公开(公告)号：US20150194412A1

公开(公告)日：2015-07-09

申请号：US14591292

申请日：2015-01-07

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koji OMURA ,  Tomoya IWAHASHI ,  Kohji HIRAMATSU ,  Ran ZHENG

IPC: H01L25/075 ,  H01L33/64 ,  H01L33/52 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48139 ,  H01L2224/48484 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes: a substrate; a first light emitting element and a second light emitting element that are mounted above the substrate; and a heat transfer pattern that is formed on the substrate. A rate of decrease in light output with respect to a temperature increase is greater for the second light emitting element than for the first light emitting element. The second light emitting element is mounted above the substrate via the heat transfer pattern, and the first light emitting element is mounted above the substrate without the heat transfer pattern

Abstract translation: 发光装置包括：基板; 安装在所述基板上方的第一发光元件和第二发光元件; 以及形成在基板上的传热图案。 对于第二发光元件而言，光输出相对于温度升高的降低率比对于第一发光元件大。 第二发光元件经由传热图案安装在基板上方，并且第一发光元件安装在基板上方，而没有传热图案

公开(公告)号：US20190146317A1

公开(公告)日：2019-05-16

申请号：US16183430

申请日：2018-11-07

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kenta WATANABE ,  Toshio MORI ,  Hiroshi ASANO ,  Yosuke HONDA ,  Ran ZHENG ,  Sachiko AZUMA

IPC: G03B21/20 ,  G03B21/00

Abstract: A wavelength conversion device is provided that includes: light-transmissive substrate that includes an incidence surface and an emission surface opposite the incidence surface, and emits, from the emission surface, laser light that enters the incidence surface; a phosphor layer that emits fluorescent light when excited by the laser light emitted from the emission surface; and a light diffuser layer between the emission surface and the phosphor layer. The light diffuser layer is, when viewed in a direction perpendicular to the emission surface, disposed only in a portion of a region in which the phosphor layer is disposed.

公开(公告)号：US20160077415A1

公开(公告)日：2016-03-17

申请号：US14832117

申请日：2015-08-21

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Atsushi MOTOYA ,  Kenta WATANABE ,  Ran ZHENG ,  Sachiko AZUMA ,  Yoshihisa NAGASAKI ,  Takahiro HAMADA ,  Mitsuru NITTA ,  Takashi MANIWA ,  Toshio MORI ,  Kazuhiro MATSUO

IPC: G03B21/20 ,  G02B27/14 ,  H01S5/00 ,  H01L33/50 ,  H01L33/60

CPC classification number: G03B21/204 ,  G02B27/141 ,  G03B21/2066 ,  H01L2933/0041 ,  H01S5/0092

Abstract: A wavelength conversion member includes a substrate, a dichroic mirror layer, an SiO2 layer, a ZnO layer, and a phosphor layer, which are sequentially stacked from the substrate. The dichroic mirror layer reflects at least part of light incident from the above. The phosphor layer includes a plurality of phosphors and ZnO between the phosphors.

Abstract translation: 波长转换构件包括从衬底依次层叠的衬底，二向色镜层，SiO 2层，ZnO层和荧光体层。 二向色镜层反射从上述入射的光的至少一部分。 磷光体层包括多个磷光体和磷光体之间的ZnO。

公开(公告)号：US20150260351A1

公开(公告)日：2015-09-17

申请号：US14641736

申请日：2015-03-09

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kohji HIRAMATSU ,  Tomoya IWAHASHI ,  Koji OMURA ,  Ran ZHENG

IPC: F21K99/00

CPC classification number: F21S8/026 ,  F21K9/232 ,  F21K9/27 ,  F21V3/02 ,  F21V3/061 ,  F21V3/062 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A light-emitting device includes a board; and light-emitting element arrays connected in parallel and each including light-emitting elements mounted on the board and connected in series. The light-emitting elements in each of the light-emitting element arrays include one or more red LED chips and one or more blue LED chips. Each of the red LED chips on the board is disposed non-successively to any other one of the red LED chips along a Y direction and along an X direction. The Y direction is parallel to a direction along which the red LED chips included in one of the light emitting arrays including the red LED chip are arranged. The X direction is perpendicular to the Y direction.

Abstract translation: 发光装置包括板; 和并联连接的发光元件阵列，每个发光元件阵列包括安装在板上并串联连接的发光元件。 每个发光元件阵列中的发光元件包括一个或多个红色LED芯片和一个或多个蓝色LED芯片。 板上的每个红色LED芯片沿着Y方向并沿着X方向非依次配置到任何其他红色LED芯片。 Y方向平行于包括在包括红色LED芯片的发光阵列之一中的红色LED芯片被布置的方向。 X方向垂直于Y方向。

公开(公告)号：US20180173085A1

公开(公告)日：2018-06-21

申请号：US15838155

申请日：2017-12-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Toshio MORI ,  Ran ZHENG

IPC: G03B21/20 ,  H01L33/46 ,  H01L33/50 ,  F21V7/22

CPC classification number: G03B21/204 ,  F21K9/64 ,  F21V7/22 ,  F21V9/30 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L33/46 ,  H01L33/50 ,  H01L33/507 ,  H01L2933/0041

Abstract: A wavelength converter includes, in sequence, a substrate, a reflective layer, and a phosphor layer. The phosphor layer contains a sealing layer and a phosphor dispersed in the sealing layer. The sealing layer is made of a hybrid material containing a glass component and a resin component.

公开(公告)号：US20180108814A1

公开(公告)日：2018-04-19

申请号：US15730477

申请日：2017-10-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Ran ZHENG ,  Toshio MORI

IPC: H01L33/50 ,  G03B21/20 ,  H01S5/00

CPC classification number: H01L33/502 ,  G03B21/204 ,  H01S5/005 ,  H01S5/0092 ,  H01S5/32341 ,  H01S5/4025

Abstract: A phosphor layer contains phosphor particles, and satisfies the following relations: y≥0.0623x2+0.2107x+28.789 and y≤−0.1172x2+7.584x+81.148 where x represents the average particle size (μm) of the phosphor particles, and y represents the thickness (μm) of the phosphor layer.

公开(公告)号：US20150263246A1

公开(公告)日：2015-09-17

申请号：US14643412

申请日：2015-03-10

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kohji HIRAMATSU ,  Tomoya IWAHASHI ,  Koji OMURA ,  Ran ZHENG

IPC: H01L33/50 ,  H01L33/54 ,  H01L25/075 ,  F21K99/00

CPC classification number: H01L25/0753 ,  F21K9/232 ,  F21S8/026 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: A light-emitting device includes a board; and a first light-emitting element array and a second light-emitting element array connected in parallel and each including light-emitting elements mounted on the board and connected in series. The light-emitting elements includes a red LED chip and a blue LED chip. The red LED chip is sealed with a dot of a first sealant, and the blue LED chip is sealed with a dot of a second sealant which is different from the first sealant.

Abstract translation: 发光装置包括板; 和并联连接的第一发光元件阵列和第二发光元件阵列，并且每个发光元件阵列和第二发光元件阵列各自包括安装在所述板上并串联连接的发光元件。 发光元件包括红色LED芯片和蓝色LED芯片。 红色LED芯片用第一密封剂的点密封，并且蓝色LED芯片用与第一密封剂不同的第二密封剂的点密封。