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    Flex Design and Attach Method for Reducing Display Panel Periphery
    1.
    发明申请
    Flex Design and Attach Method for Reducing Display Panel Periphery 审中-公开
    用于减少显示屏周边的Flex设计和附件方法

    公开(公告)号：US20110254758A1

    公开(公告)日：2011-10-20

    申请号：US12763025

    申请日：2010-04-19

    Applicant: Peng Cheng Lin ,  Mithran Cheriyan Mathew

    Inventor： Peng Cheng Lin ,  Mithran Cheriyan Mathew

    IPC: G09G3/34 ,  H01J9/00 ,  H01J9/20

    CPC classification number: H05K1/189 ,  G02B26/001 ,  G02F1/13452 ,  H05K2201/10128

    Abstract: Various embodiments described herein involve making connections with the display leads on more than one side of the display array, e.g., on 2 sides, 3 sides or all 4 sides of the display array. By making connections with the display leads on more than one side of the display array, the available area for bonding leads and control circuitry may be increased. The driver chip(s), discrete components, and other active components necessary for addressing the display panel may be attached to the top or the bottom of a flexible printed circuit (“FPC”) or a similar device. Some embodiments involve attaching an FPC to the display such that that the backplate is substantially encased by the FPC.

    Abstract translation: 本文描述的各种实施例涉及在显示器阵列的不止一个侧面上，例如在显示器阵列的2个侧面，3个侧面或全部4个侧面上与显示器引线连接。 通过与显示器阵列的多于一侧的显示器引线连接，可以增加用于接合引线和控制电路的可用区域。 用于寻址显示面板所需的驱动器芯片，分立部件和其它有源部件可以附接到柔性印刷电路（“FPC”）或类似装置的顶部或底部。 一些实施例涉及将FPC附接到显示器，使得背板基本上被FPC包围。

    Computer module device and method
    2.
    发明授权
    Computer module device and method 失效
    计算机模块设备及方法

    公开(公告)号：US06452790B1

    公开(公告)日：2002-09-17

    申请号：US09610581

    申请日：2000-07-05

    Applicant: William W. Y. Chu ,  Tony Man ,  Peng Cheng Lin

    Inventor： William W. Y. Chu ,  Tony Man ,  Peng Cheng Lin

    IPC: H05K720

    CPC classification number: G06F1/20 ,  G06F1/18 ,  G06F1/181

    Abstract: A method for installing memory into a computer module. The method includes providing a used computer module, which comprises a housing to enclose a hard disk drive, a memory module for random access memory devices and a central processing unit coupled to the hard disk drive and coupled to the random access memory. The method also includes removing a top cover from a base of the housing to expose the hard disk drive and the memory module. Thereafter, the hard disk drive is removed from the base of the housing and a second hard disk drive is inserted onto the base. The top cover is reattached to the base of the housing to complete the installation process.

    Abstract translation: 一种将内存安装到计算机模块中的方法。 该方法包括提供使用的计算机模块，其包括用于封装硬盘驱动器的外壳，用于随机存取存储器设备的存储器模块和耦合到硬盘驱动器并耦合到随机存取存储器的中央处理单元。 该方法还包括从壳体的底部移除顶盖以暴露硬盘驱动器和存储器模块。 此后，将硬盘驱动器从壳体的基座移除，并且将第二硬盘驱动器插入到基座上。 顶盖重新连接到外壳的底部，以完成安装过程。

    GROOVE ON COVER PLATE OR SUBSTRATE
    4.
    发明申请
    GROOVE ON COVER PLATE OR SUBSTRATE 审中-公开
    盖在盖板或底板上

    公开(公告)号：US20090323170A1

    公开(公告)日：2009-12-31

    申请号：US12165429

    申请日：2008-06-30

    Applicant: Peng Cheng Lin

    Inventor： Peng Cheng Lin

    IPC: G02B26/00 ,  H01L21/50 ,  H01L29/84

    CPC classification number: G02B26/001 ,  B81C1/00333 ,  B81C1/00873

    Abstract: An improved substrate or cover plate design with a groove for effective singulation of individual display apparatus. In one embodiment, the display apparatus comprises a prefabricated groove on an inside face of a substrate or cover plate to facilitate separation of a MEMS device from a plurality of MEMS devices formed a substrate. In some embodiments, the prefabricated grooves make breaking at pseudo scribe lines simple by thinning and weakening the substrate or cover plate at a scribe zone and act as an improved guide for breaking. Scribe cut relief preserves components, structural integrity, and produces a clean break without inducing excessive or unwanted stresses into the MEMS core and ensures no damage at the panel ledge for subsequent interconnect assembly.

    Abstract translation: 改进的基板或盖板设计，具有用于单独显示装置的有效分割的凹槽。 在一个实施例中，显示装置包括在基板或盖板的内表面上的预制凹槽，以便于将MEMS装置与形成基板的多个MEMS装置分离。 在一些实施例中，预制凹槽通过在划刻区处减薄和削弱基板或盖板而简化了伪划线，并且作为改进的断裂引导件。 Scribe切割浮雕保留部件，结构完整性，并产生干净的断裂，而不会在MEMS芯中引起过大或不必要的应力，并确保在面板凸缘处不会对随后的互连组件造成损坏。

    METAL THIN SHIELD ON ELECTRICAL DEVICE
    7.
    发明申请
    METAL THIN SHIELD ON ELECTRICAL DEVICE 审中-公开
    电气设备上的金属薄膜

    公开(公告)号：US20130032385A1

    公开(公告)日：2013-02-07

    申请号：US13197162

    申请日：2011-08-03

    Applicant: Peng Cheng Lin ,  Mario Francisco Velez

    Inventor： Peng Cheng Lin ,  Mario Francisco Velez

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: B81B7/0058 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/095 ,  B81C2203/0136 ,  B81C2203/0163 ,  G01P1/023 ,  H01G5/16 ,  H01L23/315 ,  H01L23/552 ,  H01L2924/0002 ,  Y10T29/49146 ,  H01L2924/00

    Abstract: This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.

    Abstract translation: 本公开提供了用于在薄膜盖上形成金属薄膜屏蔽以保护下面空腔中的机电系统装置的系统和方法。 在一个方面，使用双层或多层薄膜结构来密封机电装置。 例如，金属薄膜屏蔽可以配合在氧化物薄膜帽上以封装机电装置，并防止由于晶片变薄，切割和封装组件引起的应力引起的劣化，从而增强机电装置在封装空腔中的生存性。 在再分配层处理期间，在晶片表面上形成诸如铜层的金属薄膜屏蔽，被图案化和金属化。

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