公开(公告)号：US20150305213A1

公开(公告)日：2015-10-22

申请号：US14443691

申请日：2013-11-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO.,LTD

Inventor： Katsuhiko ITOH ,  Mitsuo NAKAMURA ,  Daisuke NAGAI ,  Kenji OKAMOTO

IPC: H05K13/00 ,  H05K3/34 ,  B23K37/04 ,  B23K31/12 ,  B23K1/00 ,  B23K1/20

CPC classification number: H05K13/0015 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0638 ,  B23K3/087 ,  B23K31/12 ,  B23K37/04 ,  B23K2101/42 ,  H05K3/303 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/0817 ,  H05K2201/10636 ,  H05K2203/04 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611

Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

Abstract translation: 在检测印刷焊料的位置的安装位置校正中，计算电极的位置与印刷焊料的位置之间的位置偏移量，并且基于计算出的位置移动量来校正安装位置，当校正量 基于计算出的位置偏移量超过表示在安装信息中定义和允许的修正量的上限的极限值，电子部件安装在通过考虑极限值而被校正的安装位置作为校正 量。 因此，可以根据打印位置偏移的程度考虑作为基准的焊锡印刷位置来适当地采用安装位置校正，并获得期望的接合质量改进效果。