METHOD OF MANUFACTURING A SEMICONDUCTOR LASER MODULE
    1.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR LASER MODULE 审中-公开
    制造半导体激光模块的方法

    公开(公告)号:US20150087094A1

    公开(公告)日:2015-03-26

    申请号:US14556042

    申请日:2014-11-28

    Abstract: A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.

    Abstract translation: 半导体激光器模块包括激光二极管阵列,光纤阵列,用于固定光纤阵列的光纤阵列配件,壳体和用于固定光纤阵列配件和外壳的支撑配件。 光纤阵列配件和支撑配件具有与平行于激光二极管阵列的发光表面的平面部分线接触或表面接触的第一接触部分,并且被激光焊接并彼此固定在 第一接触部分。 支撑配件和壳体具有第二接触部分,其与垂直于激光二极管阵列的发光表面的平面部分线接触或表面接触,并且在第二接触处被激光焊接并彼此固定 部分。

    LASER OSCILLATION DEVICE AND LASER MACHINING APPARATUS

    公开(公告)号:US20200083665A1

    公开(公告)日:2020-03-12

    申请号:US16683785

    申请日:2019-11-14

    Abstract: A laser oscillation device (1) includes a plurality of laser modules (10,11) configured to emit light beams; a beam multiplexer configured to combine the light beams emitted from the laser modules (10,11); and a power supply configured to supply power to the laser modules (10,11). The laser modules each include a plurality of laser diodes (40); a cooling plate (41) configured to cool the laser diodes (40); a pipe configured to carry a coolant to the cooling plate; a pressure sensor (27) and a flow sensor (28) configured to detect the pressure and the flow, respectively, of the coolant flowing through the pipe; and an adjustment mechanism (25) configured to adjust the pressure and the flow of the coolant based on the value of the pressure sensor (27) and the value of the flow sensor (28).

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