公开(公告)号：US20170162490A1

公开(公告)日：2017-06-08

申请号：US15426142

申请日：2017-02-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDENORI KATSUMURA ,  SHINYA TOKUNAGA ,  MASAYA SUMITA ,  HIROYOSHI YOSHIDA ,  YASUHIRO SUGAYA ,  KAZUHIDE URIU ,  OSAMU SHIBATA

IPC: H01L23/495 ,  H01L23/00 ,  B60R11/04 ,  H01L23/64 ,  H01L23/31 ,  H04N5/225 ,  H01L49/02 ,  H01L23/498

CPC classification number: H01L23/49589 ,  B60R11/04 ,  B60R2300/105 ,  B60R2300/301 ,  H01L23/3114 ,  H01L23/367 ,  H01L23/481 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/642 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L25/00 ,  H01L28/65 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48265 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H04N5/2252 ,  H04N5/2257 ,  H04N5/2258 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.