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公开(公告)号：US06809423B1
公开(公告)日：2004-10-26
申请号：US10717245
申请日：2003-11-19
IPC分类号： H01L2348
CPC分类号： H01L23/16 , H01L23/49575 , H01L23/49844 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.
摘要翻译： 一种电子模块，包括多个导电引线，导电基板，第一集成电路（IC）管芯，至少一个材料块和非导电二次模具。 至少一个材料块用于更紧密地匹配电子模块的部件之间的热膨胀系数（CTE）差异。
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2.发明授权Thick film rotational accelerometer having two structurally integrated linear acceleration sensors 失效具有两个结构集成的线性加速度传感器的厚膜旋转加速度计
公开(公告)号：US5456109A
公开(公告)日：1995-10-10
申请号：US38422
申请日：1993-03-29
CPC分类号： G01P15/0888 , G01P15/123 , G01P3/44
摘要： A rotational accelerometer has a pair of coplanar, operationally independent linear acceleration sensors. Coplanarity is provided by a unitary substrate which forms the base structure of the operationally independent linear acceleration sensors.
摘要翻译： 旋转加速度计具有一对共面的，操作上独立的线性加速度传感器。 共面性由形成操作上独立的线性加速度传感器的基础结构的单一基底提供。
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公开(公告)号：US06472251B1
公开(公告)日：2002-10-29
申请号：US09829208
申请日：2001-04-09
IPC分类号： H01L2144
CPC分类号： H01L23/047 , H01L21/50 , H01L23/24 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , Y10T83/0605 , Y10T83/159 , H01L2924/00014 , H01L2924/00
摘要： A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.
摘要翻译： 提供一种制造微电子器件封装的方法。 该方法包括微电子器件封装的连续处理模式，其中执行用于制造微电子器件封装的工艺步骤，从而节省从更昂贵的批处理步骤的去除。
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公开(公告)号：US5527999A
公开(公告)日：1996-06-18
申请号：US391740
申请日：1995-02-21
CPC分类号： H05K1/0265 , H01L23/5383 , H01L2924/0002 , H05K1/092 , H05K1/115 , H05K2201/09672 , H05K2201/0979 , H05K3/4664
摘要： A multilayer circuit is provided characterized by a multilayer conductor structure. The multilayer conductor structure is composed of at least two conductor layers, with each adjacent layer being separated by a dielectric material in the form of one or more dielectric layers. The multilayer circuit further includes electrically conductive members or features for electrically interconnecting the conductor layers at two or more locations along the lengths of the conductor layers. As a result, portions of the conductor layers between two or more locations are electrically in parallel with each other, such that the multilayer conductor is characterized by an electrical resistance between the locations which is less than the electrical resistance of the individual conductor layers between the locations. The multilayer conductor is therefore characterized by an augmented current-carrying capacity as compared to a single layer conductor of the same length and width.
摘要翻译： 提供了一种多层电路，其特征在于多层导体结构。 多层导体结构由至少两个导体层组成，每个相邻层由一个或多个介电层形式的电介质材料隔开。 多层电路还包括导电构件或特征，用于沿着导体层的长度在两个或更多个位置处电连接导体层。 结果，两个或更多个位置之间的导体层的部分彼此电并联，使得多层导体的特征在于小于单个导体层之间的电阻的位置之间的电阻 位置。 因此，与具有相同长度和宽度的单层导体相比，多层导体的特征在于增大的载流能力。
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公开(公告)号：US5277064A
公开(公告)日：1994-01-11
申请号：US864708
申请日：1992-04-08
IPC分类号： G01P15/12
CPC分类号： G01P15/123
摘要： An accelerometer is provided which is suitably rugged for use in on-board automotive safety control and navigational systems. The preferred thick film accelerometer is formed from an alumina substrate having an integrally formed U-shaped flexure member which surrounds an intermediate support member. A mass is provided on the unsupported end of the U-shaped flexure member. Deflection is maximum at the unsupported end of the U-shaped flexure member, while strain is maximum at the supported end of the flexure member. Four piezoresistors for detecting the strain within the flexure member corresponding to the acceleration in the direction perpendicular to the plane of the support member are provided on the U-shaped flexure member adjacent its supported ends. The four piezoresistors form a Wheatstone bridge, whose analog output voltage is conditioned and amplified to provide the output signal. The signal conditioning and amplifying circuitry are preferably located on the support member. The preferred accelerometer package further contains integrally formed means for preventing excessive deflection of the mass past a predetermined distance.
摘要翻译： 提供了一种适用于车载汽车安全控制和导航系统的加速度计。 优选的厚膜加速度计由氧化铝基底形成，该氧化铝基底具有围绕中间支撑构件的整体形成的U形挠曲构件。 在U形挠曲构件的未支撑的端部上设置有质量。 在U形挠曲构件的未支撑端处的挠曲最大，而在挠曲构件的支撑端处的应变最大。 四个用于检测挠曲构件内的应变的压敏电阻器，其与垂直于支撑构件的平面的方向上的加速度相对应地设置在邻近其支撑端的U形挠曲构件上。 四个压敏电阻形成惠斯登电桥，其模拟输出电压被调节和放大以提供输出信号。 信号调节和放大电路优选地位于支撑构件上。 优选的加速度计包装还包含整体形成的装置，用于防止质料块过度偏转预定距离。
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