572

申请日：2014-02-03

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： KAZUO GODA ,  TAKUMI TAURA ,  SHINICHI KISHIMOTO ,  HIDEKI UEDA ,  TAKESHI MORI

IPC: B81B3/00 ,  G01P15/125

CPC classification number: B81B3/0008 ,  B81B2201/0235 ,  G01P15/125 ,  G01P2015/0834 ,  H01L29/84

Abstract: A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft.

Abstract translation: MEMS器件包括可移动部分，框架，光束和电极基板。 框架围绕可动部分的周围。 梁从框架的至少一部分延伸，并连接到可移动部分。 电极基板包括固定电极，延伸电极和基板部分。 在面向摆动部的区域的至少一部分中，在电极基板上形成固定电极。 延伸电极连接到固定电极，并且在面向轴的区域的至少一部分中形成在电极基板上。