公开(公告)号：US20160234983A1

公开(公告)日：2016-08-11

申请号：US14867241

申请日：2015-09-28

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/04 ,  H05K3/34

CPC classification number: H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/08 ,  H05K13/0817 ,  H05K2203/041

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

Abstract translation: 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示要安装在板的每个电极上的芯片焊料的尺寸的单元。

公开(公告)号：US20150163969A1

公开(公告)日：2015-06-11

申请号：US14561634

申请日：2014-12-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hachiro NAKATSUJI ,  Kenji OKAMOTO

IPC: H05K13/04 ,  B23K1/20 ,  B23K3/06 ,  B23K1/00

CPC classification number: H05K13/0465 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0638 ,  B23K3/08 ,  B23K3/087 ,  B23K2101/42 ,  B41F15/0881 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/83192 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2203/0126 ,  H05K2203/1476

Abstract: An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to a plurality of first lands among lands of a board, using a mask plate including pattern holes formed so as to correspond to the plurality of first lands. The coating unit includes a discharge port for discharging the solder paste, and coats the solder paste through the discharge port on a plurality of second lands other than the plurality of first lands on the board to which the solder paste is supplied through the screen printing apparatus. The electronic component mounting apparatus mounts the electronic components on the first and second lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.

Abstract translation: 电子部件安装系统包括丝网印刷装置，涂布单元和电子部件安装装置。 丝网印刷装置使用包括形成为对应于多个第一平台的图案孔的掩模板将焊膏提供到板的焊盘中的多个第一焊盘。 涂布单元包括用于排出焊膏的排出口，并且通过排出口将焊膏涂覆在除了通过丝网印刷装置供给焊膏的板上的多个第一焊盘之外的多个第二焊盘上 。 电子部件安装装置通过丝网印刷装置和涂布单元将电子部件安装在供给焊锡膏的第一和第二焊盘上。

公开(公告)号：US20160234984A1

公开(公告)日：2016-08-11

申请号：US14868885

申请日：2015-09-29

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/0817 ,  H05K2203/041

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Abstract translation: 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示每个组件端子的芯片焊料的尺寸。

公开(公告)号：US20160295757A1

公开(公告)日：2016-10-06

申请号：US14993852

申请日：2016-01-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/08 ,  H05K3/34 ,  H05K13/04

Abstract: A component mounting line includes an inspecting apparatus and a component mounting apparatus. The inspecting apparatus measures a solder volume of a printed solder on each electrode of a board. The component mounting apparatus includes a mounting unit that mounts an electronic component on the board, at least one component supply unit that supplies a chip solder, and a control unit that controls the mounting unit to mount the chip solder supplied from the component supply unit based on production data in which a size of the chip solder is instructed corresponding to the solder volume measured for each of component terminals corresponding to each electrode of the board.

Abstract translation: 部件安装线包括检查装置和部件安装装置。 检查装置测量板的每个电极上的印刷焊料的焊料体积。 部件安装装置包括安装单元，其安装在电路板上的电子部件，提供芯片焊料的至少一个部件供应单元和控制单元以安装从元件供应单元提供的芯片焊料为基础的控制单元 对应于根据与板的每个电极相对应的每个组件端子测量的焊料体积来指示芯片焊料的尺寸的生产数据。

公开(公告)号：US20150334889A1

公开(公告)日：2015-11-19

申请号：US14651518

申请日：2013-12-06

Applicant: Panasonic Intellectual Property Management Co.,Ltd.

