公开(公告)号：US20150262963A1

公开(公告)日：2015-09-17

申请号：US14724661

申请日：2015-05-28

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kenichi KOYA ,  Isamu YONEKURA ,  Daisuke FUKAMACHI ,  Shinya HARANO

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48997 ,  H01L2224/49 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85181 ,  H01L2924/20752 ,  H01L2924/01201 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01046 ,  H01L2924/01044 ,  H01L2924/01076 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/0102 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01004 ,  H01L2924/01032 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/013 ,  H01L2224/43848 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A first bond portion is formed on a first electrode, and for a wire extended from the first bond portion, a tip of a capillary is pressed against a bump formed on a second electrode, to form a second bond portion to which a shape of a pressing surface at the tip of the capillary is transferred. A base end of the second bond portion from which the wire starts becoming thinner is located on the inside of the bump from an end of a bonding surface by 10% or more of the length of the bonding surface, and the wire is cut with the capillary.

Abstract translation: 第一接合部分形成在第一电极上，并且对于从第一接合部分延伸的电线，将毛细管的尖端压在形成在第二电极上的凸块上，形成第二接合部分， 毛细管尖端的按压面被传送。 电线开始变薄的第二接合部的基端从接合面的端部位于凸块的内侧，接合面的长度的10％以上，线被切断 毛细管。