Inventor： Ryota NISHIJIMA ,  Kenji OKAMOTO ,  Kunio YAMAMOTO ,  Hisashi MAEZONO

IPC: H05K13/08

CPC classification number: H05K13/08 ,  G05B19/4183 ,  G05B19/41875 ,  G05B2219/36159 ,  G05B2219/40029 ,  H05K13/083 ,  Y02P90/04 ,  Y02P90/10 ,  Y02P90/18 ,  Y02P90/22 ,  Y10T29/53174

Abstract: An electronic-component mounting system includes: mounting lines each including an electronic-component mounting apparatus; an operation information processor which collects operation information of the electronic-component mounting apparatus, applies a statistical process on the operation information, and produces operation quality information of the mounting lines; and a portable information terminal accessible to the operation information processor by wireless communication. An identification information transmission section which transmits identification information for identifying each of the mounting lines is disposed in each mounting line, and a reception section which receives the identification information is disposed in the portable information terminal. The portable information terminal displays on a display section thereof the operation quality information of one of the mounting lines located near the portable information terminal based on the identification information transmitted from the mounting lines.

Abstract translation: 电子部件安装系统包括：各自包括电子部件安装装置的安装线; 收集电子部件安装装置的操作信息的操作信息处理器对操作信息进行统计处理，并且生成安装线的操作质量信息; 以及通过无线通信可操作信息处理器可访问的便携式信息终端。 在每个安装线上设置有识别信息发送部分，用于识别每个安装线的识别信息，并且接收标识信息的接收部分设置在便携式信息终端中。 便携式信息终端基于从安装线发送的识别信息，在其显示部分上显示位于便携式信息终端附近的安装线之一的操作质量信息。

公开(公告)号：US20150305213A1

公开(公告)日：2015-10-22

申请号：US14443691

申请日：2013-11-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO.,LTD

Inventor： Katsuhiko ITOH ,  Mitsuo NAKAMURA ,  Daisuke NAGAI ,  Kenji OKAMOTO

IPC: H05K13/00 ,  H05K3/34 ,  B23K37/04 ,  B23K31/12 ,  B23K1/00 ,  B23K1/20

CPC classification number: H05K13/0015 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0638 ,  B23K3/087 ,  B23K31/12 ,  B23K37/04 ,  B23K2101/42 ,  H05K3/303 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/0817 ,  H05K2201/10636 ,  H05K2203/04 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611

Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

Abstract translation: 在检测印刷焊料的位置的安装位置校正中，计算电极的位置与印刷焊料的位置之间的位置偏移量，并且基于计算出的位置移动量来校正安装位置，当校正量 基于计算出的位置偏移量超过表示在安装信息中定义和允许的修正量的上限的极限值，电子部件安装在通过考虑极限值而被校正的安装位置作为校正 量。 因此，可以根据打印位置偏移的程度考虑作为基准的焊锡印刷位置来适当地采用安装位置校正，并获得期望的接合质量改进效果。

公开(公告)号：US20150163925A1

公开(公告)日：2015-06-11

申请号：US14561396

申请日：2014-12-05

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hachiro NAKATSUJI ,  Kenji OKAMOTO

IPC: H05K3/34 ,  B23K1/00 ,  B23K3/06

CPC classification number: B23K1/0016 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0269 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2201/09918 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0465

Abstract: An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to first specific lands of a board, using a mask plate that includes a stepped portion and pattern holes formed so as to correspond to the first specific lands. The coating unit coats the solder paste on second specific lands of the board which are positioned in a region of the board overlapping the stepped portion of the mask plate and a vicinity of the stepped portion when the screen printing apparatus supplies the solder paste using the mask plate. The electronic component mounting apparatus mounts the electronic components on the first and second specific lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.

Abstract translation: 电子部件安装系统包括丝网印刷装置，涂布单元和电子部件安装装置。 丝网印刷装置使用包括阶梯部分的掩模板和形成为对应于第一特定焊盘的图案孔，将焊膏提供到板的第一特定焊盘。 当丝网印刷设备使用掩模提供焊膏时，涂覆单元将焊膏涂覆在板的第二特定焊盘上，其位于板的与掩模板的台阶部分重叠的区域和阶梯部分附近 盘子。 电子部件安装装置将电子部件安装在通过丝网印刷装置和涂布单元供给焊锡膏的第一和第二特定焊盘上。